BGM1013 NXP Integrated Circuit (SOT23 (6-Pin)) In Stock
NXP BGM1013 is a low-noise MMIC amplifier delivering 24 dB gain across frequencies up to 3000 MHz in a compact 6-TSSOP surface mount package. It is matched to a 50 Ω system impedance with a maximum CW input power of -10 dBm for broadband RF amplification. Available worldwide at competitive prices with global stock and fast shipping.
- Manufacturer
- NXP
- Package
- SOT23 (6-Pin)
- Pin Count
- 6
- Lifecycle
- OBSOLETE
- Datasheet
- BGM1013 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of BGM1013?
- 24 dB gain up to 3000 MHz enables broadband low-noise amplification in RF receiver front ends
- 50 Ω characteristic impedance simplifies system integration without requiring external matching networks
- Low-noise MMIC design minimizes signal degradation in sensitive RF receiver and signal conditioning chains
- Compact 6-TSSOP surface mount package enables space-efficient PCB layouts for high-frequency RF modules
What is BGM1013 used for?
The NXP BGM1013 MMIC amplifier is designed for RF receiver front-end amplification in wireless communication systems, including LTE, Wi-Fi, and short-range wireless applications operating up to 3000 MHz. Its 24 dB gain and 50 Ω matched input enable direct integration after an antenna or bandpass filter stage to boost weak signals before ADC or demodulator stages. The compact 6-TSSOP package suits RF module designs in consumer electronics, IoT gateways, and industrial wireless sensors requiring low-noise wideband amplification.
What are the specifications of BGM1013?
| YTEOL | 0 |
| Additional Feature | LOW NOISE |
| Characteristic Impedance | 50Ω |
| Construction | COMPONENT |
| Gain | 24dB |
| Input Power-Max (CW) | -10 dBm |
| JESD-609 Code | e3 |
| Mounting Feature | SURFACE MOUNT |
| Number of Functions | 1 |
| Operating Frequency-Max | 3000MHz |
| Operating Frequency-Min | 100MHz |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP6,.08 |
| Power Supplies | 5V |
| RF/Microwave Device Type | WIDE BAND LOW POWER |
| Supply Current-Max | 33mA |
| Surface Mount | YES |
| Technology | BIPOLAR |
| Terminal Finish | Tin (Sn) |
| Package | SOT23 (6-Pin) |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
What are equivalent replacements for BGM1013?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the gain and maximum operating frequency of the NXP BGM1013 MMIC amplifier?
The NXP BGM1013 provides 24 dB of gain at frequencies up to 3000 MHz with a 50 Ω characteristic impedance, making it ideal for broadband RF amplification in wireless receiver front-end and signal chain applications.
How does the BGM1013 fit into an RF receiver chain given its CW input power specification?
The BGM1013 handles CW input power up to -10 dBm while delivering 24 dB gain, positioning it as a low-noise preamplifier stage between an antenna or filter output and mixer or ADC inputs in receiver chains operating up to 3000 MHz.
For which wireless frequency bands can the BGM1013 provide sufficient gain in a compact PCB footprint?
The BGM1013 operates across 0 to 3000 MHz, covering 2.4 GHz Wi-Fi, 900 MHz ISM band, LTE Sub-6 GHz, and Bluetooth, while its 6-TSSOP footprint occupies less than 10 mm² of PCB area, supporting compact multi-band RF module designs.
Related Guides
CSD87313DMS Synchronous Buck Power Stage Design Guide
Design a compact CSD87313DMS synchronous buck stage with practical guidance for loss, gate drive, PCB layout, EMI, thermal validation, and sourcing.
Aug 6, 2026
STEF05SGR eFuse Selection Guide for 5 V Overcurrent Protection
Choose STEF05SGR for 5 V overcurrent protection by checking current-limit margin, inrush, thermal loss, fault response, and sourcing.
Aug 6, 2026
C0402C103K3RACTU Selection Guide: Choosing a 10 nF 0402 MLCC
Select C0402C103K3RACTU by voltage margin, X7R behavior, tolerance, 0402 assembly risk, and qualified alternatives.
Aug 4, 2026
STM32H753VIT6 MCU Selection Guide: Memory, Package, Connectivity, and Security
Choose STM32H753VIT6 by evaluating memory architecture, LQFP-100 pin fit, connectivity, security, power, and sourcing tradeoffs.
Aug 4, 2026
Why Buy from FindMyChip
About NXP
NXP is a leading electronic component manufacturer. FindMyChip sources NXP ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“The anti-counterfeit verification gave us confidence we'd never had with other China suppliers.”
You May Also Like
ACS770ECB-200U-PFF-T
Allegro Microsystems
Integrated Circuit
ACS770KCB-150U-PFF-T
Allegro Microsystems
Integrated Circuit
MC7808BDTRKG
ON Semiconductor
Integrated Circuit
PA94EC
Apex Microtechnology
Integrated Circuit
AP7315-28SR-7
Diodes Inc.
Integrated Circuit
74HCT245D
Nexperia
Integrated Circuit
CY62256VNLL-70ZXCT
Cypress Semiconductor
Integrated Circuit
EPM7032AETC44-4N
Intel
Integrated Circuit
EPM3512AQC208-10N
Intel
Integrated Circuit
EPM3256ATC144-7N
Intel
Integrated Circuit
EPM3256AQC208-7N
Intel
Integrated Circuit
EPM3256AQC208-10N
Intel
Integrated Circuit
EPM3128ATC100-7N
Intel
Integrated Circuit
EPM1270F256C4N
Intel
Integrated Circuit
EPF8282ATC100-4N
Intel
Integrated Circuit
EPF6016QC208-2N
Intel
Integrated Circuit
EPF6016ATC144-3N
Intel
Integrated Circuit
EPF10K30ATC144-3N
Intel
Integrated Circuit
EPC2TI32N
Intel
Integrated Circuit
EPC2LC20
Intel
Integrated Circuit
EP3SL150F1152C4N
Intel
Integrated Circuit
EP2SGX60DF780C5N
Intel
Integrated Circuit
EP2SGX60CF780C5N
Intel
Integrated Circuit
EP2SGX30DF780C3N
Intel
Integrated Circuit