CD4069UBPWE4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
CD4069UBPWE4 is a Texas Instruments integrated circuit for embedded, industrial, and mixed-signal electronic designs. It provides Small Outline Packages details for compact PCB layouts and purchasing checks. From RFQ pricing, it supports in-stock sourcing and.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 14
- Lifecycle
- OBSOLETE
- Datasheet
- CD4069UBPWE4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of CD4069UBPWE4?
- 1 channel integrated circuit from Texas Instruments for production sourcing
- Small Outline Packages format supports footprint, assembly, and second-source checks
- Orderable MPN structure helps compare mounting, tolerance, package, or suffix variants
- RFQ workflow supports stock validation, lot traceability, and worldwide shipping review
What is CD4069UBPWE4 used for?
CD4069UBPWE4 is commonly selected for embedded, industrial, and mixed-signal electronic designs where a catalog configuration must match the approved bill of materials. Buyers use it for prototype builds, maintenance replenishment, and production sourcing when datasheet fit, lifecycle risk, and shipping timing need to be checked together.
What are the specifications of CD4069UBPWE4?
| YTEOL | 0 |
| Family | 4000/14000/40000 |
| JESD-30 Code | R-PDSO-G14 |
| JESD-609 Code | e4 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | INVERTER |
| Number of Functions | 6 |
| Number of Inputs | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP14,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Prop. Delay@Nom-Sup | 110ns |
| Propagation Delay (tpd) | 110ns |
| Qualification Status | Not Qualified |
| Schmitt Trigger | NO |
| Supply Voltage-Max (Vsup) | 18V |
| Supply Voltage-Min (Vsup) | 3V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| ## CD4069UBPWE4 Alternates Showing results | Image |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.60 |
Where can I find the CD4069UBPWE4 datasheet?
CD4069UBPWE4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for CD4069UBPWE4?
Compatible alternatives and drop-in replacements for CD4069UBPWE4:
suggested
suggested
suggested
Frequently Asked Questions
Which design situations fit CD4069UBPWE4 when 1 channel is required?
CD4069UBPWE4 fits embedded, industrial, and mixed-signal electronic designs that need 1 channel, Small Outline Packages. Engineers should confirm the datasheet limits, footprint, and mating or surrounding components before releasing a production BOM.
How should purchasing compare CD4069UBPWE4 with nearby Texas Instruments variants?
Compare CD4069UBPWE4 by electrical rating, package option, lifecycle status, and ordering suffix. Keeping the same 1 channel configuration usually reduces redesign risk while alternates are checked for availability.
What assembly or sourcing details matter before quoting CD4069UBPWE4?
Before quoting CD4069UBPWE4, verify the Small Outline Packages format, approved manufacturer name, and required certificates. The 1 channel detail should align with incoming inspection, production scheduling, and worldwide shipping plans.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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