DRA787BRGABFRQ1 Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments SoC processor w/ 2x 750 MHz C66x DSP and 2 Dual Arm Cortex-M4 & EVE for Audio Amplifier 367-FCBGA -40 to 125
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 367
- Lifecycle
- ACTIVE
- Datasheet
- DRA787BRGABFRQ1 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of DRA787BRGABFRQ1?
- Integrated Circuit from Texas Instruments identified by manufacturer part number DRA787BRGABFRQ1
- Documented technical context includes 750 MHz for engineering comparison
- Package or mechanical reference recorded as BGA for footprint checks
- Suitable for BOM sourcing, alternate review, repair stocking, and production procurement workflows
- Datasheet-backed context should be matched against voltage, current, timing, package, and lifecycle requirements before approval
What is DRA787BRGABFRQ1 used for?
DRA787BRGABFRQ1 is typically sourced for embedded electronics, industrial controls, communications equipment, and production BOM maintenance where buyers need a manufacturer-traceable integrated circuit with verifiable datasheet context. It is suitable for engineering replacement reviews, prototype builds, and production purchasing workflows that must confirm package fit, lifecycle risk, and key ratings such as 750 MHz.
What are the specifications of DRA787BRGABFRQ1?
| Pbfree Code | Yes |
| Date Of Intro | 2017-08-03 |
| YTEOL | 15 |
| Bus Compatibility | CAN; I2C; SPI; UART |
| Clock Frequency-Max | 32MHz |
| External Data Bus Width | 48 |
| JESD-30 Code | S-PBGA-B367 |
| JESD-609 Code | e1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 250 |
| Screening Level | AEC-Q100 |
| Supply Voltage-Max | 1.11V |
| Supply Voltage-Min | 1.02V |
| Supply Voltage-Nom | 1.06V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.A.1 |
| HTS Code | 8542.31.00.35 |
Where can I find the DRA787BRGABFRQ1 datasheet?
DRA787BRGABFRQ1 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for DRA787BRGABFRQ1?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which design checks should buyers confirm before selecting DRA787BRGABFRQ1?
Buyers should verify the integrated circuit role, package fit, lifecycle status, and datasheet ratings before approving this part. The fetched technical context includes 750 MHz, which should be matched against the target circuit and sourcing documentation.
How does the recorded package information affect sourcing DRA787BRGABFRQ1?
The recorded package reference is BGA, so purchasers should confirm footprint compatibility, assembly handling, and approved manufacturer documentation. Include 750 MHz in the engineering review so procurement does not substitute a part with mismatched limits.
When comparing alternates for DRA787BRGABFRQ1, which parameters matter most?
Start with manufacturer, component category, package style, lifecycle status, and the electrical or mechanical ratings shown in the datasheet. Because the available context includes 750 MHz, any alternate should match that requirement before release.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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