BGM1013 NXP Integrated Circuit (SOT23 (6-Pin)) In Stock
NXP BGM1013 is a low-noise MMIC amplifier delivering 24 dB gain across frequencies up to 3000 MHz in a compact 6-TSSOP surface mount package. It is matched to a 50 Ω system impedance with a maximum CW input power of -10 dBm for broadband RF amplification. Available worldwide at competitive prices with global stock and fast shipping.
- Manufacturer
- NXP
- Package
- SOT23 (6-Pin)
- Pin Count
- 6
- Lifecycle
- OBSOLETE
- Datasheet
- BGM1013 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 24 dB gain up to 3000 MHz enables broadband low-noise amplification in RF receiver front ends
- 50 Ω characteristic impedance simplifies system integration without requiring external matching networks
- Low-noise MMIC design minimizes signal degradation in sensitive RF receiver and signal conditioning chains
- Compact 6-TSSOP surface mount package enables space-efficient PCB layouts for high-frequency RF modules
Applications
The NXP BGM1013 MMIC amplifier is designed for RF receiver front-end amplification in wireless communication systems, including LTE, Wi-Fi, and short-range wireless applications operating up to 3000 MHz. Its 24 dB gain and 50 Ω matched input enable direct integration after an antenna or bandpass filter stage to boost weak signals before ADC or demodulator stages. The compact 6-TSSOP package suits RF module designs in consumer electronics, IoT gateways, and industrial wireless sensors requiring low-noise wideband amplification.
Specifications
| YTEOL | 0 |
| Additional Feature | LOW NOISE |
| Characteristic Impedance | 50Ω |
| Construction | COMPONENT |
| Gain | 24dB |
| Input Power-Max (CW) | -10 dBm |
| JESD-609 Code | e3 |
| Mounting Feature | SURFACE MOUNT |
| Number of Functions | 1 |
| Operating Frequency-Max | 3000MHz |
| Operating Frequency-Min | 100MHz |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP6,.08 |
| Power Supplies | 5V |
| RF/Microwave Device Type | WIDE BAND LOW POWER |
| Supply Current-Max | 33mA |
| Surface Mount | YES |
| Technology | BIPOLAR |
| Terminal Finish | Tin (Sn) |
| Package | SOT23 (6-Pin) |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the gain and maximum operating frequency of the NXP BGM1013 MMIC amplifier?
The NXP BGM1013 provides 24 dB of gain at frequencies up to 3000 MHz with a 50 Ω characteristic impedance, making it ideal for broadband RF amplification in wireless receiver front-end and signal chain applications.
How does the BGM1013 fit into an RF receiver chain given its CW input power specification?
The BGM1013 handles CW input power up to -10 dBm while delivering 24 dB gain, positioning it as a low-noise preamplifier stage between an antenna or filter output and mixer or ADC inputs in receiver chains operating up to 3000 MHz.
For which wireless frequency bands can the BGM1013 provide sufficient gain in a compact PCB footprint?
The BGM1013 operates across 0 to 3000 MHz, covering 2.4 GHz Wi-Fi, 900 MHz ISM band, LTE Sub-6 GHz, and Bluetooth, while its 6-TSSOP footprint occupies less than 10 mm² of PCB area, supporting compact multi-band RF module designs.
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About NXP
NXP is a leading electronic component manufacturer. FindMyChip sources NXP ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
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