ATSAMA5D24A-CUR Microchip Integrated Circuit (BGA) In Stock
Microchip ATSAMA5D24A-CUR is a 32-bit ARM Cortex-A5 microprocessor running at up to 500 MHz with 128 KB SRAM, hardware floating-point, and 256-ball TFBGA package for Linux-capable embedded systems. From $8.50 in stock with worldwide shipping.
- Manufacturer
- Microchip
- Package
- BGA
- Pin Count
- 256
- Lifecycle
- OBSOLETE
- Datasheet
- ATSAMA5D24A-CUR Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- ARM Cortex-A5 core at up to 500 MHz with hardware floating-point unit (FPU) accelerates compute-intensive signal processing and Linux applications
- Integrated 128 KB SRAM and 32-bit external bus controller supporting DDR2/DDR3 SDRAM for scalable memory configurations
- 256-ball TFBGA package with JTAG boundary scan supports high-density PCB designs and in-system debug for industrial Linux platforms
Applications
The ATSAMA5D24A-CUR is designed for Linux-based embedded control and human-machine interface applications in industrial automation, medical devices, and smart energy systems where an ARM Cortex-A5 running at 500 MHz delivers sufficient processing headroom. Its 32-bit external memory bus with DDR support enables large frame buffer and networking stack deployments on compact single-board computers. The device is also used in secure gateway and IoT edge computing modules that require hardware security features alongside the embedded Linux OS.
Specifications
| Pbfree Code | Yes |
| Manufacturer Package Code | TFBGA-256 |
| YTEOL | 0 |
| Address Bus Width | 26 |
| Bit Size | 32 |
| Boundary Scan | YES |
| Clock Frequency-Max | 24MHz |
| External Data Bus Width | 32 |
| Format | FLOATING POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B256 |
| Low Power Mode | YES |
| Number of DMA Channels | 32 |
| Number of External Interrupts | 1 |
| Number of Serial I/Os | 1 |
| On Chip Data RAM Width | 8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA256,18X18,16 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| RAM (words) | 131072 |
| Speed | 500MHz |
| Supply Voltage-Max | 1.32V |
| Supply Voltage-Min | 1.1V |
| Supply Voltage-Nom | 1.2V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 0.4mm |
| Terminal Position | BOTTOM |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.01 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for ATSAMA5D24A-CUR:
Frequently Asked Questions
What is the maximum core clock frequency of ATSAMA5D24A-CUR and which external memory types does it support?
The ATSAMA5D24A-CUR operates its ARM Cortex-A5 core at up to 500 MHz and provides a 32-bit external bus controller that supports DDR2 and DDR3 SDRAM at frequencies up to 166 MHz, as well as NAND Flash, NOR Flash, and SRAM via the Static Memory Controller. This enables system designers to configure memory from 32 MB up to several gigabytes depending on chosen DDR device density.
How does the hardware FPU in ATSAMA5D24A-CUR improve performance for control-loop algorithms compared to software floating-point?
The ARM Cortex-A5's VFPv4 hardware FPU executes single-precision floating-point multiply-accumulate in 1 clock cycle, whereas software floating-point emulation on a comparable Cortex-M MCU takes 30 to 100 cycles per operation. For a PID control loop running at 10 kHz with 5 floating-point operations per iteration, the FPU reduces the loop computation time from roughly 50 µs to under 0.1 µs, freeing over 99% of CPU cycles for Linux OS tasks and communication stacks.
For a compact industrial HMI panel using ATSAMA5D24A-CUR, what does the 256-ball TFBGA package require in terms of PCB layer count and ball pitch?
The 256-ball TFBGA package uses a 1.0 mm ball pitch on a 15 mm x 15 mm body, which typically requires a minimum 6-layer PCB to route the DDR bus, power planes, and peripheral signals without via-in-pad technology. Escape routing from the inner ball rows requires 100 µm trace and space with 0.2 mm microvias in the ground and power planes. Most industrial HMI designs using this package pair it with a 6-layer to 8-layer PCB manufactured to IPC Class 2 standards.
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