CD54HC373F3A Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
CD54HC373F3A is an 8-channel transparent D-type latch with 3-state outputs from Texas Instruments, housed in a 20-pin ceramic DIP package. It operates across the HC/UH family supply range of 2 V to 6 V, handles up to 50 pF load capacitance, and provides 7.8 mA output sink current. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- CD54HC373F3A Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of CD54HC373F3A?
- 8-channel transparent D-type latch with active-low output enable for bidirectional bus interfacing
- 3-state outputs supporting multi-device bus sharing with up to 50 pF load capacitance per channel
- Ceramic DIP-20 package rated for extended temperature range, ideal for high-reliability and military applications
What is CD54HC373F3A used for?
CD54HC373F3A is designed for data bus buffering and address latching in microprocessor and microcontroller systems where 8-bit parallel data must be held stable during bus multiplexing cycles. Its 3-state outputs and 2 V to 6 V supply range make it compatible with both TTL and CMOS logic families, while the ceramic DIP-20 package suits industrial control boards, military avionics, and radiation-tolerant embedded designs requiring long operational lifetimes.
What are the specifications of CD54HC373F3A?
| Pbfree Code | Yes |
| YTEOL | 15 |
| Control Type | ENABLE LOW/HIGH |
| Count Direction | UNIDIRECTIONAL |
| Family | HC/UH |
| JESD-30 Code | R-GDIP-T20 |
| JESD-609 Code | e0 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | BUS DRIVER |
| Max I(ol) | 0.0078A |
| Number of Bits | 8 |
| Number of Functions | 8 |
| Number of Ports | 2 |
| Output Characteristics | 3-STATE |
| Output Polarity | TRUE |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP20,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Power Supply Current-Max (ICC) | 0.16mA |
| Prop. Delay@Nom-Sup | 45ns |
| Propagation Delay (tpd) | 265ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 6V |
| Supply Voltage-Min (Vsup) | 2V |
| Supply Voltage-Nom (Vsup) | 4.5V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
Where can I find the CD54HC373F3A datasheet?
CD54HC373F3A Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for CD54HC373F3A?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What output drive capability does CD54HC373F3A provide for bus loading on a 3.3 V backplane?
CD54HC373F3A sinks up to 7.8 mA per output and sources up to 7.8 mA, and tolerates up to 50 pF load capacitance per channel. On a 3.3 V backplane this comfortably drives up to 10 HC-family inputs in parallel, making it suitable for 8-bit address latch applications in embedded computing systems.
How does the transparent latch mode of CD54HC373F3A differ from a registered flip-flop in address demultiplexing circuits?
In transparent mode, when the latch enable is high, data flows straight through to the 8 outputs in under 20 ns propagation delay. When enable goes low, the last state is captured and held, which allows a microprocessor to demultiplex a shared address/data bus without requiring a clock signal, saving 1-2 extra components compared to a registered edge-triggered solution.
When is CD54HC373F3A a better fit than plastic-packaged SOIC alternatives for harsh environments?
The ceramic DIP-20 hermetic package of CD54HC373F3A offers moisture resistance and junction temperatures up to 125°C, making it the preferred choice over plastic SOIC parts in military avionics, oil-field instrumentation, and space-qualified designs where MIL-STD-883 or equivalent reliability screening at -55°C to 125°C is required.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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