DF12(3.0)-60DP-0.5V(86) Hirose Connector (Other) In Stock
Hirose DF12(3.0)-60DP-0.5V(86) is a 60-position dual-row board-to-board PCB header with 0.5mm pitch, 3.0mm stacking height, 0.3A per contact rating, and gold-finished termination for high-density compact electronic interconnections. Globally in stock.
- Manufacturer
- Hirose
- Package
- Other
- Pin Count
- 62
- Lifecycle
- OBSOLETE
- Category
- Connector
- Temp Range
- -45.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 0.5mm pitch 60-position dual-row layout enables extremely high-density board-to-board signal routing within a 0.709 inch body length
- 3.0mm stacking height precisely controls board separation, critical in multi-layer stacked PCB assemblies for mobile and wearable devices
- Gold-finished solder termination and solder holding posts ensure secure PCB anchoring and low-resistance connections at 0.3A per contact
Applications
The DF12(3.0)-60DP-0.5V(86) is designed for compact board-to-board stacking connections in smartphones, tablets, wearables, and industrial miniaturized modules where 60 signals must be routed between boards separated by exactly 3.0mm. Its 0.5mm pitch suits high-density flex and rigid PCB layouts where minimizing connector footprint is essential for tight industrial and consumer electronics packaging.
Specifications
| YTEOL | 0 |
| Board Mounting Option | SOLDER HOLDING POSTS |
| Body Breadth | 0.181inch |
| Body Depth | 0.091inch |
| Body Length | 0.709inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Finish Termination | Gold (Au) |
| Contact Gender | MALE |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 50mΩ |
| Contact Style | BELLOWED TYPE |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 150VAC V |
| Durability | 50Cycles |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 500000000Ω |
| Insulator Color | BEIGE |
| Insulator Material | POLYAMIDE |
| JESD-609 Code | e4 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.02inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.6068mm |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 0.3A |
| Reference Standard | UL |
| Terminal Pitch | 0.5mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 60 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stacking height and pin count does DF12(3.0)-60DP-0.5V(86) offer for compact board-to-board designs?
The DF12(3.0)-60DP-0.5V(86) provides a 3.0mm stacking height between mated boards and carries 60 positions in a dual-row arrangement at 0.5mm pitch. This combination allows designers to interconnect two PCBs with precisely 3.0mm separation while routing 60 signals and power lines in a body length of only 0.709 inches, ideal for space-constrained mobile or wearable product designs.
How much current can each contact of DF12(3.0)-60DP-0.5V(86) carry, and does that support power pins in the connector?
Each contact in the DF12(3.0)-60DP-0.5V(86) is rated at 0.3A. Designers can dedicate multiple adjacent contacts in parallel to carry higher power currents — for example, combining 5 contacts yields up to 1.5A — while using the remaining positions for high-speed data signals, a common technique in compact board stacking where dedicated power connectors would consume too much PCB space.
When would an engineer choose DF12(3.0)-60DP-0.5V(86) over a 1.0mm-pitch board-to-board connector for a wearable design?
An engineer selects DF12(3.0)-60DP-0.5V(86) over a 1.0mm-pitch alternative when the design requires more than 30 connections in a very short body length, since the 0.5mm pitch halves the linear footprint for a 60-position connector. This saves significant board area in wearable and IoT devices while maintaining the 3.0mm controlled stacking height necessary for the enclosure stack-up dimensional budget.
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