ATSAME51J18A-AU-EFPAlternatives & Equivalent Parts

About ATSAME51J18A-AU-EFP

ATSAME51J18A-AU-EFP is a Integrated Circuit component manufactured by Microchip. It comes in a Quad Flat Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Get one quote covering all 2 alternatives for ATSAME51J18A-AU-EFP — response within 24 hours.

Specification Comparison

ParameterATSAME51J18A-AU-EFPSourceATSAME51J18A-AUATSAME51J19A-AUT
ManufacturerMicrochipMicrochipMicrochip
Package TypeQuad Flat PackagesQuad Flat PackagesQuad Flat Packages
Pin Count646464
Temperature Range-40.0°C ~ 85.0°C-40.0°C ~ 85.0°C-40.0°C ~ 85.0°C
Price$4.6300$4.0300$5.0700
StockIn StockIn StockIn Stock
LifecycleACTIVEACTIVEACTIVE
Electrical Parameters
Manufacturer Package CodeTQFP-64TQFP-64TQFP-64
Factory Lead Time11 Weeks11 Weeks11 Weeks
YTEOL181818
Has ADCYESYESYES
Bit Size323232
Boundary ScanNONONO
CPU FamilyCORTEX-M4FCORTEX-M4FCORTEX-M4F
Clock Frequency-Max48 MHz48 MHz48 MHz
DAC ChannelsYESYESYES
DMA ChannelsYESYESYES
FormatFLOATING POINTFLOATING POINTFLOATING POINT
Integrated CacheYESYESYES
JESD-30 CodeS-PQFP-G64S-PQFP-G64S-PQFP-G64
JESD-609 Codee3e3e3
Low Power ModeYESYESYES
Number of DMA Channels323232
Number of External Interrupts161616
Number of I/O Lines515151
Number of Timers131313
On Chip Data RAM Width888
On Chip Program ROM Width888
PWM ChannelsYESYESYES
Package Body MaterialPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXY
Package ShapeSQUARESQUARESQUARE
Package StyleFLATPACK, THIN PROFILE, FINE PITCHFLATPACK, THIN PROFILE, FINE PITCHFLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)260
RAM (bytes)131072131072196608
RAM (words)131072131072196608
ROM (words)262144262144524288
ROM ProgrammabilityFLASHFLASHFLASH
Screening LevelISO/TS-16949ISO/TS-16949ISO/TS-16949
Speed120 MHz120 MHz120 MHz
Supply Current-Max60 mA60 mA60 mA
Supply Voltage-Max3.63 V3.63 V3.63 V
Supply Voltage-Min1.71 V1.71 V1.71 V
Supply Voltage-Nom3.3 V3.3 V3.3 V
Surface MountYESYESYES
TechnologyCMOSCMOSCMOS
Temperature GradeINDUSTRIALINDUSTRIALINDUSTRIAL
Terminal FinishMatte Tin (Sn)Matte Tin (Sn)Matte Tin (Sn)
Terminal FormGULL WINGGULL WINGGULL WING
Terminal Pitch0.5 mm0.5 mm0.5 mm
Terminal PositionQUADQUADQUAD
Time@Peak Reflow Temperature-Max (s)30
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISCMICROCONTROLLER, RISCMICROCONTROLLER, RISC

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.

Need pricing on these alternatives?

Get one quote covering all 2 alternatives for ATSAME51J18A-AU-EFP — response within 24 hours.

Quick Links

ATSAME51J18A-AUby Microchip Technology Inc

RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4F CPU, 120MHz, CMOS, PQFP64

ATSAME51J19A-AUTby Microchip Technology Inc

CM4,TQFP64, 512kFlash,T&R,USB,CAN

Why Look for Alternatives?

Finding alternatives for ATSAME51J18A-AU-EFP is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.

When evaluating ATSAME51J18A-AU-EFP replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.

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FAQ

What is equivalent to ATSAME51J18A-AU-EFP?

Known equivalents for ATSAME51J18A-AU-EFP include ATSAME51J18A-AU, ATSAME51J19A-AUT. Contact FindMyChip for a full compatibility analysis for your specific application.

Can I use a different manufacturer's part instead of ATSAME51J18A-AU-EFP?

In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.

How do I verify ATSAME51J18A-AU-EFP alternatives?

Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.