BBN6203BGNY30C Texas Instruments Integrated Circuit (BGA) In Stock
BBN6203BGNY30C is a 384 pins integrated circuit by Texas Instruments. Key specs: 384 pins, BGA package, IC DSP FIXED POINT 384CSP. From quote-based sourcing, in stock checks support worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 384
- Lifecycle
- OBSOLETE
- Datasheet
- BBN6203BGNY30C Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 90.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of BBN6203BGNY30C?
- 384 pins Integrated Circuit option from Texas Instruments
- BGA package supports production sourcing and assembly review
- API context notes IC DSP FIXED POINT 384CSP
- Suitable for industrial electronics, embedded systems, maintenance repairs, and production BOM sourcing
What is BBN6203BGNY30C used for?
BBN6203BGNY30C is used in industrial electronics, embedded systems, maintenance repairs, and production BOM sourcing where buyers need a sourced integrated circuit from Texas Instruments. It is suited for production BOM review, repair sourcing, and engineering validation when 384 pins and package compatibility are confirmed.
What are the specifications of BBN6203BGNY30C?
| YTEOL | 0 |
| Address Bus Width | 20 |
| Barrel Shifter | NO |
| Bit Size | 32 |
| Boundary Scan | YES |
| Clock Frequency-Max | 50MHz |
| External Data Bus Width | 32 |
| Format | FIXED POINT |
| Internal Bus Architecture | MULTIPLE |
| JESD-30 Code | S-PBGA-B384 |
| JESD-609 Code | e0 |
| Low Power Mode | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, FINE PITCH |
| Peak Reflow Temperature (Cel) | 220 |
| Supply Voltage-Max | 1.57V |
| Supply Voltage-Min | 1.43V |
| Supply Voltage-Nom | 1.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Finish | TIN LEAD |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 4 |
| ECCN | 3A991.a.2 |
| HTS Code | 8542.31.00.35 |
| Country of Origin | Philippines |
Where can I find the BBN6203BGNY30C datasheet?
BBN6203BGNY30C Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for BBN6203BGNY30C?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How should engineers size memory interfaces around BBN6203BGNY30C?
The context lists a 20-bit address bus, 32-bit external data bus, and 50 MHz maximum clock frequency, which suits fixed-point DSP interface planning.
Which package and verification details matter for BBN6203BGNY30C sourcing?
The part is described as a BGA integrated circuit with 384 pins, JESD-30 code S-PBGA-B384, and boundary scan support for board-level verification.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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