CD74HC75PW Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
The CD74HC75PW is a dual 2-bit bistable transparent latch from Texas Instruments in the HC CMOS logic family. It operates at up to 28 MHz with 5.2 mA output drive and comes in a 16-pin TSSOP package. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 16
- Lifecycle
- OBSOLETE
- Datasheet
- CD74HC75PW Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual 2-bit transparent D latch with independent enable signals for flexible data storage
- HC CMOS technology operating at up to 28 MHz with 50 pF load capacitance
- Compact 16-pin TSSOP package ideal for high-density PCB designs
Applications
The CD74HC75PW is used for temporary data storage and bus interface latching in microprocessor-based systems, FPGA peripherals, and digital control circuits. Its transparent latch operation allows real-time data passthrough when enabled, making it useful in address/data demultiplexing and pipeline buffering. The device is also common in industrial controllers, test equipment, and communication hardware requiring reliable CMOS latch functionality.
Specifications
| YTEOL | 0 |
| Family | HC/UH |
| JESD-30 Code | R-PDSO-G16 |
| JESD-609 Code | e4 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | D LATCH |
| Max Frequency@Nom-Sup | 28000000Hz |
| Max I(ol) | 0.0052A |
| Number of Bits | 2 |
| Number of Functions | 4 |
| Output Polarity | COMPLEMENTARY |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP16,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supply Current-Max (ICC) | 0.08mA |
| Prop. Delay@Nom-Sup | 24ns |
| Propagation Delay (tpd) | 195ns |
| Qualification Status | Not Qualified |
| Schmitt Trigger | NO |
| Supply Voltage-Max (Vsup) | 6V |
| Supply Voltage-Min (Vsup) | 2V |
| Supply Voltage-Nom (Vsup) | 4.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Trigger Type | HIGH LEVEL |
| fmax-Min | 28MHz |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
| Country of Origin | Malaysia |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for CD74HC75PW:
Latch, HC/UH Series, 4-Func, High Level Triggered, 2-Bit, Complementary Output, CMOS, PDSO16
Frequently Asked Questions
What is the maximum operating frequency of the CD74HC75PW?
The CD74HC75PW supports a maximum operating frequency of 28 MHz at nominal supply voltage, ensuring reliable data latching in medium-speed digital logic and bus interface applications.
How does the transparent latch function of the CD74HC75PW work?
When the enable input is high, the CD74HC75PW passes input data directly to the outputs (transparent mode). When enable goes low, the last data state is latched and held at the outputs regardless of input changes.
What package does the CD74HC75PW come in?
The CD74HC75PW is available in a 16-pin TSSOP (Thin Shrink Small Outline Package), offering a small surface-mount footprint suitable for compact and high-density PCB assemblies.
What logic family is the CD74HC75PW part of?
The CD74HC75PW belongs to the HC (High-Speed CMOS) logic family, providing low power consumption, a wide supply voltage range of 2V to 6V, and compatibility with TTL-level logic systems.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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