CD54HC139F Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
Texas Instruments CD54HC139F is a dual 2-to-4 line decoder and demultiplexer in the HC/UH CMOS logic family. It operates with a 50 pF load capacitance and provides 5.2 mA maximum sink current per output across industrial temperature ranges. Housed in a 16-pin ceramic DIP package for high-reliability military and industrial applications.
- Manufacturer
- Texas Instruments
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- CD54HC139F Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of CD54HC139F?
- Dual independent 2-to-4 decoder channels enabling two simultaneous address decode operations in one 16-pin package
- HC CMOS technology providing low quiescent current and compatibility with both TTL and CMOS logic levels
- 16-pin ceramic DIP package offering superior hermetic sealing for military and high-reliability industrial environments
- Active-low enable inputs allowing easy cascading to build larger 3-to-8 or 4-to-16 decoder networks
- 50 pF load capacitance rating supporting standard bus speeds in backplane and board-level address decoding
What is CD54HC139F used for?
The CD54HC139F is commonly used in memory address decoding, chip-select generation for multi-device bus architectures, and data demultiplexing in industrial control and military-grade electronics. Its dual 2-to-4 structure allows a single IC to independently decode two separate address lines, reducing component count in space-constrained backplane designs. The ceramic DIP package ensures reliable operation in harsh environments with wide temperature swings and high vibration.
What are the specifications of CD54HC139F?
| Pbfree Code | Yes |
| YTEOL | 15 |
| Family | HC/UH |
| Input Conditioning | STANDARD |
| JESD-30 Code | R-GDIP-T16 |
| JESD-609 Code | e0 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | 2-LINE TO 4-LINE DECODER |
| Max I(ol) | 0.0052A |
| Number of Bits | 4 |
| Number of Functions | 2 |
| Output Polarity | INVERTED |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP16,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Power Supply Current-Max (ICC) | 0.16mA |
| Prop. Delay@Nom-Sup | 36ns |
| Propagation Delay (tpd) | 220ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 6V |
| Supply Voltage-Min (Vsup) | 2V |
| Supply Voltage-Nom (Vsup) | 4.5V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
Where can I find the CD54HC139F datasheet?
CD54HC139F Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for CD54HC139F?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the CD54HC139F dual 2-to-4 structure simplify address decoding in embedded memory systems?
The CD54HC139F contains 2 independent 2-to-4 decoders in a single 16-pin package, each capable of selecting 1 of 4 outputs from 2 address inputs. This eliminates the need for two separate ICs when decoding two memory banks simultaneously, reducing board area and component count by up to 50% in systems with multiple 4-chip memory arrays.
What makes the ceramic DIP package of CD54HC139F preferred over plastic PDIP in military designs?
The ceramic DIP (CDIP) package provides hermetic sealing, tolerating humidity levels beyond 85% RH and temperature cycling from -55 °C to +125 °C without moisture ingress. Military and aerospace standards such as MIL-STD-883 require this level of environmental protection, which plastic DIP packages cannot guarantee over 10+ year service lifetimes in avionics and defense ground systems.
Can the CD54HC139F be cascaded to build a larger 3-to-8 decoder, and how is it done?
Yes, two CD54HC139F devices can implement a 3-to-8 decoder by using the third address bit to drive the active-low enable pins of each section. When the third bit is low, one 2-to-4 decoder is enabled and selects among 4 outputs; when high, the other decoder activates its 4 outputs—producing 8 uniquely selected lines from 3 inputs with only 1 additional IC.
What is the maximum output sink current of the CD54HC139F and how does it determine load compatibility?
The CD54HC139F specifies a maximum output sink current of 5.2 mA per output at the low logic level. This is sufficient to directly drive standard HC/TTL logic inputs and low-current LED indicators at 3 mA, but not adequate for high-current loads such as relays or motor drivers, which require buffer stages or transistor drivers.
In what procurement scenarios is the CD54HC139F sourced over its PDIP or SMD variants?
The CD54HC139F in ceramic DIP is specifically sourced for mil-spec board replacements, legacy defense system repairs, and high-reliability industrial controllers where the original PCB design mandates a 16-pin through-hole ceramic package. Commercial plastic DIP or SOIC alternatives are acceptable for new designs, but field service and MIL-STD qualified builds require the CDIP form factor and qualification grade of the CD54HC139F.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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