B3B-EH-A(LF)(SN)Alternatives & Equivalent Parts
About B3B-EH-A(LF)(SN)
B3B-EH-A(LF)(SN) is a Connector component manufactured by JST (JAPAN SOLDERLESS TERMINALS). It comes in a Other package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | B3B-EH-A(LF)(SN)Source | PIC16F84-10I/P | ZXMN6A11GTA | BZT52C4V7-7-F |
|---|---|---|---|---|
| Manufacturer | JST (JAPAN SOLDERLESS TERMINALS) | Microchip | Diodes Inc. | Diodes Inc. |
| Package Type | Other | Dual-In-Line Packages | SOT223 (3-Pin) | Small Outline Diode |
| Pin Count | 3 | 18 | 4 | 2 |
| Temperature Range | — | -40.0°C ~ 85.0°C | -55.0°C ~ 150.0°C | -65.0°C ~ 150.0°C |
| Price | $0.0425 | $6.5100 | $0.2842 | $0.0160 |
| Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | NOT RECOMMENDED | ACTIVE | ACTIVE |
| Electrical Parameters | ||||
| Pbfree Code | Yes | Yes | No | Yes |
| YTEOL | 8 | 3 | 5 | 7 |
| Additional Feature | POLARIZED, TOP ENTRY, SHROUDED | — | — | HIGH RELIABILITY |
| Body Breadth | 0.15 inch | — | — | — |
| Body Depth | 0.236 inch | — | — | — |
| Body Length | 0.394 inch | — | — | — |
| Connector Type | BOARD CONNECTOR | — | — | — |
| Contact Finish Mating | TIN OVER COPPER | — | — | — |
| Contact Finish Termination | Tin/Copper (Sn/Cu) | — | — | — |
| Contact Gender | MALE | — | — | — |
| Contact Material | BRASS | — | — | — |
| Contact Pattern | RECTANGULAR | — | — | — |
| Contact Style | SQ PIN-SKT | — | — | — |
| DIN Conformance | NO | — | — | — |
| Filter Feature | NO | — | — | — |
| IEC Conformance | NO | — | — | — |
| Insulator Material | POLYAMIDE66 | — | — | — |
| JESD-609 Code | e2 | e3 | e3 | e3 |
| MIL Conformance | NO | — | — | — |
| Mating Contact Pitch | 0.098 inch | — | — | — |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE | — | — | — |
| Mixed Contacts | NO | — | — | — |
| Mounting Style | STRAIGHT | — | — | — |
| Mounting Type | BOARD | — | — | — |
| Number Of Connectors | ONE | — | — | — |
| Number Of PCB Rows | 1 | — | — | — |
| Number of Rows Loaded | 1 | — | — | — |
| Option | GENERAL PURPOSE | — | — | — |
| Terminal Pitch | 2.5 mm | 2.54 mm | — | — |
| Termination Type | SOLDER | — | — | — |
| Total Number of Contacts | 3 | — | — | — |
| UL Flammability Code | 94V-0 | — | — | — |
| Manufacturer Package Code | — | PDIP-18 | — | — |
| Factory Lead Time | — | 6 Weeks | 12 Weeks | 12 Weeks |
| Date Of Intro | — | 1990-01-01 | — | — |
| Has ADC | — | NO | — | — |
| Bit Size | — | 8 | — | — |
| Boundary Scan | — | NO | — | — |
| CPU Family | — | PIC16 | — | — |
| Clock Frequency-Max | — | 10 MHz | — | — |
| DAC Channels | — | NO | — | — |
| DMA Channels | — | NO | — | — |
| Format | — | FIXED POINT | — | — |
| Integrated Cache | — | NO | — | — |
| JESD-30 Code | — | R-PDIP-T18 | R-PDSO-G4 | R-PDSO-G2 |
| Low Power Mode | — | YES | — | — |
| Number of External Interrupts | — | 1 | — | — |
| Number of I/O Lines | — | 13 | — | — |
| Number of Timers | — | 3 | — | — |
| On Chip Data RAM Width | — | 8 | — | — |
| On Chip Program ROM Width | — | 14 | — | — |
| PWM Channels | — | NO | — | — |
| Package Body Material | — | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Equivalence Code | — | DIP18,.3 | — | — |
