CD54HCT283F3A Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
CD54HCT283F3A is a 4-bit binary full adder with full internal look-ahead carry in a 16-pin ceramic DIP package by Texas Instruments. Key specs: HCT logic family, 50pF load capacitance, 4mA output sink current, TTL-compatible inputs. From competitive pricing, in stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- CD54HCT283F3A Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of CD54HCT283F3A?
- Full internal look-ahead carry for maximum 4-bit addition speed with no ripple-carry delay
- HCT family TTL-compatible inputs allow direct interfacing with both TTL and CMOS logic at 5V
- Ceramic 16-pin DIP package for high-reliability industrial and military temperature environments
What is CD54HCT283F3A used for?
CD54HCT283F3A is used in arithmetic logic units, address offset generators, and hardware BCD-to-binary converters in legacy digital systems and industrial control boards that require reliable 4-bit addition at 5V TTL-compatible logic levels. Its look-ahead carry architecture minimises propagation delay when cascading multiple 4-bit adders for wider word-length arithmetic. The ceramic DIP package makes it appropriate for high-reliability applications such as avionics and military equipment operating over extended temperature ranges.
What are the specifications of CD54HCT283F3A?
| Pbfree Code | Yes |
| YTEOL | 15 |
| Additional Feature | WITH FULL INTERNAL LOOKAHEAD |
| Family | HCT |
| JESD-30 Code | R-GDIP-T16 |
| JESD-609 Code | e0 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | ADDER/SUBTRACTOR |
| Max I(ol) | 0.004A |
| Number of Bits | 4 |
| Number of Functions | 1 |
| Output Polarity | TRUE |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP16,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Power Supply Current-Max (ICC) | 0.08mA |
| Prop. Delay@Nom-Sup | 60ns |
| Propagation Delay (tpd) | 74ns |
| Qualification Status | Not Qualified |
| Screening Level | 38535Q/M;38534H;883B |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 4.5V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
Where can I find the CD54HCT283F3A datasheet?
CD54HCT283F3A Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for CD54HCT283F3A?
Compatible alternatives and drop-in replacements for CD54HCT283F3A:
Frequently Asked Questions
How does the full internal look-ahead carry in CD54HCT283F3A improve addition speed compared to ripple-carry adders?
CD54HCT283F3A uses internal carry look-ahead logic that computes all carry bits simultaneously from the input data, rather than waiting for each bit position to propagate a carry to the next. This reduces the worst-case addition delay to typically under 20 ns at 5V, whereas a 4-bit ripple-carry adder may take 4× the single-bit carry delay. When multiple CD54HCT283F3A devices are cascaded for 8-bit or 16-bit addition, look-ahead carry drastically reduces total path delay.
What logic family and voltage levels does CD54HCT283F3A support for interface with TTL circuits?
CD54HCT283F3A belongs to the HCT logic family, which accepts TTL-level inputs with a high threshold of 2V and a low threshold of 0.8V while operating from a 5V supply. This makes it directly compatible with legacy TTL devices such as the 74LS and 74S families without level-shifting circuitry. The output can sink 4mA at the low level, meeting standard TTL fanout requirements for driving multiple TTL inputs.
For which high-reliability environments is CD54HCT283F3A's ceramic DIP package best suited?
The CD54HCT283F3A uses a 16-pin ceramic dual-in-line package (JESD-30 R-GDIP-T16) rated for extended temperature ranges, making it suitable for avionics, military ground equipment, and space-adjacent applications where plastic packages are disqualified by MIL-SPEC or equivalent standards. Ceramic packages provide superior hermeticity and moisture resistance compared to plastic SOIC or TSSOP alternatives. The 50pF load capacitance rating supports reliable switching even with moderate board trace capacitance in such environments.
Can CD54HCT283F3A be cascaded to perform wider arithmetic operations such as 8-bit or 16-bit addition?
Yes, two CD54HCT283F3A devices can be cascaded by connecting the carry-out (C4) of the lower 4-bit stage to the carry-in (C0) of the upper 4-bit stage, yielding an 8-bit adder with only 2 packages. For 16-bit addition, 4 devices are needed, and the cascaded carry propagation remains fast because each device's look-ahead carry logic pre-generates its carry terms. The 4mA output drive also ensures the C4 output can reliably drive the next stage's C0 input with a standard pull-up or no additional buffer.
Related Guides
CSD87313DMS Synchronous Buck Power Stage Design Guide
Design a compact CSD87313DMS synchronous buck stage with practical guidance for loss, gate drive, PCB layout, EMI, thermal validation, and sourcing.
Aug 6, 2026
STEF05SGR eFuse Selection Guide for 5 V Overcurrent Protection
Choose STEF05SGR for 5 V overcurrent protection by checking current-limit margin, inrush, thermal loss, fault response, and sourcing.
Aug 6, 2026
C0402C103K3RACTU Selection Guide: Choosing a 10 nF 0402 MLCC
Select C0402C103K3RACTU by voltage margin, X7R behavior, tolerance, 0402 assembly risk, and qualified alternatives.
Aug 4, 2026
STM32H753VIT6 MCU Selection Guide: Memory, Package, Connectivity, and Security
Choose STM32H753VIT6 by evaluating memory architecture, LQFP-100 pin fit, connectivity, security, power, and sourcing tradeoffs.
Aug 4, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“We've been using FindMyChip for 2 years. Pricing is consistently 20-30% below Mouser/DigiKey for volume orders.”
You May Also Like
ACS770ECB-200U-PFF-T
Allegro Microsystems
Integrated Circuit
ACS770KCB-150U-PFF-T
Allegro Microsystems
Integrated Circuit
MC33901WEF
NXP
Integrated Circuit
MC7808BDTRKG
ON Semiconductor
Integrated Circuit
PA94EC
Apex Microtechnology
Integrated Circuit
AP7315-28SR-7
Diodes Inc.
Integrated Circuit
74HCT245D
Nexperia
Integrated Circuit
CY62256VNLL-70ZXCT
Cypress Semiconductor
Integrated Circuit
EPM7032AETC44-4N
Intel
Integrated Circuit
EPM3512AQC208-10N
Intel
Integrated Circuit
EPM3256ATC144-7N
Intel
Integrated Circuit
EPM3256AQC208-7N
Intel
Integrated Circuit
EPM3256AQC208-10N
Intel
Integrated Circuit
EPM3128ATC100-7N
Intel
Integrated Circuit
EPM1270F256C4N
Intel
Integrated Circuit
EPF8282ATC100-4N
Intel
Integrated Circuit
EPF6016QC208-2N
Intel
Integrated Circuit
EPF6016ATC144-3N
Intel
Integrated Circuit
EPF10K30ATC144-3N
Intel
Integrated Circuit
EPC2TI32N
Intel
Integrated Circuit
EPC2LC20
Intel
Integrated Circuit
EP3SL150F1152C4N
Intel
Integrated Circuit
EP2SGX60DF780C5N
Intel
Integrated Circuit
EP2SGX60CF780C5N
Intel
Integrated Circuit