CD74HC4050E Texas Instruments Integrated Circuit (Dual-In-Line Packages) In Stock
CD74HC4050 is a hex non-inverting buffer with six independent channels for CMOS-to-TTL level translation. Operating from a 2 V to 6 V supply, it drives TTL-compatible loads with up to 4 mA output current per channel and supports a 50 pF load capacitance. Packaged in a 16-pin DIP for through-hole board assembly in logic interfacing applications.
- Manufacturer
- Texas Instruments
- Package
- Dual-In-Line Packages
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- CD74HC4050E Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $0.2934(MOQ 1)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 6 independent non-inverting buffer channels for CMOS-to-TTL level translation
- Wide supply voltage range of 2 V to 6 V for multi-voltage system compatibility
- 4 mA output sink current per channel for driving TTL inputs
- 50 pF rated load capacitance per output for standard CMOS fan-out
- HC CMOS family combining low power with high-speed switching
- 16-pin DIP through-hole package for prototyping and socketed designs
Applications
The CD74HC4050 is used to interface CMOS logic outputs to TTL-level inputs in mixed-logic systems, such as connecting microcontroller GPIO lines to older 74LS or 74AS series logic ICs. It also serves as a signal buffer to increase drive capability on digital bus lines driving multiple inputs, reducing loading on source logic gates. In prototyping boards and test equipment, its DIP-16 package allows easy insertion into standard 0.1-inch breadboards for rapid circuit validation.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| Additional Feature | CMOS-TTL LEVEL TRANSLATOR |
| Family | HC/UH |
| JESD-30 Code | R-PDIP-T16 |
| JESD-609 Code | e4 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | BUFFER |
| Max I(ol) | 0.004A |
| Number of Functions | 6 |
| Number of Inputs | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | DIP16,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Power Supply Current-Max (ICC) | 0.04mA |
| Prop. Delay@Nom-Sup | 26ns |
| Propagation Delay (tpd) | 130ns |
| Qualification Status | Not Qualified |
| Schmitt Trigger | NO |
| Supply Voltage-Max (Vsup) | 6V |
| Supply Voltage-Min (Vsup) | 2V |
| Supply Voltage-Nom (Vsup) | 4.5V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| ## CD74HC4050E Alternates Showing results | Image |
| Package | Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
| Country of Origin | Malaysia, Mexico |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for CD74HC4050E:
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Frequently Asked Questions
How does the CD74HC4050 perform CMOS-to-TTL level translation between two logic families?
The CD74HC4050 translates CMOS logic output levels (which swing close to VCC and GND) into TTL-compatible signals by buffering each input to an output that meets the TTL VOH minimum of 2.4 V and VOL maximum of 0.4 V. Powered from a 5 V supply, it drives up to 4 mA per channel, sufficient to source or sink current for standard 74LS TTL inputs requiring a minimum 0.4 mA sink. This avoids the voltage incompatibility that occurs when CMOS high levels exceed the absolute maximum input voltage of TTL devices.
Can the CD74HC4050 operate at 3.3 V to buffer signals for a mixed 3.3 V and 5 V board?
The CD74HC4050 operates from as low as 2 V supply, so it can be powered at 3.3 V to buffer 3.3 V CMOS logic signals. At 3.3 V supply, its output swing will be within 0.1 V of VCC and GND, providing clean logic levels for downstream 3.3 V loads. However, it should not be used directly to translate 3.3 V signals to 5 V levels; a dedicated bidirectional level translator or an open-drain pull-up to 5 V is required for that scenario.
In what way does using the CD74HC4050 reduce loading on a microcontroller GPIO pin?
Microcontroller GPIO pins typically source or sink only 4 mA to 20 mA total before voltage droop degrades logic levels. By inserting the CD74HC4050 buffer between a GPIO and multiple downstream loads, each of the 6 channels drives up to 4 mA independently, allowing the GPIO to drive only the single buffer input with negligible current draw. This is especially useful on shared clock or strobe lines where the GPIO must fan out to 4 or more logic inputs without exceeding its rated 8 mA output current.
How does the 16-pin DIP package of the CD74HC4050E affect PCB assembly options compared to SOIC variants?
The CD74HC4050E DIP-16 package uses 2.54 mm through-hole pin spacing, making it directly insertable into standard breadboards and 0.1-inch pitch IC sockets without soldering, which is valuable for prototyping and field-replaceable designs. Its footprint occupies roughly 3× more board area than an equivalent 16-pin SOIC at 1.27 mm pitch, so production boards typically prefer the SOIC variant (CD74HC4050M) to save space. DIP packages also withstand higher mechanical stress during manual assembly, making them common in industrial repair and test fixtures.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $0.4545 | $0.45 |
| 25+ | $0.3000 | $7.50 |
| 100000+ | $0.2934 | $29340.00 |
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