| Package Shape | — | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package Style | — | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | — | 260 | 260 | 260 |
| Qualification Status | — | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | — | 68 | — | — |
| ROM (words) | — | 1024 | — | — |
| ROM Programmability | — | FLASH | — | — |
| Screening Level | — | TS-16949 | — | — |
| Speed | — | 10 MHz | — | — |
| Supply Current-Max | — | 10 mA | — | — |
| Supply Voltage-Max | — | 6 V | — | — |
| Supply Voltage-Min | — | 4 V | — | — |
| Supply Voltage-Nom | — | 5 V | — | — |
| Surface Mount | — | NO | YES | YES |
| Technology | — | CMOS | — | ZENER |
| Temperature Grade | — | INDUSTRIAL | — | — |
| Terminal Finish | — | Matte Tin (Sn) | Matte Tin (Sn) | MATTE TIN |
| Terminal Form | — | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal Position | — | DUAL | DUAL | DUAL |
| uPs/uCs/Peripheral ICs Type | — | MICROCONTROLLER, RISC | — | — |
| ## PIC16F84-10I/P Alternates Showing results | — | Image | — | — |
| Case Connection | — | — | DRAIN | — |
| Configuration | — | — | SINGLE WITH BUILT-IN DIODE | SINGLE |
| DS Breakdown Voltage-Min | — | — | 60 V | — |
| Drain Current-Max (ID) | — | — | 3.1 A | — |
| Drain-source On Resistance-Max | — | — | 0.12 Ω | — |
| FET Technology | — | — | METAL-OXIDE SEMICONDUCTOR | — |
| Feedback Cap-Max (Crss) | — | — | 17.1 pF | — |
| Number of Elements | — | — | 1 | 1 |
| Operating Mode | — | — | ENHANCEMENT MODE | — |
| Polarity/Channel Type | — | — | N-CHANNEL | — |
| Power Dissipation-Max (Abs) | — | — | 2 W | — |
| Pulsed Drain Current-Max (IDM) | — | — | 15.6 A | — |
| Reference Standard | — | — | MIL-STD-202 | — |
| Time@Peak Reflow Temperature-Max (s) | — | — | 30 | 30 |
| Transistor Application | — | — | SWITCHING | — |
| Transistor Element Material | — | — | SILICON | — |
| Diode Element Material | — | — | — | SILICON |
| Diode Type | — | — | — | ZENER DIODE |
| Dynamic Impedance-Max | — | — | — | 80 Ω |
| Knee Impedance-Max | — | — | — | 500 Ω |
| Polarity | — | — | — | UNIDIRECTIONAL |
| Power Dissipation-Max | — | — | — | 0.37 W |
| Reference Voltage-Nom | — | — | — | 4.7 V |
| Reverse Current-Max | — | — | — | 3 µA |
| Reverse Test Voltage | — | — | — | 2 V |
| Voltage Temp Coeff-Max | — | — | — | 0.2 mV/°C |
| Voltage Tol-Max | — | — | — | 6.38% |
| Working Test Current | — | — | — | 5 mA |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 3 alternatives for B3B-EH-A(LF)(SN) — response within 24 hours.
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Why Look for Alternatives?
Finding alternatives for B3B-EH-A(LF)(SN) is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating B3B-EH-A(LF)(SN) replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to B3B-EH-A(LF)(SN)?
Known equivalents for B3B-EH-A(LF)(SN) include PIC16F84-10I/P, ZXMN6A11GTA, BZT52C4V7-7-F. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of B3B-EH-A(LF)(SN)?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify B3B-EH-A(LF)(SN) alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.