CGA9N3X7R1H106K230KBAlternatives & Equivalent Parts
About CGA9N3X7R1H106K230KB
CGA9N3X7R1H106K230KB is a Capacitor component manufactured by TDK. It comes in a Capacitor Chip Non-polarised package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | CGA9N3X7R1H106K230KBSource | SN74LVC1G19DBVR | MCGPR35V107M8X11 | TOP244YN |
|---|---|---|---|---|
| Manufacturer | TDK | Texas Instruments | MULTICOMP | Power Integrations |
| Package Type | Capacitor Chip Non-polarised | Small Outline Packages | Capacitor, Polarized Radial Diameter | Other |
| Pin Count | 2 | 6 | 2 | 3 |
| Temperature Range | -55.0°C ~ 125.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 125.0°C |
| Price | $0.6458 | $0.0741 | $0.0840 | $1.6700 |
| Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | ACTIVE | NOT RECOMMENDED |
| Electrical Parameters | ||||
| Pbfree Code | Yes | Yes | — | Yes |
| Reach Compliance Code | Compliant | — | Unknown | — |
| YTEOL | 6.85 | 15 | 7 | 3 |
| Capacitance | 10 µF | — | 100 µF | — |
| Capacitor Type | CERAMIC CAPACITOR | — | ALUMINUM ELECTROLYTIC CAPACITOR | — |
| Dielectric Material | CERAMIC | — | ALUMINUM (WET) | — |
| Height | 2.3 mm | — | — | — |
| JESD-609 Code | e3 | e3 | — | e3 |
| Mounting Feature | SURFACE MOUNT | — | THROUGH HOLE MOUNT | — |
| Multilayer | Yes | — | — | — |
| Negative Tolerance | 10% | — | 20% | — |
| Package Shape | RECTANGULAR PACKAGE | RECTANGULAR | CYLINDRICAL PACKAGE | RECTANGULAR |
| Package Style | SMT | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | Radial | FLANGE MOUNT |
| Packing Method | TR, 7 INCH | TR | — | — |
| Positive Tolerance | 10% | — | 20% | — |
| Rated (DC) Voltage (URdc) | 50 V | — | 35 V | — |
| Reference Standard | AEC-Q200 | — | — | — |
| Size Code | 2220 | — | — | — |
| Surface Mount | YES | YES | NO | NO |
| Temperature Characteristics Code | X7R | — | — | — |
| Temperature Coefficient | 15% ppm/°C | — | — | — |
| Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier | Tin (Sn) | — | Matte Tin (Sn) |
| Terminal Shape | WRAPAROUND | — | WIRE | — |
| Family | — | LVC/LCX/Z | — | — |
| Input Conditioning | — | STANDARD | — | — |
| JESD-30 Code | — | R-PDSO-G6 | — | R-PZFM-T6 |
| Load Capacitance (CL) | — | 50 pF | — | — |
| Logic IC Type | — | OTHER DECODER/DRIVER | — | — |
| Max I(ol) | — | 0.032 A | — | — |
| Number of Bits | — | 1 | — | — |
| Number of Functions | — | 1 | — | 1 |
| Output Characteristics | — | 3-STATE | — | — |
| Output Polarity | — | COMPLEMENTARY | — | — |
| Package Body Material | — | PLASTIC/EPOXY | — | PLASTIC/EPOXY |
| Package Equivalence Code | — | TSOP6,.11,37 | — | ZIP6,.27,.06,100/50TB |
| Peak Reflow Temperature (Cel) | — | 260 | — | — |
| Power Supply Current-Max (ICC) | — | 0.01 mA | — | — |
| Prop. Delay@Nom-Sup | — | 5.2 ns | — | — |
| Propagation Delay (tpd) | — | 16.1 ns | — | — |
| Qualification Status | — | Not Qualified | — | Not Qualified |
| Supply Voltage-Max (Vsup) | — | 5.5 V | — | — |
| Supply Voltage-Min (Vsup) | — | 1.65 V | — | — |
| Supply Voltage-Nom (Vsup) | — | 1.8 V | — | — |
| Technology | — | CMOS | — | CMOS |
| Temperature Grade | — | INDUSTRIAL | — | AUTOMOTIVE |
| Terminal Form | — | GULL WING | — | THROUGH-HOLE |
| Terminal Pitch | — | 0.95 mm | 3.5 mm | 1.27 mm |
| Terminal Position | — | DUAL | — | ZIG-ZAG |
| Time@Peak Reflow Temperature-Max (s) | — | 30 | — | — |
| ## SN74LVC1G19DBVR Alternates Showing results | — | Image | — | — |
| Diameter | — | — | 8 mm | — |
| Leakage Current | — | — | 0.035 mA | — |
| Polarity | — | — | POLARIZED | — |
| Ripple Current | — | — | 220 mA | — |
| Tan Delta | — | — | 0.12 | — |
| Additional Feature | — | — | — | REQUIRES AN AC SUPPLY OF 85 TO 265 V |
| Analog IC - Other Type | — | — | — | LOAD SWITCH |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
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Why Look for Alternatives?
Finding alternatives for CGA9N3X7R1H106K230KB is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating CGA9N3X7R1H106K230KB replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to CGA9N3X7R1H106K230KB?
Known equivalents for CGA9N3X7R1H106K230KB include SN74LVC1G19DBVR, MCGPR35V107M8X11, TOP244YN. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of CGA9N3X7R1H106K230KB?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify CGA9N3X7R1H106K230KB alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.