BM63SPKA1MGA-0001AC Microchip Integrated Circuit (Other) In Stock
The BM63SPKA1MGA-0001AC is a Bluetooth 5.0 stereo audio SoC module from Microchip operating at 3.8V nominal supply, supporting up to 3000 Mbps data rate and designed for wireless audio streaming, voice control, and headset applications. It integrates a dual-mode Bluetooth radio, audio DSP, and codec in a compact 48-lead module package certified to TS 16949 automotive quality standards. Available from Microchip with worldwide shipping.
- Manufacturer
- Microchip
- Package
- Other
- Pin Count
- 48
- Lifecycle
- ACTIVE
- Datasheet
- BM63SPKA1MGA-0001AC Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -20.0°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Bluetooth 5.0 dual-mode radio with 3000 Mbps data rate for high-quality stereo audio streaming
- Integrated audio DSP and codec enable echo cancellation, noise suppression, and EQ without external processors
- 3.8V nominal supply compatible with single-cell Li-Ion battery-powered wireless audio products
- TS 16949 automotive screening level ensures reliability for in-vehicle hands-free and infotainment applications
- 48-lead module package integrates RF front-end, antenna, and baseband for fastest time-to-market
Applications
The BM63SPKA1MGA-0001AC is designed for Bluetooth stereo headsets, wireless earbuds, portable speakers, and hands-free car kits requiring Bluetooth 5.0 audio streaming with integrated DSP voice processing at a 3.8V Li-Ion supply. Its TS 16949 automotive certification makes it suitable for in-vehicle infotainment accessories and OBD Bluetooth adapters that must pass automotive quality requirements. Smart home speakers and voice-assistant-enabled wearables also benefit from its all-in-one module integration that minimizes RF design effort and reduces time to FCC/CE certification.
Specifications
| Pbfree Code | Yes |
| Data Rate | 3000Mbps |
| JESD-30 Code | R-XXMA-N48 |
| Number of Functions | 1 |
| Package Body Material | UNSPECIFIED |
| Package Equivalence Code | MODULE,48LEAD(UNSPEC) |
| Package Shape | RECTANGULAR |
| Package Style | MICROELECTRONIC ASSEMBLY |
| Screening Level | TS 16949 |
| Supply Voltage-Nom | 3.8V |
| Surface Mount | YES |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | COMMERCIAL |
| Terminal Form | NO LEAD |
| Terminal Pitch | 1.1mm |
| Terminal Position | UNSPECIFIED |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 5A992.C |
| HTS Code | 8529.90.22.00 |
| Country of Origin | Taiwan, Thailand |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for BM63SPKA1MGA-0001AC:
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Frequently Asked Questions
What Bluetooth version and data rate does the BM63SPKA1MGA-0001AC support for wireless audio streaming?
The BM63SPKA1MGA-0001AC implements Bluetooth 5.0 with a data rate up to 3000 Mbps at a 3.8V nominal supply, supporting A2DP stereo audio profiles for high-quality music streaming and HFP/HSP hands-free voice profiles. The Bluetooth 5.0 radio provides improved range and coexistence compared to Bluetooth 4.x in crowded 2.4 GHz environments typical of consumer electronics deployments.
How does the integrated audio DSP in the BM63SPKA1MGA-0001AC simplify headset hardware design?
The BM63SPKA1MGA-0001AC integrates an audio DSP capable of echo cancellation, noise suppression, and audio equalization directly on-module, eliminating the need for a separate audio codec IC or DSP processor in the headset BOM. This integration reduces the PCB component count by 5 to 10 parts, shrinks the analog audio signal path, and allows firmware-configurable audio tuning for different speaker and microphone transducers without hardware changes.
What makes the BM63SPKA1MGA-0001AC suitable for automotive Bluetooth applications?
The BM63SPKA1MGA-0001AC carries TS 16949 automotive quality system certification, indicating it is manufactured under automotive-grade process controls with traceability, PPAP documentation, and reliability testing appropriate for in-vehicle electronics. Combined with its 3.8V supply operation and 3000 Mbps Bluetooth 5.0 radio, it is well suited for hands-free calling modules, in-vehicle entertainment dongles, and OBD-II Bluetooth adapters that must survive automotive temperature extremes and EMC requirements.
What are the benefits of using the 48-lead module package of the BM63SPKA1MGA-0001AC versus a bare die Bluetooth SoC?
The 48-lead module package of the BM63SPKA1MGA-0001AC integrates the Bluetooth 5.0 RF front-end, antenna matching network, crystal oscillator, and baseband SoC in a single pre-certified assembly, reducing RF design expertise requirements and eliminating 20 to 30 passive components from the main PCB. This pre-integration typically shortens regulatory certification time by 4 to 8 weeks because the module's FCC/IC/CE radio approvals transfer to the end product, allowing designers to focus on application firmware rather than RF characterization.
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