CD4073BF Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
The CD4073BF is a triple 3-input AND gate from Texas Instruments in the CMOS 4000 series. It features three independent AND gates with 3 inputs each, a maximum output low current of 6.8mA, and is housed in a rugged 14-Pin Ceramic DIP package. Available from stock worldwide with fast shipping for reliable logic design applications.
- Manufacturer
- Texas Instruments
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 14
- Lifecycle
- ACTIVE
- Datasheet
- CD4073BF Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Triple 3-input AND gate in one package reduces component count and board space
- CMOS 4000 series technology enables wide operating voltage range for versatile designs
- Ceramic DIP package provides superior temperature and humidity resistance for harsh environments
- 50pF load capacitance rating ensures stable operation across high-capacitance PCB layouts
Applications
The CD4073BF is used in digital logic systems requiring multiple independent AND gate functions, such as control signal conditioning and combinational logic circuits. Its CMOS technology and wide voltage compatibility make it suitable for military, aerospace, and industrial applications where ceramic packaging and long-term reliability are critical. It is also commonly used in legacy system maintenance and replacements where ceramic DIP components are required.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| Family | 4000/14000/40000 |
| JESD-30 Code | R-GDIP-T14 |
| JESD-609 Code | e0 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | AND GATE |
| Max I(ol) | 0.0068A |
| Number of Functions | 3 |
| Number of Inputs | 3 |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP14,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Power Supply Current-Max (ICC) | 0.03mA |
| Prop. Delay@Nom-Sup | 250ns |
| Propagation Delay (tpd) | 250ns |
| Qualification Status | Not Qualified |
| Schmitt Trigger | NO |
| Supply Voltage-Max (Vsup) | 18V |
| Supply Voltage-Min (Vsup) | 3V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many AND gates does the CD4073BF contain?
The CD4073BF contains three independent 3-input AND gates in a single 14-Pin package, allowing designers to implement multiple AND logic functions without requiring additional ICs, saving board space and cost.
What package type is the CD4073BF available in?
The CD4073BF is housed in a 14-Pin Ceramic DIP (CDIP) package with JESD-30 code R-GDIP-T14. The ceramic package provides excellent resistance to moisture and temperature extremes compared to plastic PDIP alternatives.
What is the maximum output low current of the CD4073BF?
The CD4073BF has a maximum output low current (I_OL) of 6.8mA, sufficient to drive standard CMOS and TTL logic gate inputs directly in typical digital logic applications.
Is the CD4073BF suitable for military or aerospace applications?
Yes, the CD4073BF's ceramic DIP package makes it well-suited for military, aerospace, and industrial applications where reliability under extreme temperature, vibration, and humidity conditions is required. Always verify specific screening requirements with the manufacturer.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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