DRA797BHGCBDRQ1 Texas Instruments Integrated Circuit (BGA) In Stock
DRA797BHGCBDRQ1 is an AEC-Q100 automotive-grade infotainment applications processor from Texas Instruments in a 538-ball PBGA package. It integrates multi-core processing with 1.2 V supply and supports automotive-grade operation from -40 °C to 105 °C for in-vehicle infotainment and ADAS applications. Available from stock worldwide with fast shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 538
- Lifecycle
- ACTIVE
- Datasheet
- DRA797BHGCBDRQ1 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- AEC-Q100 automotive-qualified multi-core infotainment processor with 1.2 V core supply for IVI and ADAS gateway designs
- 538-ball fine-pitch PBGA package with 260 °C peak reflow compatibility supporting high-volume automotive PCB assembly
- Integrated multi-core heterogeneous processing architecture enabling simultaneous graphics, audio, and connectivity tasks in a single automotive SoC
Applications
DRA797BHGCBDRQ1 is designed for automotive in-vehicle infotainment (IVI) head units, digital instrument clusters, and telematics control units requiring high-performance processing within the AEC-Q100 reliability envelope. Its multi-core architecture supports concurrent execution of navigation, audio decoding, and HMI rendering tasks at up to 105 °C ambient, making it suitable for dashboard and center-console compute platforms. Automotive Tier-1 suppliers also use it in ADAS domain controllers where integrated processing and communication peripherals reduce BOM complexity compared to multi-chip solutions.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| JESD-30 Code | S-PBGA-B538 |
| JESD-609 Code | e1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Screening Level | AEC-Q100 |
| Supply Voltage-Max | 1.2V |
| Supply Voltage-Min | 1.11V |
| Supply Voltage-Nom | 1.15V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Form | BALL |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.35 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What automotive qualification does DRA797BHGCBDRQ1 hold and what temperature range does it support?
DRA797BHGCBDRQ1 is AEC-Q100 qualified and operates over an ambient temperature range suitable for automotive environments, with a 1.2 V core supply and peak reflow soldering temperature of 260 °C, meeting stringent reliability requirements for in-vehicle infotainment and ADAS applications.
In which package is DRA797BHGCBDRQ1 supplied and how does it affect PCB routing density?
The device is housed in a 538-ball fine-pitch LFBGA (S-PBGA-B538) plastic package, which requires controlled-impedance BGA fanout routing on a minimum 6-layer PCB and demands careful power-plane design to manage the 1.2 V core current for sustained multi-core workloads in automotive head units.
For a next-generation IVI head unit handling 4K video and multi-zone audio, what makes DRA797BHGCBDRQ1 suitable?
DRA797BHGCBDRQ1 integrates multiple heterogeneous processing cores — including DSP and GPU subsystems — within a single AEC-Q100 automotive SoC, enabling simultaneous 4K display rendering, multi-channel audio processing at 192 kHz sample rates, and CAN/Ethernet connectivity without requiring a companion processor.
How does DRA797BHGCBDRQ1 compare to a standard ARM Cortex-A series embedded processor for automotive infotainment?
Unlike a general-purpose Cortex-A SoC, DRA797BHGCBDRQ1 includes automotive-grade AEC-Q100 screening, integrated safety features, and automotive interface IPs (CAN, FlexRay, PCIe) in a single package, reducing system integration effort and enabling compliance with ISO 26262 functional safety requirements that standard industrial ARM processors do not natively address.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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