CL31B475KBHNNNEAlternatives & Equivalent Parts
About CL31B475KBHNNNE
CL31B475KBHNNNE is a Capacitor component manufactured by Samsung Electro-Mechanics. It comes in a Capacitor Chip Non-polarised package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | CL31B475KBHNNNESource | SZMMSZ5239BT1G | MCP73213-B6SI/MF | MCP23008T-E/SO | CRE2512-FZ-R002E-2 |
|---|---|---|---|---|---|
| Manufacturer | Samsung Electro-Mechanics | ON Semiconductor | Microchip | Microchip | Bourns |
| Package Type | Capacitor Chip Non-polarised | Small Outline Diode | Small Outline No-lead | Small Outline Packages | Resistor Chip |
| Pin Count | 2 | 2 | 10 | 18 | 2 |
| Temperature Range | -55.0°C ~ 125.0°C | -55.0°C ~ 150.0°C | -40.0°C ~ 85.0°C | — | -55.0°C ~ 170.0°C |
| Price | $0.0463 | $0.0374 | $0.4036 | $1.0219 | $0.1279 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| Electrical Parameters | |||||
| Pbfree Code | Yes | Yes | Yes | Yes | Yes |
| Reach Compliance Code | Compliant | — | — | — | Compliant |
| Factory Lead Time | 20 Weeks | 6 Weeks | 21 Weeks | 6 Weeks | 14 Weeks |
| YTEOL | 7.49 | 6.65 | 8 | 9 | 7 |
| Capacitance | 4.7 µF | — | — | — | — |
| Capacitor Type | CERAMIC CAPACITOR | — | — | — | — |
| Dielectric Material | CERAMIC | — | — | — | — |
| Height | 1.8 mm | — | — | — | — |
| JESD-609 Code | e3 | e3 | e3 | — | e3 |
| Mounting Feature | SURFACE MOUNT | — | — | — | SURFACE MOUNT |
| Multilayer | Yes | — | — | — | — |
| Negative Tolerance | 10% | — | — | — | — |
| Package Shape | RECTANGULAR PACKAGE | RECTANGULAR | SQUARE | — | — |
| Package Style | SMT | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | — | SMT |
| Packing Method | TR, EMBOSSED PLASTIC, 7 INCH | — | — | — | TR, Embossed, 7 Inch |
| Positive Tolerance | 10% | — | — | — | — |
| Rated (DC) Voltage (URdc) | 50 V | — | — | — | — |
| Size Code | 1206 | — | — | — | 2512 |
| Surface Mount | YES | YES | YES | — | YES |
| Temperature Characteristics Code | X7R | — | — | — | — |
| Temperature Coefficient | 15% ppm/°C | — | — | — | 50 ppm/°C |
| Terminal Finish | MATTE TIN OVER NICKEL | Matte Tin (Sn) - annealed | Matte Tin (Sn) | — | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Terminal Shape | WRAPAROUND | — | — | — | WRAPAROUND |
| Manufacturer Package Code | — | 425-04 | DFN-10 | SOIC-18 | — |
| Configuration | — | SINGLE | — | — | — |
| Diode Element Material | — | SILICON | — | — | — |
| Diode Type | — | ZENER DIODE | — | — | — |
| Dynamic Impedance-Max | — | 10 Ω | — | — | — |
| JESD-30 Code | — | R-PDSO-G2 | S-PDSO-N10 | — | — |
| Number of Elements | — | 1 | — | — | — |
| Package Body Material | — | PLASTIC/EPOXY | PLASTIC/EPOXY | — | — |
| Peak Reflow Temperature (Cel) | — | 260 | 260 | — | — |
| Polarity | — | UNIDIRECTIONAL | — | — | — |
| Power Dissipation-Max | — | 0.5 W | — | — | — |
| Reference Standard | — | AEC-Q101 | — | — | AEC-Q200 |
| Reference Voltage-Nom | — | 9.1 V | — | — | — |
| Technology | — | ZENER | — | — | METAL STRIP |
| Terminal Form | — | GULL WING | NO LEAD | — | — |
| Terminal Position | — | DUAL | DUAL | — | — |
| Time@Peak Reflow Temperature-Max (s) | — | 30 | 40 | — | — |
| Voltage Tol-Max | — | 5% | — | — | — |
| Working Test Current | — | 20 mA | — | — | — |
| Adjustable Threshold | — | — | YES | — | — |
| Analog IC - Other Type | — | — | INPUT FAULT PROTECTION CONTROLLER | — | — |
| Number of Channels | — | — | 2 | — | — |
| Number of Functions | — | — | 1 | — | — |
| Package Equivalence Code | — | — | SOLCC10,.12,20 | — | — |
| Qualification Status | — | — | Not Qualified | Not Qualified | — |
| Screening Level | — | — | TS 16949 | — | — |
| Supply Current-Max (Isup) | — | — | 1.5 mA | — | — |
| Supply Voltage-Max (Vsup) | — | — | 16 V | — | — |
| Supply Voltage-Min (Vsup) | — | — | 4 V | — | — |
| Supply Voltage-Nom (Vsup) | — | — | 9.4 V | — | — |
| Temperature Grade | — | — | INDUSTRIAL | — | — |
| Terminal Pitch | — | — | 0.5 mm | — | — |
| ## MCP73213-B6SI/MF Alternates Showing results | — | — | Image | — | — |
| uPs/uCs/Peripheral ICs Type | — | — | — | PARALLEL IO PORT, GENERAL PURPOSE | — |
| Construction | — | — | — | — | Rectangular |
| Package Height | — | — | — | — | 0.9 mm |
| Package Length | — | — | — | — | 6.4 mm |
| Package Width | — | — | — | — | 3.2 mm |
| Rated Power Dissipation (P) | — | — | — | — | 2 W |
| Rated Temperature | — | — | — | — | 70 °C |
| Resistance | — | — | — | — | 0.002 Ω |
| Resistor Type | — | — | — | — | FIXED RESISTOR |
| Tolerance | — | — | — | — | 1% |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 4 alternatives for CL31B475KBHNNNE — response within 24 hours.
Quick Links
Why Look for Alternatives?
Finding alternatives for CL31B475KBHNNNE is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating CL31B475KBHNNNE replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to CL31B475KBHNNNE?
Known equivalents for CL31B475KBHNNNE include SZMMSZ5239BT1G, MCP73213-B6SI/MF, MCP23008T-E/SO. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of CL31B475KBHNNNE?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify CL31B475KBHNNNE alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.