CD54HCT157F3A Texas Instruments Integrated Circuit (Dual-In-Line Packages) In Stock

Texas Instruments CD54HCT157F3A is a quad 2-to-1 HCT CMOS multiplexer with 8 inputs in a 16-pin ceramic DIP package. Features 50 pF load capacitance and 4 mA output sink current for TTL-compatible logic selection. In stock worldwide with competitive pricing and reliable supply.

ACTIVEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
CD54HCT157F3ADual-In-Line Packages
Quick Facts
Manufacturer
Texas Instruments
Package
Dual-In-Line Packages
Pin Count
16
Lifecycle
ACTIVE
Category
Integrated Circuit
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of CD54HCT157F3A?

  • Quad 2-to-1 CMOS multiplexer with 8 inputs and 4 functions per package, ideal for TTL-to-CMOS signal routing in HCT logic families
  • 50 pF load capacitance rating and 4 mA output sink current (I_ol) enabling direct drive of standard logic buses without buffering
  • 16-pin ceramic DIP (CDIP) package providing high reliability for military, aerospace, and industrial long-life designs with extended YTEOL of 15 years

What is CD54HCT157F3A used for?

The CD54HCT157F3A is used in data selection and bus multiplexing circuits within military electronics, aerospace avionics, and high-reliability industrial control systems requiring ceramic package longevity and TTL-compatible HCT logic performance. Its quad 2-to-1 configuration with 8 inputs enables flexible signal routing in FPGA support logic, address decoding, and data bus switching applications operating at standard 5 V HCT supply levels.

What are the specifications of CD54HCT157F3A?

Pbfree CodeYes
YTEOL15
FamilyHCT
JESD-30 CodeR-GDIP-T16
JESD-609 Codee0
Load Capacitance (CL)50pF
Logic IC TypeMULTIPLEXER
Max I(ol)0.004A
Number of Bits2
Number of Functions4
Number of Inputs2
Number of Outputs1
Output PolarityTRUE
Package Body MaterialCERAMIC, GLASS-SEALED
Package Equivalence CodeDIP16,.3
Package ShapeRECTANGULAR
Package StyleIN-LINE
Packing MethodTUBE
Power Supply Current-Max (ICC)0.16mA
Prop. Delay@Nom-Sup12ns
Propagation Delay (tpd)190ns
Qualification StatusNot Qualified
Screening Level38535Q/M;38534H;883B
Supply Voltage-Max (Vsup)5.5V
Supply Voltage-Min (Vsup)4.5V
Supply Voltage-Nom (Vsup)5V
Surface MountNO
TechnologyCMOS
Temperature GradeMILITARY
Terminal FinishTin/Lead (Sn/Pb)
Terminal FormTHROUGH-HOLE
Terminal Pitch2.54mm
Terminal PositionDUAL
PackageDual-In-Line Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8542.39.00.90

Where can I find the CD54HCT157F3A datasheet?

CD54HCT157F3A Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for CD54HCT157F3A?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many input channels does the CD54HCT157F3A support and at what supply voltage?

The CD54HCT157F3A supports 8 input channels organized as 4 independent 2-to-1 multiplexers, operating at standard HCT supply voltage of 5 V. With a 50 pF load capacitance rating and 4 mA output sink current, it interfaces directly with TTL and CMOS logic buses in a 16-pin DIP package.

Why is the ceramic DIP package of the CD54HCT157F3A preferred in aerospace or military designs over plastic alternatives?

The CD54HCT157F3A uses a ceramic DIP (R-GDIP-T16) package that provides superior hermeticity and thermal stability compared to plastic DIPs, making it suitable for military and aerospace environments with extended temperature exposure. The 15-year YTEOL rating further supports long-lifecycle system designs common in defense electronics.

When is CD54HCT157F3A a better fit than a standard 74HCT157 for signal multiplexing?

The CD54HCT157F3A is preferred over the commercial 74HCT157 when ceramic package reliability, extended temperature range, and long component lifecycle (YTEOL 15 years) matter more than unit cost. Both parts provide identical quad 2-to-1 mux function with 8 inputs and 50 pF load capacitance, but the CD54 series ceramic package supports harsh-environment applications where plastic package outgassing or moisture ingress would degrade reliability.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

AvailabilityIn Stock
Reference Price (USD)
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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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