BD237Alternatives & Equivalent Parts
About BD237
BD237 is a Transistor BJT NPN component manufactured by STMicroelectronics. It comes in a Transistor Outline, Vertical package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
Specification Comparison
| Parameter | BD237Source | TIP36C | M27C160-50F1 |
|---|---|---|---|
| Manufacturer | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package Type | Transistor Outline, Vertical | Transistor Outline, Vertical | Dual-In-Line Packages |
| Pin Count | 3 | 3 | 42 |
| Temperature Range | ~ 150.0°C | ~ 150.0°C | ~ 70.0°C |
| Price | $0.0480 | — | — |
| Electrical Parameters | |||
| Factory Lead Time | 14 Weeks | 14 Weeks | — |
| YTEOL | 9 | 9 | 0 |
| Case Connection | ISOLATED | — | — |
| Collector Current-Max (IC) | 2 A | 25 A | — |
| Collector-Emitter Voltage-Max | 80 V | 100 V | — |
| Configuration | SINGLE | SINGLE | — |
| DC Current Gain-Min (hFE) | 25 | 10 | — |
| JEDEC-95 Code | TO-126 | TO-218 | — |
| JESD-30 Code | R-PSFM-T3 | R-PSFM-T3 | R-CDIP-T42 |
| JESD-609 Code | e3 | e3 | e3 |
| Number of Elements | 1 | 1 | — |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| Package Shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package Style | FLANGE MOUNT | FLANGE MOUNT | IN-LINE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | NOT SPECIFIED | — |
| Polarity/Channel Type | NPN | PNP | — |
| Power Dissipation Ambient-Max | 25 W | 125 W | — |
| Power Dissipation-Max (Abs) | 25 W | 125 W | — |
| Qualification Status | Not Qualified | Not Qualified | Not Qualified |
| Surface Mount | NO | NO | NO |
| Terminal Finish | Matte Tin (Sn) | Matte Tin (Sn) | MATTE TIN |
| Terminal Form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal Position | SINGLE | SINGLE | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | NOT SPECIFIED | — |
| Transistor Application | SWITCHING | SWITCHING | — |
| Transistor Element Material | SILICON | SILICON | — |
| Transition Frequency-Nom (fT) | 3 MHz | 3 MHz | — |
| VCEsat-Max | 0.6 V | 4 V | — |
| ## BD237 Alternates Showing results | Image | — | — |
| ## TIP36C Alternates Showing results | — | Image | — |
| Access Time-Max | — | — | 50 ns |
| Alternate Memory Width | — | — | 8 |
| I/O Type | — | — | COMMON |
| Memory Density | — | — | 16777216 bit |
| Memory IC Type | — | — | UVPROM |
| Memory Width | — | — | 16 |
| Number of Functions | — | — | 1 |
| Number of Words | — | — | 1048576 words |
| Number of Words Code | — | — | 1000000 |
| Operating Mode | — | — | ASYNCHRONOUS |
| Organization | — | — | 1MX16 |
| Output Characteristics | — | — | 3-STATE |
| Package Equivalence Code | — | — | DIP42,.6 |
| Parallel/Serial | — | — | PARALLEL |
| Standby Current-Max | — | — | 0.0001 A |
| Supply Current-Max | — | — | 0.07 mA |
| Supply Voltage-Max (Vsup) | — | — | 5.5 V |
| Supply Voltage-Min (Vsup) | — | — | 4.5 V |
| Supply Voltage-Nom (Vsup) | — | — | 5 V |
| Technology | — | — | CMOS |
| Temperature Grade | — | — | COMMERCIAL |
| Terminal Pitch | — | — | 2.54 mm |
| ## M27C160-50F1 Alternates Showing results | — | — | Image |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
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Why Look for Alternatives?
Finding alternatives for BD237 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating BD237 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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Request Alternatives for BD237FAQ
What is equivalent to BD237?
Known equivalents for BD237 include TIP36C, M27C160-50F1. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of BD237?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify BD237 alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.