BS62LV4006EIP55 BSI (BRILLIANCE SEMICONDUCTOR) Integrated Circuit (Small Outline Packages) In Stock

Name: BS62LV4006EIP55
Brand: BSI (BRILLIANCE SEMICONDUCTOR)
SKU: BS62LV4006EIP55
Availability: InStock

BSI (BRILLIANCE SEMICONDUCTOR) - BS62LV4006EIP55 - SRAM, 4 Mbit, 512K x 8bit, 2.4V to 5.5V, TSOP-II, 32 Pins, 55 ns

OBSOLETEIntegrated CircuitVerified Jul 2026

Package / Visual Reference

BS62LV4006EIP55Small Outline Packages

Quick Facts

Manufacturer: BSI (BRILLIANCE SEMICONDUCTOR)
Package: Small Outline Packages
Pin Count: 32
Lifecycle: OBSOLETE
Datasheet: BS62LV4006EIP55 Datasheet PDF
Category: Integrated Circuit
Temp Range: -40.0°C to 85.0°C
RoHS: Compliant
Lead Time: 3–7 business days
Shipping: DHL Express · Worldwide

What are the key features of BS62LV4006EIP55?

Integrated Circuit from BSI (BRILLIANCE SEMICONDUCTOR) identified by manufacturer part number BS62LV4006EIP55
Documented technical context includes 4 Mb for engineering comparison
Package or mechanical reference recorded as Small Outline Packages for footprint checks
Suitable for BOM sourcing, alternate review, repair stocking, and production procurement workflows
Datasheet-backed context should be matched against voltage, current, timing, package, and lifecycle requirements before approval

What is BS62LV4006EIP55 used for?

BS62LV4006EIP55 is typically sourced for embedded electronics, industrial controls, communications equipment, and production BOM maintenance where buyers need a manufacturer-traceable integrated circuit with verifiable datasheet context. It is suitable for engineering replacement reviews, prototype builds, and production purchasing workflows that must confirm package fit, lifecycle risk, and key ratings such as 4 Mb.

What are the specifications of BS62LV4006EIP55?

YTEOL	0
Access Time-Max	55ns
I/O Type	COMMON
JESD-30 Code	R-PDSO-G32
Memory Density	4194304bit
Memory IC Type	STANDARD SRAM
Memory Width	8
Number of Functions	1
Number of Words	524288words
Number of Words Code	512000
Operating Mode	ASYNCHRONOUS
Organization	512KX8
Output Characteristics	3-STATE
Package Body Material	PLASTIC/EPOXY
Package Equivalence Code	TSOP32,.46
Package Shape	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Cel)	260
Qualification Status	Not Qualified
Standby Current-Max	0.0000013A
Standby Voltage-Min	1.5V
Supply Current-Max	0.07mA
Supply Voltage-Max (Vsup)	5.5V
Supply Voltage-Min (Vsup)	3V
Supply Voltage-Nom (Vsup)	5V
Surface Mount	YES
Technology	CMOS
Temperature Grade	INDUSTRIAL
Terminal Form	GULL WING
Terminal Pitch	1.27mm
Terminal Position	DUAL
Package	Small Outline Packages

Compliance & Regulatory

RoHS Status	Compliant
Lead-Free	Yes (Pb-Free)
Moisture Sensitivity Level	MSL 3
ECCN	3A991.b.2.a
HTS Code	8542.32.00.41

Where can I find the BS62LV4006EIP55 datasheet?

BS62LV4006EIP55 Datasheet Download

Official datasheet from BSI (BRILLIANCE SEMICONDUCTOR)

What are equivalent replacements for BS62LV4006EIP55?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

Which design checks should buyers confirm before selecting BS62LV4006EIP55?

Buyers should verify the integrated circuit role, package fit, lifecycle status, and datasheet ratings before approving this part. The fetched technical context includes 4 Mb, which should be matched against the target circuit and sourcing documentation.

How does the recorded package information affect sourcing BS62LV4006EIP55?

The recorded package reference is Small Outline Packages, so purchasers should confirm footprint compatibility, assembly handling, and approved manufacturer documentation. Include 4 Mb in the engineering review so procurement does not substitute a part with mismatched limits.

When comparing alternates for BS62LV4006EIP55, which parameters matter most?

Start with manufacturer, component category, package style, lifecycle status, and the electrical or mechanical ratings shown in the datasheet. Because the available context includes 4 Mb, any alternate should match that requirement before release.

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