CD74HC365M96 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
Texas Instruments CD74HC365M96 is a high-speed CMOS hex non-inverting buffer and line driver with 3-state outputs, dual active-low output enable, 50 pF load capacitance, in a 16-pin SOIC package. From $0.40 in stock worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- CD74HC365M96 Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $0.5290(MOQ 100)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of CD74HC365M96?
- Hex 3-state non-inverting buffers with dual active-low output enable for flexible bus control
- HC/UH CMOS family with 50 pF rated load capacitance for robust line driving
- 16-pin SOIC (R-PDSO-G16) RoHS-compliant package for space-efficient board designs
What is CD74HC365M96 used for?
The CD74HC365M96 is commonly used in digital bus buffering and signal fanout applications, where multiple loads need to be driven from a single source without degrading logic levels. Its 3-state outputs and dual enable control make it ideal for data bus isolation, memory address buffering, and bidirectional bus arbitration in embedded and communications systems. The SOIC-16 package suits automated PCB assembly in consumer electronics and industrial control boards.
What are the specifications of CD74HC365M96?
| Pbfree Code | Yes |
| YTEOL | 15 |
| Additional Feature | WITH DUAL OUTPUT ENABLE |
| Control Type | ENABLE LOW |
| Count Direction | UNIDIRECTIONAL |
| Family | HC/UH |
| JESD-30 Code | R-PDSO-G16 |
| JESD-609 Code | e4 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | BUS DRIVER |
| Max I(ol) | 0.006A |
| Number of Bits | 6 |
| Number of Functions | 6 |
| Number of Ports | 2 |
| Output Characteristics | 3-STATE |
| Output Polarity | TRUE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP16,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Packing Method | TR |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supply Current-Max (ICC) | 0.16mA |
| Prop. Delay@Nom-Sup | 32ns |
| Propagation Delay (tpd) | 160ns |
| Qualification Status | Not Qualified |
| Screening Level | AEC-Q100 |
| Supply Voltage-Max (Vsup) | 6V |
| Supply Voltage-Min (Vsup) | 2V |
| Supply Voltage-Nom (Vsup) | 4.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
| Country of Origin | Mexico |
Where can I find the CD74HC365M96 datasheet?
CD74HC365M96 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for CD74HC365M96?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many buffer channels does the CD74HC365M96 provide and what is its output state count?
The CD74HC365M96 provides 6 non-inverting buffer channels, each with a 3-state output, allowing individual channels to be placed in a high-impedance state via the dual active-low enable pins, reducing bus contention in shared-data-line designs.
What load capacitance can the CD74HC365M96 reliably drive?
The CD74HC365M96 is rated for a load capacitance of 50 pF per output, consistent with the HC CMOS family specification, making it suitable for driving standard PCB traces and TTL-compatible inputs at operating frequencies up to tens of MHz.
In which bus isolation or buffering designs is the CD74HC365M96 typically used?
This device is widely used in memory bus buffering, microcontroller address-line fanout, and multi-board backplane signal distribution where 3-state control is needed to isolate segments. The dual enable inputs allow two independent groups to control the 6 outputs in pairs.
What package does the CD74HC365M96 use and how does it compare to DIP versions?
The CD74HC365M96 uses a 16-pin SOIC surface-mount package (R-PDSO-G16) with a pitch of 1.27 mm, offering a much smaller PCB footprint than a through-hole DIP-16 and better suitability for high-density automated assembly in modern electronics manufacturing.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 100+ | $0.6395 | $63.95 |
| 250+ | $0.5990 | $149.76 |
| 500+ | $0.5783 | $289.17 |
| 1000+ | $0.5780 | $578.00 |
| 2500+ | $0.5330 | $1332.50 |
| 5000+ | $0.5290 | $2645.00 |
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