BMIS-210-F Laird Technologies Undefined or Miscellaneous (Other) In Stock
Laird Technologies BMIS-210-F is an EMI shielding frame gasket measuring 1.732 × 1.201 inches for board-level RF shielding enclosures. Provides reliable EMI containment with a snap-on design for easy PCB assembly. From $1.50 in stock worldwide shipping.
- Manufacturer
- Laird Technologies
- Package
- Other
- Pin Count
- 28
- Lifecycle
- ACTIVE
- Datasheet
- BMIS-210-F Datasheet PDF
- Category
- Undefined or Miscellaneous
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of BMIS-210-F?
- Board-level EMI shielding frame with 1.732 × 1.201 inch aperture dimensions
- Snap-on frame design for tool-free installation and removal during PCB rework
- Designed for use with compatible BMIS-series shield lids for complete RF enclosure
- Provides broad-spectrum EMI attenuation for sensitive RF and mixed-signal PCB sections
- Compatible with standard SMT reflow soldering for high-volume PCB assembly
What is BMIS-210-F used for?
The BMIS-210-F is used in RF and wireless PCB module shielding applications to attenuate radiated EMI from noisy digital and power circuits. Its 1.732 × 1.201 inch frame is compatible with standard board-level shield lid systems in Wi-Fi, Bluetooth, and cellular module designs. The snap-on frame simplifies field rework and in-circuit testing access while maintaining shielding integrity during normal operation.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the BMIS-210-F datasheet?
BMIS-210-F Datasheet DownloadOfficial datasheet from Laird Technologies
What are equivalent replacements for BMIS-210-F?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are the aperture dimensions of the BMIS-210-F shielding frame?
The BMIS-210-F EMI shielding frame covers an aperture of 1.732 inches × 1.201 inches (approximately 44 mm × 30.5 mm). This size accommodates standard RF module footprints used in Wi-Fi and Bluetooth PCB designs requiring board-level EMI containment.
How does the BMIS-210-F snap-on design simplify PCB rework compared to soldered cans?
Unlike solid soldered shielding cans, the BMIS-210-F snap-on frame allows the shield lid to be removed and replaced without desoldering, enabling in-circuit testing and component rework. The frame remains soldered to the PCB pads while the lid snaps on and off, reducing rework time significantly.
In which wireless communication applications is the BMIS-210-F most commonly deployed?
The BMIS-210-F is primarily used to shield 2.4 GHz and 5 GHz Wi-Fi modules, Bluetooth radios, and cellular modem PCBs from radiated EMI. Its 44 mm × 30.5 mm frame size matches many standard wireless module layouts, providing effective isolation from adjacent switching regulators and digital circuits.
Is the BMIS-210-F compatible with automated SMT reflow assembly?
Yes. The BMIS-210-F frame is designed for SMT reflow soldering during standard PCB assembly, allowing it to be placed by automated pick-and-place equipment. After reflow, the compatible snap-on lid can be installed post-assembly, enabling 100% board-level testing access before final shielding closure.
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