B57332V5103F360Alternatives & Equivalent Parts
About B57332V5103F360
B57332V5103F360 is a Thermistor component manufactured by EPCOS. It comes in a Thermistors Chip package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | B57332V5103F360Source | TPS92662-Q1 | MM3Z3V9T1G |
|---|---|---|---|
| Manufacturer | EPCOS | Texas Instruments | ON Semiconductor |
| Package Type | Thermistors Chip | Quad Flat Packages | Small Outline Diode |
| Pin Count | 2 | 49 | 2 |
| Temperature Range | -40.0°C ~ 150.0°C | — | -65.0°C ~ 150.0°C |
| Price | $0.0534 | — | $0.0138 |
| Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | ACTIVE |
| Electrical Parameters | |||
| Reach Compliance Code | Compliant | — | — |
| YTEOL | 8.8 | — | 6.95 |
| Mounting Feature | SURFACE MOUNT | — | — |
| Package Height | 0.9 mm | — | — |
| Package Length | 1.6 mm | — | — |
| Package Shape | RECTANGULAR PACKAGE | — | RECTANGULAR |
| Package Style | SMT | — | SMALL OUTLINE |
| Package Width | 0.8 mm | — | — |
| Packing Method | TR, CARDBOARD, 7 INCH | — | — |
| Rated Power Dissipation (P) | 0.18 W | — | — |
| Rated Temperature | 25 °C | — | — |
| Reference Standard | AEC-Q200; UL | — | — |
| Resistance | 10000 Ω | — | — |
| Resistor Type | NTC THERMISTOR | — | — |
| Surface Mount | YES | — | YES |
| Terminal Placement | DUAL ENDED | — | — |
| Terminal Shape | WRAPAROUND | — | — |
| Thermal Sensitivity Index | 3455 K | — | — |
| Thermistor Application | TEMPERATURE COMPENSATION | — | — |
| Tolerance | 1% | — | — |
| Pbfree Code | — | — | Yes |
| Manufacturer Package Code | — | — | 477-02 |
| Factory Lead Time | — | — | 9 Weeks |
| Configuration | — | — | SINGLE |
| Diode Element Material | — | — | SILICON |
| Diode Type | — | — | ZENER DIODE |
| Dynamic Impedance-Max | — | — | 90 Ω |
| Forward Voltage-Max (VF) | — | — | 0.9 V |
| JESD-30 Code | — | — | R-PDSO-G2 |
| JESD-609 Code | — | — | e3 |
| Knee Impedance-Max | — | — | 1000 Ω |
| Number of Elements | — | — | 1 |
| Package Body Material | — | — | PLASTIC/EPOXY |
| Peak Reflow Temperature (Cel) | — | — | 260 |
| Polarity | — | — | UNIDIRECTIONAL |
| Power Dissipation-Max | — | — | 0.3 W |
| Qualification Status | — | — | Not Qualified |
| Reference Voltage-Nom | — | — | 3.9 V |
| Reverse Current-Max | — | — | 3 µA |
| Reverse Test Voltage | — | — | 1 V |
| Technology | — | — | ZENER |
| Terminal Finish | — | — | Matte Tin (Sn) - annealed |
| Terminal Form | — | — | GULL WING |
| Terminal Position | — | — | DUAL |
| Time@Peak Reflow Temperature-Max (s) | — | — | 30 |
| Voltage Tol-Max | — | — | 5.13% |
| Working Test Current | — | — | 5 mA |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 2 alternatives for B57332V5103F360 — response within 24 hours.
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Why Look for Alternatives?
Finding alternatives for B57332V5103F360 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating B57332V5103F360 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to B57332V5103F360?
Known equivalents for B57332V5103F360 include TPS92662-Q1, MM3Z3V9T1G. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of B57332V5103F360?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify B57332V5103F360 alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.