DF12(3.0)-60DP-0.5V(86) Hirose Connector (Other) In Stock

Hirose DF12(3.0)-60DP-0.5V(86) is a 60-position dual-row board-to-board PCB header with 0.5mm pitch, 3.0mm stacking height, 0.3A per contact rating, and gold-finished termination for high-density compact electronic interconnections. Globally in stock.

OBSOLETEConnectorVerified Jun 2026
Package / Visual Reference
DF12(3.0)-60DP-0.5V(86)Other
Quick Facts
Manufacturer
Hirose
Package
Other
Pin Count
62
Lifecycle
OBSOLETE
Category
Connector
Temp Range
-45.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 0.5mm pitch 60-position dual-row layout enables extremely high-density board-to-board signal routing within a 0.709 inch body length
  • 3.0mm stacking height precisely controls board separation, critical in multi-layer stacked PCB assemblies for mobile and wearable devices
  • Gold-finished solder termination and solder holding posts ensure secure PCB anchoring and low-resistance connections at 0.3A per contact

Applications

The DF12(3.0)-60DP-0.5V(86) is designed for compact board-to-board stacking connections in smartphones, tablets, wearables, and industrial miniaturized modules where 60 signals must be routed between boards separated by exactly 3.0mm. Its 0.5mm pitch suits high-density flex and rigid PCB layouts where minimizing connector footprint is essential for tight industrial and consumer electronics packaging.

Specifications

YTEOL0
Board Mounting OptionSOLDER HOLDING POSTS
Body Breadth0.181inch
Body Depth0.091inch
Body Length0.709inch
Connector TypeBOARD STACKING CONNECTOR
Contact Finish MatingNOT SPECIFIED
Contact Finish TerminationGold (Au)
Contact GenderMALE
Contact MaterialNOT SPECIFIED
Contact PatternRECTANGULAR
Contact Resistance50
Contact StyleBELLOWED TYPE
DIN ConformanceNO
Dielectric Withstanding Voltage150VAC V
Durability50Cycles
Filter FeatureNO
IEC ConformanceNO
Insulation Resistance500000000Ω
Insulator ColorBEIGE
Insulator MaterialPOLYAMIDE
JESD-609 Codee4
MIL ConformanceNO
Mating Contact Pitch0.02inch
Mating InformationMULTIPLE MATING PARTS AVAILABLE
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing3.6068mm
Polarization KeyPOLARIZED HOUSING
Rated Current (Signal)0.3A
Reference StandardUL
Terminal Pitch0.5mm
Termination TypeSURFACE MOUNT
Total Number of Contacts60
UL Flammability Code94V-0
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40

Datasheet

DF12(3.0)-60DP-0.5V(86) Datasheet Download

Official datasheet from Hirose

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What stacking height and pin count does DF12(3.0)-60DP-0.5V(86) offer for compact board-to-board designs?

The DF12(3.0)-60DP-0.5V(86) provides a 3.0mm stacking height between mated boards and carries 60 positions in a dual-row arrangement at 0.5mm pitch. This combination allows designers to interconnect two PCBs with precisely 3.0mm separation while routing 60 signals and power lines in a body length of only 0.709 inches, ideal for space-constrained mobile or wearable product designs.

How much current can each contact of DF12(3.0)-60DP-0.5V(86) carry, and does that support power pins in the connector?

Each contact in the DF12(3.0)-60DP-0.5V(86) is rated at 0.3A. Designers can dedicate multiple adjacent contacts in parallel to carry higher power currents — for example, combining 5 contacts yields up to 1.5A — while using the remaining positions for high-speed data signals, a common technique in compact board stacking where dedicated power connectors would consume too much PCB space.

When would an engineer choose DF12(3.0)-60DP-0.5V(86) over a 1.0mm-pitch board-to-board connector for a wearable design?

An engineer selects DF12(3.0)-60DP-0.5V(86) over a 1.0mm-pitch alternative when the design requires more than 30 connections in a very short body length, since the 0.5mm pitch halves the linear footprint for a 60-position connector. This saves significant board area in wearable and IoT devices while maintaining the 3.0mm controlled stacking height necessary for the enclosure stack-up dimensional budget.

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About Hirose

Hirose is a leading electronic component manufacturer. FindMyChip sources Hirose ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy