DRA718BJGCBDRQ1 Texas Instruments Inductor (BGA) In Stock
The DRA718BJGCBDRQ1 is an AEC-Q100-qualified automotive-grade applications processor from Texas Instruments, designed for in-vehicle infotainment and cluster systems operating at 1.11 V to 1.2 V core supply in a 538-ball FCBGA package. It combines multi-core processing, hardware safety features, and rich multimedia interfaces for next-generation automotive cockpit platforms.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 538
- Lifecycle
- ACTIVE
- Datasheet
- DRA718BJGCBDRQ1 Datasheet PDF
- Category
- Inductor
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- AEC-Q100 automotive qualification ensures reliable operation across -40°C to 125°C junction temperature in harsh in-vehicle environments
- 538-ball FCBGA (JESD-30 S-PBGA-B538) with fine-pitch grid array supports high-density PCB integration in compact automotive ECU designs
- 1.11 V to 1.2 V core supply range optimized for low-power automotive infotainment SoC operation with hardware-accelerated multimedia processing
Applications
The DRA718BJGCBDRQ1 powers automotive infotainment head units, digital instrument clusters, and rear-seat entertainment systems that require AEC-Q100-grade reliability across the -40°C to 125°C automotive temperature range. Its multi-core architecture and hardware security modules support AUTOSAR-compliant OS stacks alongside GPU-accelerated 3D cluster graphics at 1080p resolution. OEM tier-1 suppliers integrate it into connected cockpit domain controllers where multiple display outputs, camera inputs, and CAN or Ethernet connectivity must coexist on a single SoC.
Specifications
| YTEOL | 15 |
| JESD-30 Code | S-PBGA-B538 |
| JESD-609 Code | e1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Screening Level | AEC-Q100 |
| Supply Voltage-Max | 1.2V |
| Supply Voltage-Min | 1.11V |
| Supply Voltage-Nom | 1.15V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.75 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What automotive qualification level does the DRA718BJGCBDRQ1 meet, and over what temperature range is it guaranteed?
The DRA718BJGCBDRQ1 is screened to AEC-Q100 Grade 1, guaranteeing reliable operation from -40°C to 125°C junction temperature. This qualification level is mandatory for under-hood-adjacent and dashboard-mounted automotive ECUs where temperature cycling and vibration stress exceed the capabilities of standard industrial-grade processors.
What core supply voltage does the DRA718BJGCBDRQ1 require, and how does it affect power supply design for an IVI head unit?
The DRA718BJGCBDRQ1 requires a tightly regulated core supply between 1.11 V and 1.2 V, necessitating a high-accuracy PMIC with at least 1% load regulation in automotive head unit designs. The narrow 90 mV supply window requires careful PCB decoupling with multiple 100 nF and 10 µF ceramic capacitors near the 538-ball BGA to prevent supply rail droop during burst workloads.
How does the DRA718BJGCBDRQ1's 538-ball BGA package influence PCB routing complexity for automotive infotainment boards?
The JESD-30 S-PBGA-B538 fine-pitch BGA requires at least 8 PCB layers for adequate signal routing and power plane separation, with via-in-pad or microvia technology to escape the dense 538-ball array. Automotive-grade PCB materials with Dk below 3.8 and Df below 0.01 are recommended to maintain signal integrity on high-speed DDR and display interfaces at 260°C reflow peak temperature.
What multimedia and connectivity capabilities does the DRA718BJGCBDRQ1 offer for a dual-display automotive cockpit?
The DRA718BJGCBDRQ1 integrates display subsystems capable of driving multiple 1080p outputs simultaneously, along with camera capture interfaces supporting up to 8 camera inputs for surround-view systems. Hardware video codecs handle H.264 decode at 1080p60 frames per second, and Gigabit Ethernet with AVB support enables in-vehicle network connectivity compliant with OPEN Alliance BroadR-Reach automotive Ethernet standards.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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