CDC960DLG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
CDC960DLG4 is a dual PLL clock synthesizer in a 48-pin SSOP package, generating output clock frequencies up to 200 MHz with a 260 °C peak reflow temperature rating. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 48
- Lifecycle
- OBSOLETE
- Datasheet
- CDC960DLG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of CDC960DLG4?
- Dual PLL architecture generates up to 200 MHz output clock frequencies for high-speed digital system clock distribution
- 48-pin SSOP package (R-PDSO-G48) with 0.635 mm pitch shrinks PCB footprint compared to standard SOIC-48 equivalents
- 260 °C peak reflow temperature rating ensures compatibility with standard lead-free SMT soldering processes
What is CDC960DLG4 used for?
The CDC960DLG4 is used in high-speed digital board designs such as FPGA clock distribution networks, network switch fabric timing subsystems, and DSP processing boards where dual PLL clock synthesis up to 200 MHz is required. Its SSOP-48 package and dual-channel architecture allow two independently controlled clock domains to be managed on a single device, reducing clock jitter and simplifying PCB routing compared to discrete oscillator and divider combinations.
What are the specifications of CDC960DLG4?
| Pbfree Code | Yes |
| YTEOL | 0 |
| JESD-30 Code | R-PDSO-G48 |
| JESD-609 Code | e4 |
| Output Clock Frequency-Max | 200MHz |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SSOP48,.4 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Primary Clock/Crystal Frequency-Nom | 16MHz |
| Qualification Status | Not Qualified |
| Supply Current-Max | 185mA |
| Supply Voltage-Max | 3.465V |
| Supply Voltage-Min | 3.135V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.635mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | CLOCK GENERATOR, PROCESSOR SPECIFIC |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 2 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Where can I find the CDC960DLG4 datasheet?
CDC960DLG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for CDC960DLG4?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What maximum output clock frequency does the CDC960DLG4 support and which high-speed logic families can it drive?
The CDC960DLG4 supports output clock frequencies up to 200 MHz, which meets the timing requirements for LVTTL and LVCMOS logic families operating at 3.3 V in DDR memory controllers, FPGA fabric clocks, and fast microprocessor bus interfaces. At 200 MHz the dual PLL outputs can feed separate clock domains simultaneously without external clock buffers.
How does the dual PLL architecture of CDC960DLG4 benefit designs that require two independent clock domains?
The CDC960DLG4 integrates 2 independent PLLs on a single chip, allowing two output clock frequencies up to 200 MHz to be synthesized and distributed simultaneously without coupling between domains. This eliminates the need for 2 discrete clock synthesizer ICs, saves board area by approximately 40%, and reduces inter-clock jitter coupling in designs such as dual-port memory controllers or split-bus FPGA systems.
What peak reflow temperature does CDC960DLG4 support, and is it compatible with standard lead-free SMT assembly lines?
The CDC960DLG4 is rated for a peak reflow temperature of 260 °C, matching the J-STD-020 profile for lead-free solder pastes. This rating confirms compatibility with standard lead-free SMT assembly lines using SAC305 solder alloy, which typically peaks at 250 °C to 260 °C, allowing the device to be assembled alongside other RoHS-compliant components without special oven profiling.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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