DRA793BDGCBDQ1 Texas Instruments Integrated Circuit (BGA) In Stock

The DRA793BDGCBDQ1 is an AEC-Q100 qualified automotive-grade ARM Cortex-A15 SoC processor from Texas Instruments running at 500 MHz with integrated DSP for audio amplifier applications, housed in a 538-pin FCBGA package rated from -40 to 125 degrees Celsius. It supports 1.2V maximum supply voltage and 260-degree Celsius peak reflow temperature for lead-free assembly. Available from authorized distributors with in-stock inventory and worldwide shipping for automotive and industrial designs.

ACTIVEIntegrated CircuitVerified May 2026
Package / Visual Reference
DRA793BDGCBDQ1BGA
Quick Facts
Manufacturer
Texas Instruments
Package
BGA
Pin Count
538
Lifecycle
ACTIVE
Category
Integrated Circuit
Temp Range
-40.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • AEC-Q100 qualified automotive-grade SoC with -40 to 125 degree Celsius operating range for harsh environment reliability
  • 500-MHz ARM Cortex-A15 CPU paired with integrated DSP enables high-performance audio signal processing in a single chip
  • 538-pin fine-pitch FCBGA package in plastic/epoxy construction supports compact board designs with high I/O density
  • 1.2V core supply voltage with 260 degree Celsius peak reflow compatibility for lead-free automotive manufacturing processes

Applications

The DRA793BDGCBDQ1 is designed for automotive infotainment systems, digital audio amplifiers, and advanced driver assistance systems (ADAS) requiring high-performance ARM-based processing combined with DSP acceleration. Its AEC-Q100 certification and -40 to 125 degree Celsius temperature range make it suitable for in-vehicle head units, instrument clusters, and audio DSP control boards in passenger and commercial vehicles. The integrated Cortex-A15 and DSP architecture also supports industrial audio equipment, smart speakers, and embedded multimedia applications demanding real-time signal processing.

Specifications

Pbfree CodeYes
YTEOL15
JESD-30 CodeS-PBGA-B538
JESD-609 Codee1
Package Body MaterialPLASTIC/EPOXY
Package ShapeSQUARE
Package StyleGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)260
Screening LevelAEC-Q100
Supply Voltage-Max1.2V
Supply Voltage-Min1.11V
Supply Voltage-Nom1.15V
Surface MountYES
TechnologyCMOS
Temperature GradeAUTOMOTIVE
Terminal FormBALL
Terminal Pitch0.65mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)30
uPs/uCs/Peripheral ICs TypeSoC
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 3
ECCN5A992.C
HTS Code8542.31.00.35

Datasheet

DRA793BDGCBDQ1 Datasheet Download

Official datasheet from Texas Instruments

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What CPU architecture and clock speed does the DRA793BDGCBDQ1 use?

The DRA793BDGCBDQ1 features an ARM Cortex-A15 processor core running at 500 MHz, complemented by an integrated DSP for accelerated audio and signal processing tasks. This combination enables real-time audio decoding, filtering, and amplifier control without requiring an external DSP chip, reducing system complexity and BOM cost.

Is the DRA793BDGCBDQ1 automotive qualified, and what temperature range does it support?

Yes, the DRA793BDGCBDQ1 is AEC-Q100 qualified for automotive applications, ensuring it meets rigorous reliability and quality standards required by the automotive industry. It operates across a temperature range of -40 to 125 degrees Celsius, covering the full automotive grade requirement for under-hood and passenger compartment environments.

What package does the DRA793BDGCBDQ1 use, and what are its physical characteristics?

The DRA793BDGCBDQ1 is housed in a 538-pin fine-pitch FCBGA (Flip Chip Ball Grid Array) package in a square plastic/epoxy body with a low-profile grid array style. This high-density package provides a large number of I/O connections in a compact footprint, suitable for multi-layer PCB designs in automotive infotainment and industrial embedded systems.

What is the supply voltage and reflow temperature for the DRA793BDGCBDQ1?

The DRA793BDGCBDQ1 has a maximum core supply voltage of 1.2V and supports a peak reflow temperature of 260 degrees Celsius during PCB soldering. The device is RoHS compliant and lead-free per its Pb-free code and JESD-609 e1 rating, compatible with standard lead-free solder paste and reflow profiles used in automotive-grade PCB assembly.

What applications is the DRA793BDGCBDQ1 designed for?

The DRA793BDGCBDQ1 targets automotive digital audio amplifier systems, in-vehicle infotainment head units, instrument clusters, and ADAS processing platforms. Its integrated Cortex-A15 and DSP make it effective for active noise cancellation, surround sound processing, and real-time audio effects in premium automotive audio systems. Industrial audio processing, smart speaker controllers, and professional audio DSP boards are additional application areas.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

AvailabilityIn Stock
Reference Price (USD)
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pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

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Marco Rossi
CTO, AutoDrive Systems, Italy