CR0201-FW-3012GLF Bourns Resistor (Resistor Chip) In Stock
Bourns CR0201-FW-3012GLF is a thick-film chip resistor in the ultra-compact 0201 (0.6 mm x 0.3 mm) surface-mount package, measuring only 0.23 mm in height, ideal for high-density PCB designs. It provides reliable resistance performance with RoHS-compliant, lead-free construction. Available from authorized distributors with worldwide shipping.
- Manufacturer
- Bourns
- Package
- Resistor Chip
- Pin Count
- 2
- Lifecycle
- ACTIVE
- Datasheet
- CR0201-FW-3012GLF Datasheet PDF
- Category
- Resistor
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Ultra-compact 0201 package (0.6 mm x 0.3 mm x 0.23 mm height) for extreme-density SMT PCB layouts
- RoHS-compliant (JESD-609 e3) lead-free construction suitable for modern green electronics manufacturing
- Thick-film rectangular chip resistor construction providing stable resistance and reliable long-term performance
- Surface-mount termination compatible with automated reflow soldering on high-density boards with fine-pitch SMT components
Applications
The CR0201-FW-3012GLF is used in miniaturized consumer electronics, wearable devices, and mobile communication equipment where ultra-small component size is critical for PCB density. Its 0201 package allows placement in areas inaccessible to larger 0402 or 0603 resistors, enabling higher component counts per unit area on multilayer PCBs. It is also suited for medical electronics and IoT modules where compact form factor and reliable surface-mount assembly are required.
Specifications
| Pbfree Code | Yes |
| Reach Compliance Code | Compliant |
| Factory Lead Time | 12Weeks |
| YTEOL | 13 |
| Construction | Rectangular |
| JESD-609 Code | e3 |
| Mounting Feature | SURFACE MOUNT |
| Package Height | 0.23mm |
| Package Length | 0.6mm |
| Package Style | SMT |
| Package Width | 0.3mm |
| Packing Method | TR, PAPER, 7 INCH |
| Rated Power Dissipation (P) | 0.05W |
| Rated Temperature | 70°C |
| Resistance | 30100Ω |
| Resistor Type | FIXED RESISTOR |
| Size Code | 0201 |
| Surface Mount | YES |
| Technology | METAL GLAZE/THICK FILM |
| Temperature Coefficient | 200ppm/°C |
| Terminal Finish | TIN OVER NICKEL |
| Terminal Shape | WRAPAROUND |
| Tolerance | 1% |
| Working Voltage | 30V |
| Package | Resistor Chip |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8533.21.00.30 |
| Country of Origin | Taiwan |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are the physical dimensions of the CR0201-FW-3012GLF and why does the 0201 package matter for PCB density?
The CR0201-FW-3012GLF measures 0.6 mm in length, 0.3 mm in width, and only 0.23 mm in height, conforming to the 0201 chip resistor standard. This size is approximately one-quarter the footprint of a 0402 resistor, enabling roughly 4 times more resistors per unit PCB area and making it essential for ultra-high-density layouts in mobile, wearable, and IoT board designs.
For miniaturized wearable PCBs, how does the CR0201-FW-3012GLF compare to 0402 resistors in terms of space savings?
The CR0201-FW-3012GLF's 0201 package occupies a pad area of approximately 0.18 mm squared, compared to about 0.72 mm squared for a typical 0402 resistor. This 75% reduction in footprint per component allows designers to place significantly more passive components in the same board area, which is critical for compact wearable PCBs where total board area is often below 4 cm squared.
What SMT assembly considerations apply when placing CR0201-FW-3012GLF on a PCB?
Placing CR0201-FW-3012GLF components requires SMT equipment capable of handling 0201-size parts with pick-and-place accuracy of plus or minus 0.05 mm or better. Stencil aperture design should target a solder paste deposit of approximately 0.25 mm x 0.25 mm per pad to avoid tombstoning. Reflow profiles must be controlled to a peak temperature of 245°C to 260°C with a maximum ramp rate of 3°C per second to prevent thermal stress on these ultra-small components.
Is the CR0201-FW-3012GLF suitable for high-frequency signal path applications?
Yes, the CR0201-FW-3012GLF is well suited for high-frequency signal paths due to its ultra-small 0201 package, which exhibits parasitic inductance below 1 nH and parasitic capacitance below 0.05 pF. These low parasitics make it appropriate for RF matching networks, impedance termination, and signal conditioning circuits operating at frequencies up to several gigahertz in mobile and wireless communication modules.
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