C3225X7S1H106K250ABAlternatives & Equivalent Parts
About C3225X7S1H106K250AB
C3225X7S1H106K250AB is a Capacitor component manufactured by TDK. It comes in a Capacitor Chip Non-polarised package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | C3225X7S1H106K250ABSource | 744316560 | GRM219R61C226ME15L | SMA6J5.0CA-TR | MC0603B104K500CT |
|---|---|---|---|---|---|
| Manufacturer | TDK | Würth Elektronik | Murata Electronics | STMicroelectronics | MULTICOMP |
| Package Type | Capacitor Chip Non-polarised | Inductor Moulded | Capacitor Chip Non-polarised | Diodes Moulded Non Polarised | Capacitor Chip Non-polarised |
| Pin Count | 2 | 2 | 2 | 2 | 2 |
| Temperature Range | -55.0°C ~ 125.0°C | -40.0°C ~ 150.0°C | -55.0°C ~ 85.0°C | -55.0°C ~ 175.0°C | -55.0°C ~ 125.0°C |
| Price | $0.2730 | $1.4800 | $0.0700 | $0.1989 | $0.0020 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | NOT RECOMMENDED | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| Electrical Parameters | |||||
| Pbfree Code | Yes | — | — | — | — |
| Reach Compliance Code | Compliant | — | Compliant | — | Unknown |
| Factory Lead Time | 24 Weeks | — | — | 13 Weeks | — |
| YTEOL | 3 | 15 | 7 | 7.2 | 7 |
| Capacitance | 10 µF | — | 22 µF | — | 0.1 µF |
| Capacitor Type | CERAMIC CAPACITOR | — | CERAMIC CAPACITOR | — | CERAMIC CAPACITOR |
| Dielectric Material | CERAMIC | — | CERAMIC | — | CERAMIC |
| Height | 2.5 mm | — | 0.85 mm | — | 0.8 mm |
| JESD-609 Code | e3 | e1 | e3 | e3 | e3 |
| Mounting Feature | SURFACE MOUNT | — | SURFACE MOUNT | — | SURFACE MOUNT |
| Multilayer | Yes | — | YES | — | Yes |
| Negative Tolerance | 10% | — | 20% | — | 10% |
| Package Shape | RECTANGULAR PACKAGE | — | RECTANGULAR PACKAGE | RECTANGULAR | — |
| Package Style | SMT | SMT | SMT | SMALL OUTLINE | SMT |
| Packing Method | TR, 7 Inch | TR, EMBOSSED PLASTIC, 13 INCH | 180mm Reel W8P4 | — | TR |
| Positive Tolerance | 10% | — | 20% | — | 10% |
| Rated (DC) Voltage (URdc) | 50 V | — | 16 V | — | 50 V |
| Size Code | 1210 | — | 2012M/0805 | — | 0603 |
| Surface Mount | YES | YES | YES | YES | YES |
| Temperature Characteristics Code | X7S | — | X5R | — | X7R |
| Temperature Coefficient | 22% ppm/°C | — | 15% ppm/°C | — | 15% ppm/°C |
| Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) - with Nickel (Ni) barrier | Matte Tin (Sn) - annealed | Tin (Sn) - with Nickel (Ni) barrier |
| Terminal Shape | WRAPAROUND | WRAPAROUND | WRAPAROUND | — | WRAPAROUND |
| Case/Size Code | — | 2221 | — | — | — |
| Construction | — | Rectangular | — | — | — |
| DC Resistance | — | 0.0285 Ω | — | — | — |
| Inductance-Nom (L) | — | 5.6 µH | — | — | — |
| Inductor Application | — | HIGH CURRENT INDUCTOR | — | — | — |
| Inductor Type | — | GENERAL PURPOSE INDUCTOR | — | — | — |
| Number of Functions | — | 1 | — | — | — |
| Package Height | — | 4 mm | — | — | — |
| Package Length | — | 5.5 mm | — | — | — |
| Package Width | — | 5.3 mm | — | — | — |
| Rated Current-Max | — | 5.5 A | — | — | — |
| Reference Standard | — | AEC-Q200 | — | IEC-61000-4-2, 4-4, 4-5; MIL-STD-750 | — |
| Self Resonance Frequency | — | 48 MHz | — | — | — |
| Shape/Size Description | — | RECTANGULAR PACKAGE | — | — | — |
| Shielded | — | YES | — | — | — |
| Special Feature | — | DC RESISTANCE IS MEASURED AT: 10% | — | — | — |
| Terminal Placement | — | DUAL ENDED | — | — | — |
| Test Frequency | — | 0.1 MHz | — | — | — |
| Tolerance | — | 20% | — | — | — |
| Breakdown Voltage-Max | — | — | — | 7.07 V | — |
| Breakdown Voltage-Min | — | — | — | 6.4 V | — |
| Breakdown Voltage-Nom | — | — | — | 6.7 V | — |
| Clamping Voltage-Max | — | — | — | 9.1 V | — |
| Configuration | — | — | — | SINGLE, 1 CHANNEL | — |
| Diode Element Material | — | — | — | SILICON | — |
| Diode Type | — | — | — | TRANS VOLTAGE SUPPRESSOR DIODE | — |
| JEDEC-95 Code | — | — | — | DO-214AC | — |
| JESD-30 Code | — | — | — | R-PDSO-C2 | — |
| Non-rep Peak Rev Power Dis-Max | — | — | — | 600 W | — |
| Number of Elements | — | — | — | 1 | — |
| Package Body Material | — | — | — | PLASTIC/EPOXY | — |
| Peak Reflow Temperature (Cel) | — | — | — | 260 | — |
| Polarity | — | — | — | BIDIRECTIONAL | — |
| Power Dissipation-Max | — | — | — | 4 W | — |
| Qualification Status | — | — | — | Not Qualified | — |
| Rep Pk Reverse Voltage-Max | — | — | — | 5 V | — |
| Reverse Current-Max | — | — | — | 20 µA | — |
| Reverse Test Voltage | — | — | — | 5 V | — |
| Technology | — | — | — | AVALANCHE | — |
| Terminal Form | — | — | — | C BEND | — |
| Terminal Position | — | — | — | DUAL | — |
| Time@Peak Reflow Temperature-Max (s) | — | — | — | 10 | — |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
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Get one quote covering all 4 alternatives for C3225X7S1H106K250AB — response within 24 hours.
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Why Look for Alternatives?
Finding alternatives for C3225X7S1H106K250AB is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating C3225X7S1H106K250AB replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to C3225X7S1H106K250AB?
Known equivalents for C3225X7S1H106K250AB include 744316560, GRM219R61C226ME15L, SMA6J5.0CA-TR. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of C3225X7S1H106K250AB?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify C3225X7S1H106K250AB alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.