CD54ACT174F3A Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
Texas Instruments CD54ACT174F3A is a hex D-type flip-flop with 6 positive-edge-triggered bits, clocked at up to 80 MHz on a 5 V supply with TTL-compatible ACT logic levels. Packaged in a 16-pin ceramic DIP for high-reliability applications, it features synchronous clear and bus-interface drive capability. Available through authorized distributors with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- CD54ACT174F3A Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of CD54ACT174F3A?
- 6-bit hex D-type flip-flop with positive-edge clock triggering operating at up to 80 MHz for high-speed synchronous data storage and bus-interface applications
- ACT logic family with TTL-compatible 5 V input thresholds and CMOS output swing enabling direct interfacing between legacy TTL and CMOS logic families
- 16-pin ceramic DIP (CDIP) packaging providing enhanced reliability for military, aerospace, and harsh-environment applications requiring operation from -55°C to +125°C
- 24 mA output sink current (IOL) supporting direct driving of bus lines with 50 pF load capacitance without external buffering in multi-device digital systems
What is CD54ACT174F3A used for?
The CD54ACT174F3A is designed for synchronous data latching and bus interface applications in military electronics, aerospace systems, and industrial control equipment where the ceramic DIP package provides reliability at junction temperatures from -55°C to +125°C. It is widely used in address latching, data buffering, and pipeline register stages in embedded processor systems and FPGA-to-bus interface boards requiring ACT-family TTL-compatible logic levels. The 6-bit parallel flip-flop architecture also suits frequency division, shift register chains, and synchronous state machine designs in ruggedized communication and signal processing hardware.
What are the specifications of CD54ACT174F3A?
| Pbfree Code | Yes |
| YTEOL | 15 |
| Family | ACT |
| JESD-30 Code | R-GDIP-T16 |
| JESD-609 Code | e0 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | D FLIP-FLOP |
| Max Frequency@Nom-Sup | 80000000Hz |
| Max I(ol) | 0.024A |
| Number of Bits | 6 |
| Number of Functions | 6 |
| Output Polarity | TRUE |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP16,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Power Supply Current-Max (ICC) | 0.16mA |
| Prop. Delay@Nom-Sup | 14ns |
| Propagation Delay (tpd) | 14ns |
| Qualification Status | Not Qualified |
| Screening Level | 38535Q/M;38534H;883B |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 4.5V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Trigger Type | POSITIVE EDGE |
| fmax-Min | 85MHz |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
Where can I find the CD54ACT174F3A datasheet?
CD54ACT174F3A Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for CD54ACT174F3A?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the maximum clock frequency of the CD54ACT174F3A and what logic family does it belong to?
The CD54ACT174F3A operates at a maximum clock frequency of 80 MHz with a 5 V supply and 50 pF load capacitance. It belongs to the ACT (Advanced CMOS TTL-compatible) logic family, which accepts TTL input voltage levels (VIL max 0.8 V, VIH min 2.0 V) while providing CMOS rail-to-rail output swing, enabling direct interfacing between TTL and CMOS subsystems in legacy and mixed-logic designs.
Why is the ceramic DIP package of the CD54ACT174F3A preferred in military and aerospace designs?
The 16-pin ceramic DIP (CDIP) package of the CD54ACT174F3A provides hermetic sealing that protects the die from moisture and contamination, enabling reliable operation from -55°C to +125°C across thousands of thermal cycles. Ceramic packages meet MIL-PRF-38535 qualification requirements for military and aerospace applications where plastic packages would absorb moisture and fail under thermal shock conditions encountered in avionics and satellite electronics.
How many flip-flop bits does the CD54ACT174F3A contain and how are they synchronized?
The CD54ACT174F3A contains 6 D-type flip-flop bits all sharing a common positive-edge-triggered clock input, allowing all 6 bits to be captured simultaneously on each rising clock edge. A shared active-low synchronous clear resets all 6 outputs to logic 0 on the next rising clock edge, enabling deterministic initialization of 6-bit data buses, address registers, or pipeline stages in digital systems clocked up to 80 MHz.
When would you select CD54ACT174F3A over a plastic-package 74ACT174 alternative?
The CD54ACT174F3A is selected over plastic-package 74ACT174 alternatives when the application demands extended temperature operation beyond the commercial 0°C to +70°C range or the industrial -40°C to +85°C range. The ceramic hermetic package supports -55°C to +125°C junction temperature, making it the required choice for military-spec (MIL-STD-810) environments, downhole oil drilling electronics, satellite equipment, and other extreme-temperature applications where plastic package moisture ingress would cause catastrophic field failures.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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