CD74HC365M96 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock

Texas Instruments CD74HC365M96 is a high-speed CMOS hex non-inverting buffer and line driver with 3-state outputs, dual active-low output enable, 50 pF load capacitance, in a 16-pin SOIC package. From $0.40 in stock worldwide shipping.

ACTIVEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
CD74HC365M96Small Outline Packages
Quick Facts
Manufacturer
Texas Instruments
Package
Small Outline Packages
Pin Count
16
Lifecycle
ACTIVE
Category
Integrated Circuit
Price
From $0.5290(MOQ 100)
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of CD74HC365M96?

  • Hex 3-state non-inverting buffers with dual active-low output enable for flexible bus control
  • HC/UH CMOS family with 50 pF rated load capacitance for robust line driving
  • 16-pin SOIC (R-PDSO-G16) RoHS-compliant package for space-efficient board designs

What is CD74HC365M96 used for?

The CD74HC365M96 is commonly used in digital bus buffering and signal fanout applications, where multiple loads need to be driven from a single source without degrading logic levels. Its 3-state outputs and dual enable control make it ideal for data bus isolation, memory address buffering, and bidirectional bus arbitration in embedded and communications systems. The SOIC-16 package suits automated PCB assembly in consumer electronics and industrial control boards.

What are the specifications of CD74HC365M96?

Pbfree CodeYes
YTEOL15
Additional FeatureWITH DUAL OUTPUT ENABLE
Control TypeENABLE LOW
Count DirectionUNIDIRECTIONAL
FamilyHC/UH
JESD-30 CodeR-PDSO-G16
JESD-609 Codee4
Load Capacitance (CL)50pF
Logic IC TypeBUS DRIVER
Max I(ol)0.006A
Number of Bits6
Number of Functions6
Number of Ports2
Output Characteristics3-STATE
Output PolarityTRUE
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeSOP16,.25
Package ShapeRECTANGULAR
Package StyleSMALL OUTLINE
Packing MethodTR
Peak Reflow Temperature (Cel)260
Power Supply Current-Max (ICC)0.16mA
Prop. Delay@Nom-Sup32ns
Propagation Delay (tpd)160ns
Qualification StatusNot Qualified
Screening LevelAEC-Q100
Supply Voltage-Max (Vsup)6V
Supply Voltage-Min (Vsup)2V
Supply Voltage-Nom (Vsup)4.5V
Surface MountYES
TechnologyCMOS
Temperature GradeMILITARY
Terminal FinishNickel/Palladium/Gold (Ni/Pd/Au)
Terminal FormGULL WING
Terminal Pitch1.27mm
Terminal PositionDUAL
Time@Peak Reflow Temperature-Max (s)30
PackageSmall Outline Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 1
ECCNEAR99
HTS Code8542.39.00.90
Country of OriginMexico

Where can I find the CD74HC365M96 datasheet?

CD74HC365M96 Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for CD74HC365M96?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many buffer channels does the CD74HC365M96 provide and what is its output state count?

The CD74HC365M96 provides 6 non-inverting buffer channels, each with a 3-state output, allowing individual channels to be placed in a high-impedance state via the dual active-low enable pins, reducing bus contention in shared-data-line designs.

What load capacitance can the CD74HC365M96 reliably drive?

The CD74HC365M96 is rated for a load capacitance of 50 pF per output, consistent with the HC CMOS family specification, making it suitable for driving standard PCB traces and TTL-compatible inputs at operating frequencies up to tens of MHz.

In which bus isolation or buffering designs is the CD74HC365M96 typically used?

This device is widely used in memory bus buffering, microcontroller address-line fanout, and multi-board backplane signal distribution where 3-state control is needed to isolate segments. The dual enable inputs allow two independent groups to control the 6 outputs in pairs.

What package does the CD74HC365M96 use and how does it compare to DIP versions?

The CD74HC365M96 uses a 16-pin SOIC surface-mount package (R-PDSO-G16) with a pitch of 1.27 mm, offering a much smaller PCB footprint than a through-hole DIP-16 and better suitability for high-density automated assembly in modern electronics manufacturing.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

AvailabilityIn Stock
Reference Price (USD)
From $0.5290
Buy from 1pc · Factory-direct pricing
Qty.Unit PriceExt. Price
100+$0.6395$63.95
250+$0.5990$149.76
500+$0.5783$289.17
1000+$0.5780$578.00
2500+$0.5330$1332.50
5000+$0.5290$2645.00
pcs
Unit price: $0.6395 · Total: $63.95

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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