CD74HC540E Texas Instruments Integrated Circuit (Dual-In-Line Packages) In Stock

CD74HC540E is a high-speed CMOS octal inverting bus buffer and line driver from Texas Instruments, featuring 8 inverting 3-state outputs, dual active-low output-enable pins, 50 pF load drive, and housed in a 20-pin DIP package. From $0.60 in stock worldwide shipping.

ACTIVEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
CD74HC540EDual-In-Line Packages
Quick Facts
Manufacturer
Texas Instruments
Package
Dual-In-Line Packages
Pin Count
20
Lifecycle
ACTIVE
Category
Integrated Circuit
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 8 inverting 3-state outputs with dual active-low output-enable control for flexible bus-sharing and multiplexed data path designs
  • HC/UH CMOS family operation from 2 V to 6 V supply with high-speed propagation delay under 10 ns at 5 V
  • Drives 50 pF capacitive loads at full CMOS voltage swings, compatible with both 3.3 V and 5 V logic systems

Applications

The CD74HC540E is used in microprocessor data bus buffering, memory address demultiplexing, and backplane data-path isolation in embedded systems and industrial controllers. Its dual output-enable inputs allow two independent bus-enable sources to control all 8 output channels, simplifying arbitration logic in multi-master bus architectures. Test equipment, FPGA prototyping boards, and legacy TTL replacement designs also rely on the CD74HC540E for level-compatible, 3-state line driving with inverting logic.

Specifications

Pbfree CodeYes
YTEOL15
Additional FeatureWITH DUAL OUTPUT ENABLE
Control TypeENABLE LOW
Count DirectionUNIDIRECTIONAL
FamilyHC/UH
JESD-30 CodeR-PDIP-T20
JESD-609 Codee4
Load Capacitance (CL)50pF
Logic IC TypeBUS DRIVER
Max I(ol)0.006A
Number of Bits8
Number of Functions8
Number of Ports2
Output Characteristics3-STATE
Output PolarityINVERTED
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeDIP20,.3
Package ShapeRECTANGULAR
Package StyleIN-LINE
Packing MethodTUBE
Power Supply Current-Max (ICC)0.16mA
Prop. Delay@Nom-Sup33ns
Propagation Delay (tpd)165ns
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup)6V
Supply Voltage-Min (Vsup)2V
Supply Voltage-Nom (Vsup)5V
Surface MountNO
TechnologyCMOS
Temperature GradeMILITARY
Terminal FinishNickel/Palladium/Gold (Ni/Pd/Au)
Terminal FormTHROUGH-HOLE
Terminal Pitch2.54mm
Terminal PositionDUAL
## CD74HC540E Alternates Showing resultsImage
PackageDual-In-Line Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8542.39.00.90
Country of OriginMalaysia

Datasheet

CD74HC540E Datasheet Download

Official datasheet from Texas Instruments

Alternate & Equivalent Parts

Compatible alternatives and drop-in replacements for CD74HC540E:

Frequently Asked Questions

How does the dual output-enable feature of CD74HC540E simplify multi-master bus designs?

CD74HC540E has two independent active-low output-enable pins (OE1 and OE2), both of which must be low to enable the 8 outputs. This wired-AND enable logic lets two independent bus masters each assert their own OE signal, preventing bus contention without external gate logic and reducing component count in 8-bit multi-master systems.

What propagation delay and supply voltage does CD74HC540E support in a 5 V logic system?

Operating at 5 V supply, CD74HC540E achieves typical propagation delays below 10 ns and guaranteed maximum delays of approximately 14 ns at 50 pF load, comfortably supporting bus clock frequencies above 30 MHz. The device operates from 2 V to 6 V, making it backward-compatible with 3.3 V and 5 V CMOS logic families.

Which bus architectures benefit most from CD74HC540E as a line driver?

Microprocessor address and data buses operating at 8-bit width, ISA-style backplanes, and SRAM/DRAM address demultiplexers benefit most from CD74HC540E. The device drives up to 50 pF capacitive loads per channel and absorbs bus current surges, extending signal integrity across board-to-board connectors in industrial control systems and embedded computing platforms.

How does the 20-pin DIP package of CD74HC540E compare to equivalent SOIC packages for prototyping?

The 20-pin through-hole DIP package with 2.54 mm pitch is ideal for breadboard and perfboard prototyping, while the equivalent CD74HC540M SOIC-20 package measures roughly 12.8 mm × 7.5 mm and saves about 50% PCB footprint in production designs. Both packages offer identical electrical performance including the 50 pF load drive and 3-state output characteristics.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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