DDTD113ZC-7-FAlternatives & Equivalent Parts
About DDTD113ZC-7-F
DDTD113ZC-7-F is a Transistor BJT NPN component manufactured by Diodes Inc.. It comes in a SOT23 (3-Pin) package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | DDTD113ZC-7-FSource | SI3127DV-T1-GE3 | IRLR8726PBF | ICM-20789 | LQG15HN2N4S02D |
|---|---|---|---|---|---|
| Manufacturer | Diodes Inc. | Vishay | Infineon | TDK | Murata Electronics |
| Package Type | SOT23 (3-Pin) | SOT23 (6-Pin) | Other | Other | Other |
| Pin Count | 3 | 6 | 3 | 24 | 2 |
| Temperature Range | ~ 150.0°C | — | -55.0°C ~ 175.0°C | -40.0°C ~ 85.0°C | — |
| Price | $0.0302 | $0.1880 | $0.0827 | $5.4900 | $0.0062 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | OBSOLETE | OBSOLETE | ACTIVE |
| Electrical Parameters | |||||
| Pbfree Code | Yes | — | — | — | Yes |
| Reach Compliance Code | Compliant | — | — | — | — |
| Factory Lead Time | 12 Weeks | — | 4 Weeks | — | 9 Weeks |
| YTEOL | 7 | 7 | 0 | 0 | 7 |
| Additional Feature | BUILT IN BIAS RESISTOR RATIO IS 10 | — | BULK | — | — |
| Collector Current-Max (IC) | 0.5 A | — | — | — | — |
| Collector-Emitter Voltage-Max | 50 V | — | — | — | — |
| Configuration | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | — | — |
| DC Current Gain-Min (hFE) | 56 | — | — | — | — |
| JESD-30 Code | R-PDSO-G3 | R-PDSO-G6 | R-PSSO-G2 | S-XBGA-B24 | — |
| JESD-609 Code | e3 | e3 | e3 | — | e3 |
| Number of Elements | 1 | 1 | 1 | — | — |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | — |
| Package Shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | — |
| Package Style | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | GRID ARRAY, LOW PROFILE, FINE PITCH | SMT |
| Peak Reflow Temperature (Cel) | 260 | 260 | 260 | — | — |
| Polarity/Channel Type | NPN | P-CHANNEL | N-CHANNEL | — | — |
| Power Dissipation-Max (Abs) | 0.2 W | — | 75 W | — | — |
| Qualification Status | Not Qualified | — | Not Qualified | — | — |
| Surface Mount | YES | YES | YES | YES | Reflow soldering |
| Terminal Finish | MATTE TIN | Matte Tin (Sn) | MATTE TIN OVER NICKEL | — | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Terminal Form | GULL WING | GULL WING | GULL WING | BUTT | — |
| Terminal Position | DUAL | DUAL | SINGLE | BOTTOM | — |
| Time@Peak Reflow Temperature-Max (s) | 30 | 30 | 30 | — | — |
| Transistor Element Material | SILICON | SILICON | SILICON | — | — |
| Transition Frequency-Nom (fT) | 200 MHz | — | — | — | — |
| DS Breakdown Voltage-Min | — | 60 V | 30 V | — | — |
| Drain Current-Max (ID) | — | 5.1 A | 50 A | — | — |
| Drain-source On Resistance-Max | — | 0.089 Ω | 0.0058 Ω | — | — |
| FET Technology | — | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | — | — |
| JEDEC-95 Code | — | MO-193AA | TO-252AA | — | — |
| Operating Mode | — | ENHANCEMENT MODE | ENHANCEMENT MODE | — | — |
| Transistor Application | — | SWITCHING | SWITCHING | — | — |
| Avalanche Energy Rating (Eas) | — | — | 120 mJ | — | — |
| Case Connection | — | — | DRAIN | — | — |
| Feedback Cap-Max (Crss) | — | — | 205 pF | — | — |
| Pulsed Drain Current-Max (IDM) | — | — | 340 A | — | — |
| Analog IC - Other Type | — | — | — | ANALOG CIRCUIT | — |
| Number of Functions | — | — | — | 1 | 1 |
| Supply Voltage-Max (Vsup) | — | — | — | 3.45 V | — |
| Supply Voltage-Min (Vsup) | — | — | — | 1.71 V | — |
| Supply Voltage-Nom (Vsup) | — | — | — | 1.8 V | — |
| Technology | — | — | — | CMOS | — |
| Temperature Grade | — | — | — | INDUSTRIAL | — |
| Terminal Pitch | — | — | — | 0.5 mm | — |
| Case/Size Code | — | — | — | — | 1005/0402 |
| Construction | — | — | — | — | Multilayer Chip |
| Core Material | — | — | — | — | AIR |
| DC Resistance | — | — | — | — | 0.1 Ω |
| Inductance-Nom (L) | — | — | — | — | 0.0024 µH |
| Inductor Application | — | — | — | — | RF INDUCTOR |
| Inductor Type | — | — | — | — | GENERAL PURPOSE INDUCTOR |
| Package Height | — | — | — | — | 0.5 mm |
| Package Length | — | — | — | — | 1 mm |
| Package Width | — | — | — | — | 0.5 mm |
| Packing Method | — | — | — | — | TR, PAPER, 7 INCH |
| Quality Factor-Min (at L-nom) | — | — | — | — | 8 |
| Rated Current-Max | — | — | — | — | 0.8 A |
| Self Resonance Frequency | — | — | — | — | 6000 MHz |
| Shape/Size Description | — | — | — | — | RECTANGULAR PACKAGE |
| Shielded | — | — | — | — | NO |
| Special Feature | — | — | — | — | INDUCTANCE TOLERANCE IS 0.3 NANO HENRY |
| Terminal Placement | — | — | — | — | DUAL ENDED |
| Terminal Shape | — | — | — | — | WRAPAROUND |
| Test Frequency | — | — | — | — | 100 MHz |
| Tolerance | — | — | — | — | 12.5% |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 4 alternatives for DDTD113ZC-7-F — response within 24 hours.
Quick Links
Why Look for Alternatives?
Finding alternatives for DDTD113ZC-7-F is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating DDTD113ZC-7-F replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to DDTD113ZC-7-F?
Known equivalents for DDTD113ZC-7-F include SI3127DV-T1-GE3, IRLR8726PBF, ICM-20789. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of DDTD113ZC-7-F?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify DDTD113ZC-7-F alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.