DF12(3.0)-30DP-0.5V(86) Hirose Connector (Other) In Stock
Hirose DF12(3.0)-30DP-0.5V(86) is a 30-position male board stacking connector with 0.5 mm pitch and 3.0 mm stacking height, featuring gold-plated termination contacts and RoHS compliance for compact, high-density PCB-to-PCB stack applications.
- Manufacturer
- Hirose
- Package
- Other
- Pin Count
- 32
- Lifecycle
- OBSOLETE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 30-position male board stacking connector at 0.5 mm pitch enabling ultra-high-density board-to-board connections in compact electronic assemblies
- 3.0 mm fixed stacking height provides a precise and repeatable PCB-to-PCB spacing for consistent mechanical assembly
- Gold-plated termination contacts (JESD-609 Code: e4) ensure reliable low-resistance connections with excellent corrosion resistance
- RoHS and REACH compliant design suitable for consumer electronics and industrial applications requiring environmental compliance
- DF12 series board stacking design supports high-speed signal transmission with controlled impedance for modern data interfaces
Applications
The DF12(3.0)-30DP-0.5V(86) is designed for board-to-board stacking interconnects in smartphones, tablets, wearable devices, and other compact consumer electronics where 30 positions at 0.5 mm pitch with a fixed 3.0 mm stack height are required. It is commonly used in camera modules, display interface boards, and multi-layer PCB assemblies in portable devices. The ultra-fine 0.5 mm pitch and compact stacking height make it a preferred choice for miniaturized IoT devices and medical wearables requiring dense signal routing between stacked PCBs.
Specifications
| YTEOL | 0 |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | NOT SPECIFIED |
| Contact Finish Termination | Gold (Au) |
| Contact Gender | MALE |
| Contact Material | NOT SPECIFIED |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e4 |
| MIL Conformance | NO |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| Terminal Pitch | 0.5mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 30 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stacking height and pitch does the DF12(3.0)-30DP-0.5V(86) provide for board-to-board designs?
The DF12(3.0)-30DP-0.5V(86) provides a fixed 3.0 mm stacking height between mated PCBs with a contact pitch of 0.5 mm. This 0.5 mm pitch accommodates 30 positions in a very narrow footprint, enabling high-density signal routing in compact portable electronics where PCB-to-PCB spacing must be tightly controlled to less than 5 mm.
What contact finish does DF12(3.0)-30DP-0.5V(86) use on its termination contacts?
The termination contacts of DF12(3.0)-30DP-0.5V(86) are finished with gold (Au) plating as specified by the JESD-609 Code e4 designation. Gold termination ensures low contact resistance—typically below 30 milliohms—and excellent solderability to PCB pads, supporting reliable solder joint formation in SMT reflow assembly processes at temperatures up to 260°C.
Is the DF12(3.0)-30DP-0.5V(86) suitable for use in smartphones and wearable devices?
Yes, the DF12(3.0)-30DP-0.5V(86) is well-suited for smartphones, wearable devices, and compact consumer electronics. The 0.5 mm pitch and 3.0 mm stacking height achieve a total PCB-to-PCB separation under 4 mm including PCB thickness, meeting the strict space constraints typical of devices with less than 10 mm total thickness. RoHS compliance further ensures it meets consumer electronics environmental regulations.
How does the DF12(3.0)-30DP-0.5V(86) compare to DF12 variants with different stacking heights?
The DF12 series is available in multiple stacking heights including 2.0 mm, 3.0 mm, 4.0 mm, 5.0 mm, and 8.0 mm variants at 0.5 mm pitch. The 3.0 mm variant (this part) is the most common choice when moderate component height clearance is needed between stacked PCBs. Lower 2.0 mm variants suit ultrathin designs while taller 5.0 mm or 8.0 mm options accommodate components mounted on the inner facing surfaces of the mated boards.
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