DF37NC-30DS-0.4V(51) Hirose Connector (Other) In Stock
Hirose DF37NC-30DS-0.4V(51) is a 30-position female board stacking connector with 0.4 mm pitch, gold-over-nickel contact finish, and 100 mΩ maximum contact resistance for compact, high-density PCB-to-PCB interconnects. Engineered for slim consumer electronics and mobile device stacking assemblies. Available from stock with worldwide shipping.
- Manufacturer
- Hirose
- Package
- Other
- Pin Count
- 30
- Lifecycle
- ACTIVE
- Datasheet
- DF37NC-30DS-0.4V(51) Datasheet PDF
- Category
- Connector
- Temp Range
- -35.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Ultra-fine 0.4 mm pitch 30-position board stacking receptacle enabling high-density connections in slim mobile designs
- Gold over nickel contact finish delivering contact resistance below 100 mΩ for reliable signal integrity
- Female rectangular contact pattern optimized for secure, low-profile PCB-to-PCB stacking in compact assemblies
Applications
The DF37NC-30DS-0.4V(51) suits high-density board stacking in smartphones, wearable devices, and compact IoT modules where 30 signals must bridge between stacked PCBs at 0.4 mm pitch. Its gold-plated female contacts maintain contact resistance below 100 mΩ across the rated mating cycles, ensuring signal integrity in camera modules, display driver boards, and sensor fusion modules. Miniaturized industrial controllers and medical wearables also leverage this connector's slim profile for multi-layer board assemblies.
Specifications
| Factory Lead Time | 12Weeks |
| YTEOL | 8 |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Finish Termination | Gold (Au) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 100mΩ |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 100VAC V |
| Durability | 10Cycles |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 50000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e4 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.016inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.6416mm |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 0.3A |
| Reference Standard | UL |
| Terminal Pitch | 0.4mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 30 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Japan |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Why does the 0.4 mm pitch of the DF37NC-30DS-0.4V(51) make it suitable for ultra-slim mobile device designs?
A 0.4 mm pitch allows 30 contacts to occupy a footprint under 13 mm wide, far smaller than 0.5 mm or 0.8 mm pitch alternatives. This enables smartphone camera module stacking and wearable sensor board interconnects where PCB real estate is less than 15 mm across the connector zone. Combined with the low-profile female receptacle height, the DF37NC-30DS-0.4V(51) lets engineers stack two boards within 1 mm to 2 mm of vertical clearance in ultra-thin device enclosures.
How does the gold over nickel contact finish of the DF37NC-30DS-0.4V(51) sustain low contact resistance over repeated mating cycles?
Gold over nickel plating on the DF37NC-30DS-0.4V(51) contacts maintains contact resistance below 100 mΩ across the rated mating lifecycle. The nickel barrier prevents gold diffusion into the underlying base metal, preserving the gold surface layer that resists oxidation and fretting corrosion. This is critical for 30-pin board stacking connectors subjected to field assembly, repair, or iterative prototyping where contact surfaces see dozens of insertions and removals.
How does the DF37NC-30DS-0.4V(51) compare to a 0.5 mm pitch alternative when minimizing connector width is the primary constraint?
At 0.4 mm pitch, the DF37NC-30DS-0.4V(51) compresses 30 positions into roughly 12 mm of row length versus approximately 15.5 mm for a 0.5 mm pitch counterpart, a 22% width reduction. In designs where the PCB edge-to-edge stack dimension must stay under 14 mm, the 0.4 mm pitch variant saves over 3 mm. This trade-off requires tighter PCB manufacturing tolerances, but Hirose's DF37 series is designed for standard SMT assembly with 0.4 mm minimum pad pitch capability.
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