CDCV857BIDGGG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock

CDCV857BIDGGG4 is a PLL-based zero-delay clock buffer from Texas Instruments with 10 differential outputs and a differential clock input. Key specs: 12 mA output current, 14 pF load capacitance rating, 48-pin TSSOP package. Available from stock worldwide with fast shipping.

OBSOLETEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
CDCV857BIDGGG4Small Outline Packages
Quick Facts
Manufacturer
Texas Instruments
Package
Small Outline Packages
Pin Count
48
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of CDCV857BIDGGG4?

  • PLL-based zero-delay architecture eliminates clock skew between input and outputs for synchronous distribution across 10 loads
  • 10 differential output pairs provide low-jitter clock fanout for FPGA, DSP, and high-speed ADC/DAC clocking networks
  • Differential input accepts LVPECL, LVDS, and HCSL clock sources, offering broad compatibility with common clock tree standards

What is CDCV857BIDGGG4 used for?

CDCV857BIDGGG4 is designed for clock distribution in high-performance computing, telecommunications, and test equipment where multiple synchronous logic devices must share a common low-skew clock. Its PLL-based zero-delay topology ensures the output edges align with the input reference within picoseconds, supporting tight setup and hold margin budgets in multi-FPGA or processor board designs. The 10 differential outputs drive up to 10 independent clock loads such as FPGAs, serializers, and high-speed converters from a single reference source.

What are the specifications of CDCV857BIDGGG4?

YTEOL0
Family857
Input ConditioningDIFFERENTIAL
JESD-30 CodeR-PDSO-G48
JESD-609 Codee4
Load Capacitance (CL)14pF
Logic IC TypePLL BASED CLOCK DRIVER
Max I(ol)0.012A
Number of Functions1
Number of True Outputs10
Output Characteristics3-STATE
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeTSSOP48,.3,20
Package ShapeRECTANGULAR
Package StyleSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing MethodTUBE
Peak Reflow Temperature (Cel)260
Power Supply Current-Max (ICC)12mA
Qualification StatusNot Qualified
Same Edge Skew-Max (tskwd)0.1ns
Supply Voltage-Max (Vsup)2.7V
Supply Voltage-Min (Vsup)2.3V
Supply Voltage-Nom (Vsup)2.5V
Surface MountYES
Temperature GradeINDUSTRIAL
Terminal FinishNICKEL PALLADIUM GOLD
Terminal FormGULL WING
Terminal Pitch0.5mm
Terminal PositionDUAL
Time@Peak Reflow Temperature-Max (s)30
fmax-Min200MHz
PackageSmall Outline Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 2
HTS Code8542.39.00.60

Where can I find the CDCV857BIDGGG4 datasheet?

CDCV857BIDGGG4 Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for CDCV857BIDGGG4?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

Which design use cases are a practical fit for CDCV857BIDGGG4?

CDCV857BIDGGG4 is a Integrated Circuit from Texas Instruments suited to embedded systems, industrial electronics, communication equipment, test fixtures, and production BOM sourcing. The 48 pins detail helps engineers confirm schematic fit, interface allocation, and sourcing suitability before BOM approval.

How should engineers check package compatibility for CDCV857BIDGGG4 during layout review?

Use the Small Outline Packages package information together with 48 pins when comparing footprints, assembly drawings, and mating or socket constraints. This reduces layout risk before prototype or production purchasing.

What should procurement keep aligned when cross-referencing CDCV857BIDGGG4 against alternates?

Cross-reference checks should preserve the manufacturer, Integrated Circuit function, package style, lifecycle status, and at least one key parameter such as -40°C to 85°C. Matching these details lowers substitution risk across 1 approved BOM.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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