CC2640F128RGZRIn StockTexas Instruments
CC2640F128RGZR is a Texas Instruments SimpleLink Bluetooth Low Energy wireless MCU with 128KB flash, ARM Cortex-M3 core, and ultra-low power consumption. Ideal for IoT, wearables, and smart home applications. From $2.17 in stock worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Quad Flat No-Lead
- Pin Count
- 49
- Lifecycle
- ACTIVE
- Datasheet
- CC2640F128RGZR Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $2.1684(MOQ 1)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- ARM Cortex-M3 core running at up to 48 MHz for efficient wireless processing
- Bluetooth Low Energy (BLE) 4.2 compliant radio with -97 dBm sensitivity
- 128KB in-system programmable flash with 20KB SRAM
- Ultra-low power: 2.9 mA RX current, 9.1 mA TX at 0 dBm
- 48-pin QFN package (RGZ) with integrated DC-DC converter
- Supports over-the-air (OTA) firmware updates
Applications
The CC2640F128RGZR is widely used in IoT sensor nodes, wearable fitness trackers, and smart home devices requiring Bluetooth Low Energy connectivity. Its ultra-low power architecture makes it ideal for battery-operated products such as health monitors, proximity beacons, and remote controls. It is also deployed in industrial wireless sensor networks and asset tracking applications where long battery life and reliable 2.4 GHz RF performance are critical.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| JESD-30 Code | S-PQCC-N48 |
| JESD-609 Code | e4 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Nom | 3V |
| Surface Mount | YES |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| ## CC2640F128RGZR Alternates Showing results | Image |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.50 |
| Country of Origin | Philippines |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for CC2640F128RGZR:
Frequently Asked Questions
What is the core architecture and clock speed of the CC2640F128RGZR?
The CC2640F128RGZR integrates an ARM Cortex-M3 processor running at up to 48 MHz, paired with 128KB flash memory and 20KB SRAM. It also includes a dedicated sensor controller with an ultra-low power ARM Cortex-M0 core for autonomous peripheral data collection without waking the main CPU.
What wireless standard does the CC2640F128RGZR support?
The CC2640F128RGZR supports Bluetooth Low Energy (BLE) 4.2 with a 2.4 GHz RF transceiver. It achieves a receive sensitivity of -97 dBm and a transmit current of 9.1 mA at 0 dBm output power, making it suitable for robust short-range wireless communication in consumer and industrial applications.
What are typical applications for the CC2640F128RGZR?
Typical applications include wearable health monitors, smart home automation devices, Bluetooth beacons, remote controls, IoT sensor nodes, and battery-powered industrial wireless sensors. Its ultra-low power sleep current (1 µA in standby) makes it especially suitable for coin-cell or small battery-powered products requiring years of operation.
What package type and supply voltage does the CC2640F128RGZR use?
The CC2640F128RGZR comes in a 48-pin Very Thin Quad Flat No-Lead (VQFN/RGZ) package measuring 7×7 mm. It operates from a supply voltage of 1.8 V to 3.8 V (nominal 3 V), and includes an on-chip DC-DC converter to extend battery life in single-cell applications.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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