CD54HC237F Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
The CD54HC237F is a CMOS 3-to-8 line decoder and demultiplexer with integrated address latches and 3 enable inputs, housed in a 16-pin ceramic DIP package for high-reliability applications. It drives 50 pF loads and is available from distributors worldwide with fast shipping.
- Manufacturer
- Texas Instruments
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- CD54HC237F Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of CD54HC237F?
- 3-to-8 line decoder with integrated address latches for registering input states without external flip-flops
- 3 enable inputs including active-low and active-high controls for flexible cascading and bus expansion
- Ceramic DIP-16 package offers superior reliability and moisture resistance for military and high-reliability applications
What is CD54HC237F used for?
The CD54HC237F is used in address decoding and memory expansion circuits where latched address inputs simplify the interface between multiplexed address buses and peripheral devices. Its 3-to-8 decoder function enables selection of 1 of 8 output lines from a 3-bit binary address, making it useful in chip-select generation for memory banks and I/O expansion in embedded systems. The ceramic DIP package suits high-reliability designs in aerospace, military, and industrial applications that require long-term performance under thermal and humidity stress.
What are the specifications of CD54HC237F?
| Pbfree Code | Yes |
| YTEOL | 15 |
| Additional Feature | ADDRESS LATCHES; 3 ENABLE INPUTS |
| Family | HC/UH |
| Input Conditioning | LATCHED |
| JESD-30 Code | R-GDIP-T16 |
| JESD-609 Code | e0 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | 3-LINE TO 8-LINE DECODER |
| Max I(ol) | 0.0052A |
| Number of Bits | 8 |
| Number of Functions | 1 |
| Output Polarity | TRUE |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP16,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Power Supply Current-Max (ICC) | 0.16mA |
| Prop. Delay@Nom-Sup | 36ns |
| Propagation Delay (tpd) | 240ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 6V |
| Supply Voltage-Min (Vsup) | 2V |
| Supply Voltage-Nom (Vsup) | 4.5V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
Where can I find the CD54HC237F datasheet?
CD54HC237F Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for CD54HC237F?
Compatible alternatives and drop-in replacements for CD54HC237F:
Frequently Asked Questions
How does the address latch in CD54HC237F simplify interfacing with multiplexed address buses?
The CD54HC237F integrates address latches that capture and hold the 3-bit binary input address on the latch enable signal, allowing the decoder to maintain a stable output selection even after the address bus changes. This eliminates the need for external 3-bit D-type latches, reducing component count and PCB area in multiplexed bus designs driving up to 8 chip-select outputs.
What is the output drive capability of CD54HC237F and how does it limit fan-out?
Each output of the CD54HC237F can sink up to 5.2 mA and drive load capacitances up to 50 pF. This moderate drive level is suited for driving CMOS logic inputs but may limit fan-out when connecting directly to multiple high-capacitance inputs or long PCB traces without buffer stages in large memory expansion designs.
Why would an engineer choose CD54HC237F over a plastic DIP equivalent for a defense application?
The CD54HC237F is packaged in a 16-pin ceramic DIP, which provides better moisture resistance and thermal stability than plastic equivalents. Ceramic packages are specified for military-grade and aerospace applications that require operation over extended temperature ranges and long storage life, making CD54HC237F the preferred choice over commercial-grade plastic PDIP variants in high-reliability programs.
How can multiple CD54HC237F devices be cascaded to decode a wider address space?
Multiple CD54HC237F units can be cascaded using their 3 enable inputs (active-low G1, G2A and active-high G2B) to build 4-to-16 or larger decoders. A higher-order address bit enables one chip at a time, so 2 CD54HC237F devices together decode a 4-bit address into 16 output lines, covering 16 chip-select outputs for memory or I/O expansion.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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