CD54AC283F3A Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
The CD54AC283F3A is a 4-bit binary full adder from Texas Instruments with internal carry lookahead logic. It operates in the AC CMOS family with 50 pF load capacitance and 75 mA output drive in a 16-pin ceramic DIP package. Available worldwide for high-speed arithmetic and digital computing designs.
- Manufacturer
- Texas Instruments
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- CD54AC283F3A Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of CD54AC283F3A?
- 4-bit binary full adder with internal carry lookahead for accelerated arithmetic operations
- AC CMOS technology offering high-speed switching with low static power consumption
- Ceramic DIP-16 package providing robust mechanical and thermal stability for harsh environments
- 75 mA output sink current drive supporting TTL and CMOS load compatibility
- Wide supply voltage range compatible with 2 V to 6 V CMOS logic systems
What is CD54AC283F3A used for?
The CD54AC283F3A is used in arithmetic logic units, binary counters, and address computation circuits requiring fast 4-bit addition with carry propagation. Its internal carry lookahead reduces latency in cascaded multi-bit adder chains used in digital signal processors and custom logic controllers. The ceramic 16-pin DIP package makes it suitable for military, aerospace, and high-reliability industrial applications demanding thermal robustness and long operational lifetime.
What are the specifications of CD54AC283F3A?
| Pbfree Code | Yes |
| YTEOL | 15 |
| Additional Feature | FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD |
| Family | AC |
| JESD-30 Code | R-GDIP-T16 |
| JESD-609 Code | e0 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | ADDER/SUBTRACTOR |
| Max I(ol) | 0.075A |
| Number of Bits | 4 |
| Number of Functions | 1 |
| Output Polarity | TRUE |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP16,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Power Supply Current-Max (ICC) | 0.08mA |
| Prop. Delay@Nom-Sup | 16ns |
| Propagation Delay (tpd) | 228ns |
| Qualification Status | Not Qualified |
| Screening Level | 38535Q/M;38534H;883B |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 1.5V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
Where can I find the CD54AC283F3A datasheet?
CD54AC283F3A Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for CD54AC283F3A?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the internal carry lookahead in CD54AC283F3A improve addition speed compared to ripple-carry adders?
The CD54AC283F3A generates carry signals in parallel rather than waiting for each bit to propagate sequentially. This reduces worst-case propagation delay significantly when cascading multiple 4-bit stages, enabling faster clock rates in 8-bit and 16-bit arithmetic circuits compared to ripple-carry designs with cumulative 4 ns-per-stage delays.
What output drive current can CD54AC283F3A deliver and which logic families can it interface with?
CD54AC283F3A delivers up to 75 mA output sink current (I_OL), allowing it to drive TTL and CMOS loads directly. Its AC CMOS family supply range of 2 V to 6 V covers both 3.3 V and 5 V logic systems, enabling interfacing with standard 74AC, 74HC, and TTL-compatible devices without level-shifting buffers.
For which environmental conditions is the ceramic DIP-16 package of CD54AC283F3A best suited?
The ceramic DIP-16 package withstands operating temperatures from -55°C to +125°C, making CD54AC283F3A suitable for military-grade, aerospace, and industrial harsh-environment applications. Ceramic sealing provides better moisture resistance and hermeticity compared to plastic DIP packages, extending device reliability in temperature-cycling and high-humidity field deployments.
Can CD54AC283F3A be cascaded to build a wider 8-bit or 16-bit adder and how is carry connected?
Yes, two CD54AC283F3A devices cascade to form an 8-bit adder by connecting the carry-out (C4) of the lower 4-bit stage to the carry-in (C0) of the upper stage. Each device handles 4 bits with 50 pF load capacitance, and the internal carry lookahead in each IC limits carry propagation to within the stage, minimizing total addition latency.
How does CD54AC283F3A compare to the SN74AC283 for procurement in reliability-critical programs?
CD54AC283F3A is the ceramic mil-temp version (-55°C to +125°C) while SN74AC283 uses a plastic package rated to +85°C. For defense or aerospace programs requiring MIL-spec screening or hermetic sealing, CD54AC283F3A is the preferred choice despite higher unit cost, as its 16-pin ceramic DIP package meets stricter reliability standards over a 125°C thermal range.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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