CD4050BD Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
The CD4050BD is a CMOS hex non-inverting buffer/converter supporting 6 independent buffer channels with 50 pF load capacitance. It operates with 18 mA output current and is available in SO-16 package from stock worldwide.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 16
- Lifecycle
- OBSOLETE
- Datasheet
- CD4050BD Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 6 independent non-inverting buffer channels in a single package for signal isolation and level shifting
- 18 mA output drive current (I_ol) enabling direct interface with TTL and CMOS logic families
- 50 pF load capacitance rating supporting high-speed signal buffering in 4000-series CMOS applications
Applications
The CD4050BD is widely used in digital logic designs requiring signal buffering between CMOS and TTL devices, including microcontroller I/O expansion and bus line driving. It is also applied in level shifting circuits where interfacing between different voltage logic families is needed. Additional applications include clock buffering, signal isolation in control systems, and driving capacitive loads in industrial automation equipment.
Specifications
| YTEOL | 0 |
| Family | 4000/14000/40000 |
| JESD-30 Code | R-PDSO-G16 |
| JESD-609 Code | e4 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | BUFFER |
| Max I(ol) | 0.018A |
| Number of Functions | 6 |
| Number of Inputs | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP16,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supply Current-Max (ICC) | 0.12mA |
| Prop. Delay@Nom-Sup | 140ns |
| Propagation Delay (tpd) | 140ns |
| Qualification Status | Not Qualified |
| Schmitt Trigger | NO |
| Supply Voltage-Max (Vsup) | 18V |
| Supply Voltage-Min (Vsup) | 3V |
| Supply Voltage-Nom (Vsup) | 10V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| ## CD4050BD Alternates Showing results | Image |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
| Country of Origin | Mexico |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for CD4050BD:
Frequently Asked Questions
How much output current can the CD4050BD source or sink per channel?
Each of the 6 buffer channels in the CD4050BD can sink up to 18 mA (I_ol = 0.018 A), making it suitable for driving TTL inputs and moderately capacitive loads without additional driver stages.
Can the CD4050BD interface CMOS logic outputs to TTL inputs in a 5 V system?
Yes, the CD4050BD is specifically designed for CMOS-to-TTL level shifting. Its 18 mA sink current meets TTL input current requirements, and operating at 5 V ensures output high and low levels are within standard TTL thresholds for reliable interfacing.
What is the maximum load capacitance the CD4050BD can drive reliably?
The CD4050BD is rated for a 50 pF load capacitance per channel, which accommodates typical PCB trace capacitance and TTL or CMOS gate inputs. For higher capacitance loads exceeding 50 pF, propagation delay increases and additional buffering may be required.
Which package is the CD4050BD available in and what are its pin count dimensions?
The CD4050BD comes in a 16-pin Small Outline Package (SO-16 / SOIC-16) with standard 1.27 mm pitch, offering a compact footprint of approximately 10 mm x 4 mm, suitable for space-constrained PCB layouts in industrial and consumer electronics designs.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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