CD54HCT30F3A Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
The CD54HCT30F3A is a high-speed CMOS 8-input NAND gate IC in a 14-pin ceramic DIP package, part of the HCT logic family with TTL-compatible inputs and 50 pF load capacitance. Lead-free and available in stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 14
- Lifecycle
- ACTIVE
- Datasheet
- CD54HCT30F3A Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Single 8-input NAND gate in the HCT family provides TTL-compatible input levels while operating at CMOS speed and power efficiency
- 14-pin ceramic DIP (GDIP) package offers superior reliability and thermal performance for military, aerospace, and harsh environment applications
- 50 pF load capacitance with 4 mA output low current supports reliable driving of standard logic buses in high-reliability digital systems
Applications
The CD54HCT30F3A is used in high-reliability digital logic systems requiring an 8-input NAND gate with TTL-compatible inputs, such as address decoding, interrupt logic, and combinational control in military, aerospace, and industrial electronics. Its ceramic DIP package ensures durability in wide temperature range and high-vibration environments. It is also applied in legacy system maintenance and high-reliability designs where ceramic packaging is mandated by specification.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| Family | HCT |
| JESD-30 Code | R-GDIP-T14 |
| JESD-609 Code | e0 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | NAND GATE |
| Max I(ol) | 0.004A |
| Number of Functions | 1 |
| Number of Inputs | 8 |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP14,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Power Supply Current-Max (ICC) | 0.04mA |
| Prop. Delay@Nom-Sup | 42ns |
| Propagation Delay (tpd) | 42ns |
| Qualification Status | Not Qualified |
| Schmitt Trigger | NO |
| Screening Level | 38535Q/M;38534H;883B |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 4.5V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the function of the CD54HCT30F3A?
The CD54HCT30F3A is a single 8-input NAND gate. It produces a LOW output only when all eight inputs are HIGH, and a HIGH output for any other input combination. It belongs to the HCT logic family with TTL-compatible inputs and CMOS-level outputs.
What makes the CD54HCT30F3A suitable for harsh environments?
The CD54HCT30F3A is housed in a 14-pin ceramic dual in-line package (GDIP), which provides superior mechanical strength, hermetic sealing, and thermal stability compared to plastic packages, making it ideal for military, aerospace, and industrial applications with wide temperature ranges.
What logic family does the CD54HCT30F3A belong to?
The CD54HCT30F3A belongs to the HCT (High-speed CMOS with TTL-compatible inputs) logic family, which accepts standard TTL input levels (0.8V LOW, 2.0V HIGH thresholds) while providing CMOS power consumption and switching speed at a 5V supply voltage.
What is the load capacitance and output current of the CD54HCT30F3A?
The CD54HCT30F3A specifies a load capacitance of 50 pF and a maximum output low current (IOL) of 4 mA, which determines its fan-out capability and suitability for driving standard logic bus loads in TTL-compatible digital systems.
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Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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