BAS16XV2T1GAlternatives & Equivalent Parts

About BAS16XV2T1G

BAS16XV2T1G is a Diode component manufactured by ON Semiconductor. It comes in a Small Outline Diode Flat Lead package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

ParameterBAS16XV2T1GSourceKSZ9031RNXVB-VAOTCM811TERCTR502790-4091TXS02612RTWR750311692MSP430FR59941IRGZR
ManufacturerON SemiconductorMicrochipMicrochipMolexTexas InstrumentsWürth ElektronikTexas Instruments
Package TypeSmall Outline Diode Flat LeadQuad Flat No-LeadOtherOtherQuad Flat No-LeadOtherQuad Flat No-Lead
Pin Count24844224849
Temperature Range-55.0°C ~ 150.0°C-40.0°C ~ 105.0°C-40.0°C ~ 85.0°C-20.0°C ~ 85.0°C-40.0°C ~ 85.0°C-40.0°C ~ 125.0°C-40.0°C ~ 85.0°C
Price$0.0150$5.7500$0.3750$1.0001$0.3900$2.9341$5.3440
StockIn StockIn StockIn StockIn StockIn StockIn StockIn Stock
LifecycleACTIVEACTIVEOBSOLETENOT RECOMMENDEDACTIVEACTIVEACTIVE
Electrical Parameters
Pbfree CodeYesYesYesYes
Manufacturer Package Code502VQFN-48
YTEOL6.11803151515
ApplicationGENERAL PURPOSE
Breakdown Voltage-Min100 V
ConfigurationSINGLE
Diode Element MaterialSILICON
Diode TypeRECTIFIER DIODE
Forward Voltage-Max (VF)1.25 V
JESD-30 CodeR-PDSO-F2S-XQCC-N48R-PDSO-G4S-PQCC-N24S-PQCC-N48
JESD-609 Codee3e3e3e4e4e4
Non-rep Pk Forward Current-Max1 A
Number of Elements1
Number of Phases1
Output Current-Max0.2 A
Package Body MaterialPLASTIC/EPOXYUNSPECIFIEDPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXY
Package ShapeRECTANGULARSQUARERECTANGULARSQUARESQUARE
Package StyleSMALL OUTLINECHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILESMALL OUTLINE, LOW PROFILECHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILECHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)260260260260
Power Dissipation-Max0.2 W
Qualification StatusNot QualifiedNot QualifiedNot Qualified
Rep Pk Reverse Voltage-Max100 V
Reverse Current-Max1 µA
Reverse Recovery Time-Max0.006 µs
Reverse Test Voltage100 V
Surface MountYESYESYESYESYESYES
Terminal FinishMatte Tin (Sn) - annealedMatte Tin (Sn)MATTE TINNickel/Palladium/Gold (Ni/Pd/Au)Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal FormFLATNO LEADGULL WINGNO LEADNO LEAD
Terminal PositionDUALQUADDUALQUADQUAD
Time@Peak Reflow Temperature-Max (s)303030
Factory Lead Time7 Weeks22 Weeks
Date Of Intro2017-05-262017-01-13
Data Rate1000000 Mbps
Number of Functions11
Number of Transceivers1
Package Equivalence CodeLCC48,.27SQ,20TO-253LCC24,.16SQ,20
Screening LevelAEC-Q100
Supply Voltage-Nom1.2 V1.2 V3 V
Telecom IC TypeETHERNET TRANSCEIVER
Temperature GradeINDUSTRIALINDUSTRIALINDUSTRIALINDUSTRIAL
Terminal Pitch0.5 mm1.92 mm0.508 mm0.5 mm0.5 mm
## KSZ9031RNXVB-VAO Alternates Showing resultsImage
Adjustable ThresholdNO
Analog IC - Other TypeVOLTAGE SUPERVISOR/RESET IC
Number of Channels1
Supply Current-Max (Isup)0.01 mA
Supply Voltage-Max (Vsup)5.5 V
Supply Voltage-Min (Vsup)1 V
Supply Voltage-Nom (Vsup)3.3 V
TechnologyCMOSCMOSCMOS
Threshold Voltage-Nom+3.08V
## TCM811TERCTR Alternates Showing resultsImage
Reach Compliance CodeCompliant
Board Mounting OptionFITTING NAIL
Body Breadth0.098 inch
Body Depth0.154 inch
Body Length0.972 inch
Connector TypeFFC/FPC CONNECTOR
Contact Finish MatingNOT SPECIFIED
Contact Finish TerminationGold (Au)
Contact MaterialNOT SPECIFIED
Contact PatternRECTANGULAR
Contact Resistance40 mΩ
Contact StyleBELLOWED TYPE
Dielectric Withstanding Voltage125VAC V
Filter FeatureNO
Insertion Force-MaxZIF N
Insulation Resistance50000000 Ω
Insulator ColorBEIGE
Insulator MaterialGLASS FILLED LIQUID CRYSTAL POLYMER
Mating Contact Pitch0.020 inch
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleRIGHT ANGLE
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows1
Number of Rows Loaded1
PCB Contact PatternRECTANGULAR
Plating Thickness2u inch
Rated Current (Signal)0.5 A
Reference StandardUL
Termination TypeSURFACE MOUNT
Total Number of Contacts40
Withdrawl Force-MinZIF N
CPU FamilyTXSMSP430
Clock Frequency-Max60 MHz24 MHz
Number of I/O Lines1568
Number of Ports2
Supply Current-Max0.036 mA
Supply Voltage-Max3.6 V3.6 V
Supply Voltage-Min1.1 V3 V
uPs/uCs/Peripheral ICs TypePARALLEL IO PORT, GENERAL PURPOSEMICROCONTROLLER, RISC
Additional FeatureLENGTH DIM INCLUDES TERMINALS ALSO
Height10.54 mm
Input Voltage-Max15 V
Input Voltage-Min8 V
Mounting FeatureSURFACE MOUNT
Number of Primary Winding1
Number of Secondary Winding2
Output Voltage 1150 V
Output Voltage 2-150 V
Packing MethodTR, EMBOSSED PLASTIC, 13 INCH
Primary Inductance80 µH
Transformer TypeSMPS TRANSFORMER
Has ADCYES
Bit Size16
Boundary ScanYES
DAC ChannelsNO
DMA ChannelsYES
On Chip Data RAM Width8
On Chip Program ROM Width8
PWM ChannelsYES
RAM (bytes)8192
ROM (words)262144
ROM ProgrammabilityFRAM
Speed16 MHz

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.

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Get one quote covering all 6 alternatives for BAS16XV2T1G — response within 24 hours.

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Why Look for Alternatives?

Finding alternatives for BAS16XV2T1G is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.

When evaluating BAS16XV2T1G replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.

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FAQ

What is equivalent to BAS16XV2T1G?

Known equivalents for BAS16XV2T1G include KSZ9031RNXVB-VAO, TCM811TERCTR, 502790-4091. Contact FindMyChip for a full compatibility analysis for your specific application.

Can I use a different manufacturer's part instead of BAS16XV2T1G?

In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.

How do I verify BAS16XV2T1G alternatives?

Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.