CD74HC366MG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
The CD74HC366MG4 is a high-speed CMOS hex inverting bus driver with dual active-low output enable and 50 pF load capacitance. Operates in SOIC-16 package with 6 mA sink current per output. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 16
- Lifecycle
- OBSOLETE
- Datasheet
- CD74HC366MG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of CD74HC366MG4?
- Dual active-low output enable pins allow selective tri-stating of two independent groups, simplifying bus multiplexing
- HC/UH CMOS family provides wide supply voltage operation with low quiescent current for power-efficient bus buffering
- 50 pF load capacitance rating supports driving standard TTL bus lines without additional buffering
- SOIC-16 package with 16 leads enables compact PCB placement for data bus and address line driving applications
What is CD74HC366MG4 used for?
The CD74HC366MG4 serves as a hex inverting bus driver in microprocessor and microcontroller systems where address or data bus signals require buffering and controlled tri-state operation. Its dual output enable inputs make it well suited for memory expansion boards, where independent enable control of two groups of 3 lines manages bus contention. It is also used in industrial PLCs and test equipment backplanes requiring reliable signal drive at 50 pF load capacitance.
What are the specifications of CD74HC366MG4?
| YTEOL | 0 |
| Additional Feature | WITH DUAL OUTPUT ENABLE |
| Control Type | ENABLE LOW |
| Count Direction | UNIDIRECTIONAL |
| Family | HC/UH |
| JESD-30 Code | R-PDSO-G16 |
| JESD-609 Code | e4 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | BUS DRIVER |
| Max I(ol) | 0.006A |
| Number of Bits | 6 |
| Number of Functions | 1 |
| Number of Ports | 2 |
| Output Characteristics | 3-STATE |
| Output Polarity | INVERTED |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP16,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supply Current-Max (ICC) | 0.16mA |
| Prop. Delay@Nom-Sup | 32ns |
| Propagation Delay (tpd) | 165ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 6V |
| Supply Voltage-Min (Vsup) | 2V |
| Supply Voltage-Nom (Vsup) | 4.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.60 |
Where can I find the CD74HC366MG4 datasheet?
CD74HC366MG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for CD74HC366MG4?
Compatible alternatives and drop-in replacements for CD74HC366MG4:
Bus Driver, HC/UH Series, 1-Func, 6-Bit, Inverted Output, CMOS, PDSO16
Frequently Asked Questions
How does the dual output enable on the CD74HC366MG4 help manage bus contention in a memory expansion design?
The CD74HC366MG4 provides two separate active-low output enable pins, each controlling 3 of the 6 inverting driver outputs, so a memory controller can independently tri-state each group to avoid bus contention when switching between two memory banks. With a 6 mA sink current per output and 50 pF load capacitance rating, it drives standard CMOS and TTL bus lines reliably in memory interface designs.
What supply voltage range does the CD74HC366MG4 support, and how does it perform at 3.3 V compared to 5 V?
The CD74HC366MG4 belongs to the HC/UH CMOS family, which supports a supply voltage range of 2 V to 6 V, making it compatible with both 3.3 V and 5 V logic systems. At 3.3 V the propagation delay increases slightly compared to 5 V operation, so designs requiring maximum switching speed above 50 MHz should verify timing margins against the specific datasheet curves for the operating voltage.
For a 16-bit address bus buffering application, how many CD74HC366MG4 devices are needed and what total sink current can they provide?
Each CD74HC366MG4 buffers 6 lines, so 3 devices are needed to drive all 16 address bus lines with 2 lines unused or used for control signals. With 6 mA sink current per output, each IC can collectively sink up to 36 mA across its 6 outputs, and 3 ICs together provide up to 108 mA total sink capacity for worst-case simultaneous switching scenarios on a heavily loaded PCB bus.
What is the SOIC-16 footprint of the CD74HC366MG4 and how does it compare to a DIP-16 alternative for a prototype board?
The CD74HC366MG4 in SOIC-16 has a 10 mm body length and 1.27 mm lead pitch, occupying roughly 60 mm2 of PCB area compared to about 185 mm2 for a through-hole DIP-16 equivalent. While a DIP-16 is easier to prototype on breadboards, the SOIC-16 reduces board space by approximately 3x and is compatible with standard SMD reflow assembly for production designs.
Related Guides
CSD87313DMS Synchronous Buck Power Stage Design Guide
Design a compact CSD87313DMS synchronous buck stage with practical guidance for loss, gate drive, PCB layout, EMI, thermal validation, and sourcing.
Aug 6, 2026
STEF05SGR eFuse Selection Guide for 5 V Overcurrent Protection
Choose STEF05SGR for 5 V overcurrent protection by checking current-limit margin, inrush, thermal loss, fault response, and sourcing.
Aug 6, 2026
C0402C103K3RACTU Selection Guide: Choosing a 10 nF 0402 MLCC
Select C0402C103K3RACTU by voltage margin, X7R behavior, tolerance, 0402 assembly risk, and qualified alternatives.
Aug 4, 2026
STM32H753VIT6 MCU Selection Guide: Memory, Package, Connectivity, and Security
Choose STM32H753VIT6 by evaluating memory architecture, LQFP-100 pin fit, connectivity, security, power, and sourcing tradeoffs.
Aug 4, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“We've been using FindMyChip for 2 years. Pricing is consistently 20-30% below Mouser/DigiKey for volume orders.”
You May Also Like
ACS770ECB-200U-PFF-T
Allegro Microsystems
Integrated Circuit
ACS770KCB-150U-PFF-T
Allegro Microsystems
Integrated Circuit
MC33901WEF
NXP
Integrated Circuit
MC7808BDTRKG
ON Semiconductor
Integrated Circuit
PA94EC
Apex Microtechnology
Integrated Circuit
AP7315-28SR-7
Diodes Inc.
Integrated Circuit
74HCT245D
Nexperia
Integrated Circuit
CY62256VNLL-70ZXCT
Cypress Semiconductor
Integrated Circuit
EPM7032AETC44-4N
Intel
Integrated Circuit
EPM3512AQC208-10N
Intel
Integrated Circuit
EPM3256ATC144-7N
Intel
Integrated Circuit
EPM3256AQC208-7N
Intel
Integrated Circuit
EPM3256AQC208-10N
Intel
Integrated Circuit
EPM3128ATC100-7N
Intel
Integrated Circuit
EPM1270F256C4N
Intel
Integrated Circuit
EPF8282ATC100-4N
Intel
Integrated Circuit
EPF6016QC208-2N
Intel
Integrated Circuit
EPF6016ATC144-3N
Intel
Integrated Circuit
EPF10K30ATC144-3N
Intel
Integrated Circuit
EPC2TI32N
Intel
Integrated Circuit
EPC2LC20
Intel
Integrated Circuit
EP3SL150F1152C4N
Intel
Integrated Circuit
EP2SGX60DF780C5N
Intel
Integrated Circuit
EP2SGX60CF780C5N
Intel
Integrated Circuit