BQ27520YZFT-G3 Texas Instruments Integrated Circuit (BGA) In Stock
BQ27520YZFT-G3 is a integrated circuit by Texas Instruments for production BOM and repair sourcing. Key specs: 15 pins, -40°C to 85°C, 4.5 V, 4.5 V. From quote-based pricing, in stock with worldwide shipping support.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 15
- Lifecycle
- OBSOLETE
- Datasheet
- BQ27520YZFT-G3 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of BQ27520YZFT-G3?
- BQ27520YZFT-G3 Integrated Circuit listing from Texas Instruments for exact BOM matching
- 15 pins configuration helps engineers compare fit, footprint, and sourcing risk
- datasheet-backed BGA details support RFQ review and production purchasing
- inquiry_only sourcing workflow supports worldwide shipping, date-code checks, and alternate review
What is BQ27520YZFT-G3 used for?
BQ27520YZFT-G3 is used in integrated circuit sourcing for production builds, repair programs, and prototype assemblies where 15 pins or matching package details matter. Buyers commonly review it for BOM alternates, lifecycle checks, and worldwide RFQ fulfillment tied to Texas Instruments traceability.
What are the specifications of BQ27520YZFT-G3?
| YTEOL | 0 |
| Adjustable Threshold | YES |
| Analog IC - Other Type | BATTERY GAUGE |
| JESD-30 Code | R-PBGA-B15 |
| JESD-609 Code | e1 |
| Number of Channels | 1 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA15,3X5,20 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 4.5V |
| Supply Voltage-Min (Vsup) | 2.7V |
| Supply Voltage-Nom (Vsup) | 3.6V |
| Surface Mount | YES |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Where can I find the BQ27520YZFT-G3 datasheet?
BQ27520YZFT-G3 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for BQ27520YZFT-G3?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which designs are a good fit for BQ27520YZFT-G3 when 15 pins matters?
BQ27520YZFT-G3 fits integrated circuit designs where 15 pins and BGA packaging align with the board or module requirement. Buyers should confirm footprint, mating parts, and lifecycle status before release.
How should procurement compare BQ27520YZFT-G3 with nearby Texas Instruments alternatives?
Compare BQ27520YZFT-G3 against alternatives by manufacturer, package, lifecycle status, and -40°C to 85°C. Matching these details reduces substitution risk when a purchase request covers a production BOM.
Which sourcing checks are useful before requesting BQ27520YZFT-G3 for a build?
Confirm the orderable MPN, inquiry_only status, datasheet availability, and 15 pins. For scheduled builds, request an RFQ with quantity targets, date-code needs, and worldwide shipping terms.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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