DM368ZCEZ Texas Instruments Integrated Circuit (BGA) In Stock

Texas Instruments DM368ZCEZ is a DaVinci digital media processor combining DSP and ARM cores for video encoding and processing, operating from 1.28 V to 1.42 V core supply in a 338-pin LFBGA package. It supports 0°C to 85°C commercial temperature range and 260°C peak reflow, making it suitable for embedded video and surveillance systems. Available RoHS-compliant from authorized distributors with worldwide shipping.

OBSOLETEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
DM368ZCEZBGA
Quick Facts
Manufacturer
Texas Instruments
Package
BGA
Pin Count
338
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
?°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • DaVinci architecture integrating DSP and ARM processor cores for real-time video encoding and multimedia processing
  • 1.28 V to 1.42 V core supply enabling energy-efficient operation in embedded video processing platforms
  • 338-pin fine-pitch BGA package (JESD-30 S-PBGA-B338) supporting high pin-count I/O for camera, memory, and display interfaces
  • 0°C to 85°C commercial temperature range with 260°C peak reflow compatible with standard SMT assembly

Applications

The DM368ZCEZ is used in IP cameras, digital video recorders, and portable video conferencing terminals where H.264 or MPEG-4 video encoding at resolutions up to 1080p must be offloaded from a host processor. Its DaVinci architecture separates media processing on the DSP core from system management on the ARM core, enabling concurrent video encoding and network streaming on a single SoC. Industrial machine vision systems and automotive rear-view camera modules also deploy this processor for real-time video analysis pipelines at low core supply voltages below 1.5 V.

Specifications

Pbfree CodeYes
YTEOL0
JESD-30 CodeS-PBGA-B338
JESD-609 Codee1
Package Body MaterialPLASTIC/EPOXY
Package ShapeSQUARE
Package StyleGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)260
Supply Voltage-Max1.42V
Supply Voltage-Min1.28V
Supply Voltage-Nom1.35V
Surface MountYES
TechnologyCMOS
Temperature GradeOTHER
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Terminal FormBALL
Terminal Pitch0.65mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)30
uPs/uCs/Peripheral ICs TypeDigital Media SoC
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 3
HTS Code8542.31.00.30
Country of OriginPhilippines

Datasheet

DM368ZCEZ Datasheet Download

Official datasheet from Texas Instruments

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What core supply voltage does the DM368ZCEZ require and how does this affect power supply design?

The DM368ZCEZ operates from a core supply voltage of 1.28 V to 1.42 V, requiring a tight-tolerance DC-DC converter or LDO regulator for the processor core rail. A 1 A to 2 A rated buck converter with ±2% output accuracy is typically needed to stay within the 140 mV window, which is standard practice for digital media processors in the DaVinci family operating at clock rates above 300 MHz.

What video processing capabilities does the DM368ZCEZ DaVinci architecture support for surveillance applications?

The DM368ZCEZ DaVinci processor integrates a DSP core optimized for video codec algorithms supporting H.264, MPEG-4, and MJPEG encoding and decoding at frame rates up to 30 fps at 720p resolution. The ARM subsystem handles system tasks such as network protocol stacks (RTSP, HTTP) and sensor control, enabling a complete IP camera system-on-module with fewer than 5 external chips including DRAM, NAND flash, and PHY.

What are the PCB assembly requirements for the DM368ZCEZ 338-pin BGA package?

The 338-pin fine-pitch BGA (S-PBGA-B338) requires a PCB with at least 6 layers to route all signal, power, and ground balls from the array center to the board periphery. The 260°C peak reflow temperature rating is compatible with standard SAC305 lead-free solder paste profiles used in RoHS-compliant assembly. BGA package rework requires a hot-air rework station capable of reaching 245°C to 255°C ball temperature without exceeding the 260°C peak limit on the component body.

How does the DM368ZCEZ compare to a discrete DSP plus ARM microcontroller solution for an IP camera design?

Integrating both DSP and ARM cores in the DM368ZCEZ reduces the chip count from two processors plus a bridge to a single SoC, cutting PCB area by approximately 30 to 50 mm², eliminating one inter-processor bus, and reducing power distribution complexity from two separate core rails to one 1.28 V to 1.42 V domain. For IP camera designs targeting below 3 W total system power, the DaVinci single-chip approach is typically 25 to 40% more energy-efficient than equivalent two-chip solutions due to eliminated inter-chip I/O switching losses.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

AvailabilityIn Stock
Reference Price (USD)
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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

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CTO, AutoDrive Systems, Italy