CC2650F128RSM Texas Instruments Integrated Circuit (Quad Flat No-Lead) In Stock
CC2650F128RSM is a SimpleLink multistandard wireless MCU by Texas Instruments supporting Bluetooth LE, ZigBee, and 6LoWPAN in a 32-pin QFN package. Key specs: 128KB Flash, 16-bit core, 10 I/O lines, integrated ADC and DMA. Available in stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Quad Flat No-Lead
- Pin Count
- 33
- Lifecycle
- OBSOLETE
- Datasheet
- CC2650F128RSM Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of CC2650F128RSM?
- SimpleLink multistandard radio supports Bluetooth Low Energy, ZigBee, and IEEE 802.15.4 in a single 32-pin QFN chip
- 128KB Flash with dedicated sensor controller enabling ultra-low-power autonomous sensor sampling without waking the main ARM Cortex-M3 core
- Integrated ADC, DMA, and PWM channels provide complete mixed-signal I/O for wireless sensor node designs in a compact 5mm x 5mm QFN package
What is CC2650F128RSM used for?
The CC2650F128RSM is targeted at ultra-low-power wireless sensor nodes, smart home accessories, and industrial IoT edge devices that require multi-protocol wireless connectivity in a small form factor. Its dedicated sensor controller allows background sensor polling without activating the main processor, dramatically reducing average current consumption in duty-cycled applications such as wearable health monitors and asset trackers. The 32-pin QFN package and multistandard radio make it an efficient single-chip solution for Bluetooth LE beacons, ZigBee mesh network nodes, and Thread/6LoWPAN connected devices.
What are the specifications of CC2650F128RSM?
| YTEOL | 0 |
| Has ADC | YES |
| Bit Size | 16 |
| DAC Channels | NO |
| DMA Channels | YES |
| JESD-30 Code | S-PQCC-N32 |
| Number of I/O Lines | 10 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| ROM Programmability | FLASH |
| Speed | 48MHz |
| Supply Voltage-Max | 3.8V |
| Supply Voltage-Min | 1.8V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.4mm |
| Terminal Position | QUAD |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.31.00.20 |
Where can I find the CC2650F128RSM datasheet?
CC2650F128RSM Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for CC2650F128RSM?
Compatible alternatives and drop-in replacements for CC2650F128RSM:
Frequently Asked Questions
Which wireless protocols does CC2650F128RSM support and how does multi-protocol operation work in practice?
The CC2650F128RSM supports Bluetooth Low Energy 4.2, ZigBee (IEEE 802.15.4), 6LoWPAN/Thread, and proprietary sub-1 GHz protocols via software-defined radio. Multi-protocol operation runs time-sliced, where the RF core switches between protocol stacks without hardware changes. In practice, Bluetooth LE advertising and ZigBee data transmission can coexist in the same application by scheduling RF activity in alternating time slots, enabling a single device to serve both a smartphone app (BLE) and a ZigBee mesh network simultaneously.
For a battery-powered IoT sensor, how does the CC2650F128RSM's sensor controller reduce power consumption?
The CC2650F128RSM includes a dedicated Sensor Controller Engine — a separate ultra-low-power 16-bit processor that can sample ADC inputs, read I2C/SPI sensors, and buffer data while the main ARM Cortex-M3 core remains in deep sleep at under 1 µA. The sensor controller consumes only 4 µA to 8 µA during active sampling, versus 2 mA to 5 mA for the main CPU. This duty-cycled architecture extends coin-cell battery life from weeks (always-on CPU) to years in applications measuring temperature or humidity every few seconds.
How does the 32-pin QFN package of CC2650F128RSM constrain GPIO availability and PCB layout?
The CC2650F128RSM's 32-pin QFN (5mm x 5mm body) provides 10 GPIO I/O lines, which is sufficient for simple sensor interfaces (I2C, SPI, UART, and a few discrete controls) but limits complex multi-peripheral designs. PCB layout requires a ground paddle exposed pad under the package for thermal and RF ground plane integrity, soldered with a solid via-stitched copper pour. Antenna placement is critical — the RF output pin must route to a matching network and antenna within 10mm with a clear ground plane, following TI's CC2650 reference design PCB guidelines to achieve the specified -90 dBm sensitivity.
When is CC2650F128RSM a more cost-effective alternative to CC2640R2F for Bluetooth LE designs?
The CC2650F128RSM is preferred over CC2640R2F when multi-protocol operation (ZigBee + BLE) or IEEE 802.15.4 support is required in addition to Bluetooth LE, since CC2640R2F supports only Bluetooth LE and proprietary 2.4 GHz. For pure BLE-only applications, CC2640R2F may cost less and offers a newer Bluetooth 5 stack. If the design needs both a smartphone BLE interface and a ZigBee mesh connection to an existing 802.15.4 network, CC2650F128RSM eliminates the need for a second radio chip, saving at least one IC, its matching network, and associated antenna cost.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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