BGM11S12F256GA-V2Alternatives & Equivalent Parts

About BGM11S12F256GA-V2

BGM11S12F256GA-V2 is a Integrated Circuit component manufactured by Silicon Labs. It comes in a Other package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

ParameterBGM11S12F256GA-V2SourceTPS61093QDSKRQ1BGM111A256V21RBT121-A-V2SPBTLE-1SBLUENRG-134
ManufacturerSilicon LabsTexas InstrumentsSilicon LabsSilicon LabsSTMicroelectronicsSTMicroelectronics
Package TypeOtherSmall Outline No-leadOtherOtherOtherBGA
Pin Count561131332334
Temperature Range—-40.0°C ~ 125.0°C——-40.0°C ~ 85.0°C-40.0°C ~ 105.0°C
Price$7.7700$2.1300$2.0110$22.1560$7.1992$1.2100
StockIn StockIn StockIn StockIn StockIn StockIn Stock
Lifecycle—ACTIVE——OBSOLETEACTIVE
Electrical Parameters
Pbfree Code—Yes————
YTEOL—15——08
Additional Feature—ADJUSTABLE OUTPUT UPTO 17V————
Analog IC - Other Type—SWITCHING REGULATOR————
Control Mode—CURRENT-MODE————
Control Technique—PULSE WIDTH MODULATION————
Input Voltage-Max—6 V————
Input Voltage-Min—1.6 V————
Input Voltage-Nom—3.6 V————
JESD-30 Code—S-PDSO-N10——R-XQMA-N23R-PBGA-B34
JESD-609 Code—e4————
Number of Functions—1——11
Number of Outputs—1————
Output Current-Max—1.6 A————
Output Voltage-Max—17 V————
Output Voltage-Min—1.7 V————
Package Body Material—PLASTIC/EPOXY——UNSPECIFIEDPLASTIC/EPOXY
Package Shape—SQUARE——RECTANGULARRECTANGULAR
Package Style—SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE——MICROELECTRONIC ASSEMBLYGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)—260———NOT SPECIFIED
Screening Level—AEC-Q100————
Surface Mount—YES——YESYES
Switcher Configuration—BOOST————
Switching Frequency-Max—1200 kHz————
Technology—BICMOS————
Temperature Grade—AUTOMOTIVE——INDUSTRIALINDUSTRIAL
Terminal Finish—Nickel/Palladium/Gold (Ni/Pd/Au)————
Terminal Form—NO LEAD——NO LEADBALL
Terminal Pitch—0.5 mm——1.27 mm0.4 mm
Terminal Position—DUAL——QUADBOTTOM
Time@Peak Reflow Temperature-Max (s)—30———NOT SPECIFIED
## TPS61093QDSKRQ1 Alternates Showing results—Image————
Supply Voltage-Nom————3.3 V3 V
Telecom IC Type————TELECOM CIRCUITTELECOM CIRCUIT
Manufacturer Package Code—————WLCSP MSL1
Factory Lead Time—————15 Weeks

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.

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Get one quote covering all 5 alternatives for BGM11S12F256GA-V2 — response within 24 hours.

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Why Look for Alternatives?

Finding alternatives for BGM11S12F256GA-V2 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.

When evaluating BGM11S12F256GA-V2 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.

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FAQ

What is equivalent to BGM11S12F256GA-V2?

Known equivalents for BGM11S12F256GA-V2 include TPS61093QDSKRQ1, BGM111A256V21R, BT121-A-V2. Contact FindMyChip for a full compatibility analysis for your specific application.

Can I use a different manufacturer's part instead of BGM11S12F256GA-V2?

In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.

How do I verify BGM11S12F256GA-V2 alternatives?

Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.