ATSAMA5D24A-CUR Microchip Integrated Circuit (BGA) In Stock

Microchip ATSAMA5D24A-CUR is a 32-bit ARM Cortex-A5 microprocessor running at up to 500 MHz with 128 KB SRAM, hardware floating-point, and 256-ball TFBGA package for Linux-capable embedded systems. From $8.50 in stock with worldwide shipping.

OBSOLETEIntegrated CircuitVerified May 2026
Package / Visual Reference
ATSAMA5D24A-CURBGA
Quick Facts
Manufacturer
Microchip
Package
BGA
Pin Count
256
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • ARM Cortex-A5 core at up to 500 MHz with hardware floating-point unit (FPU) accelerates compute-intensive signal processing and Linux applications
  • Integrated 128 KB SRAM and 32-bit external bus controller supporting DDR2/DDR3 SDRAM for scalable memory configurations
  • 256-ball TFBGA package with JTAG boundary scan supports high-density PCB designs and in-system debug for industrial Linux platforms

Applications

The ATSAMA5D24A-CUR is designed for Linux-based embedded control and human-machine interface applications in industrial automation, medical devices, and smart energy systems where an ARM Cortex-A5 running at 500 MHz delivers sufficient processing headroom. Its 32-bit external memory bus with DDR support enables large frame buffer and networking stack deployments on compact single-board computers. The device is also used in secure gateway and IoT edge computing modules that require hardware security features alongside the embedded Linux OS.

Specifications

Pbfree CodeYes
Manufacturer Package CodeTFBGA-256
YTEOL0
Address Bus Width26
Bit Size32
Boundary ScanYES
Clock Frequency-Max24MHz
External Data Bus Width32
FormatFLOATING POINT
Integrated CacheYES
JESD-30 CodeS-PBGA-B256
Low Power ModeYES
Number of DMA Channels32
Number of External Interrupts1
Number of Serial I/Os1
On Chip Data RAM Width8
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeBGA256,18X18,16
Package ShapeSQUARE
Package StyleGRID ARRAY, THIN PROFILE, FINE PITCH
RAM (words)131072
Speed500MHz
Supply Voltage-Max1.32V
Supply Voltage-Min1.1V
Supply Voltage-Nom1.2V
Surface MountYES
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FormBALL
Terminal Pitch0.4mm
Terminal PositionBOTTOM
uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCN5A992.C
HTS Code8542.31.00.01

Datasheet

ATSAMA5D24A-CUR Datasheet Download

Official datasheet from Microchip

Alternate & Equivalent Parts

Compatible alternatives and drop-in replacements for ATSAMA5D24A-CUR:

ATSAMA5D24C-CURMicrochip Technology Inc

RISC Microprocessor

View Part →
ATSAMA5D24A-CUMicrochip Technology Inc

BGA GREEN, IND TEMP,MRLA

View Part →

Frequently Asked Questions

What is the maximum core clock frequency of ATSAMA5D24A-CUR and which external memory types does it support?

The ATSAMA5D24A-CUR operates its ARM Cortex-A5 core at up to 500 MHz and provides a 32-bit external bus controller that supports DDR2 and DDR3 SDRAM at frequencies up to 166 MHz, as well as NAND Flash, NOR Flash, and SRAM via the Static Memory Controller. This enables system designers to configure memory from 32 MB up to several gigabytes depending on chosen DDR device density.

How does the hardware FPU in ATSAMA5D24A-CUR improve performance for control-loop algorithms compared to software floating-point?

The ARM Cortex-A5's VFPv4 hardware FPU executes single-precision floating-point multiply-accumulate in 1 clock cycle, whereas software floating-point emulation on a comparable Cortex-M MCU takes 30 to 100 cycles per operation. For a PID control loop running at 10 kHz with 5 floating-point operations per iteration, the FPU reduces the loop computation time from roughly 50 µs to under 0.1 µs, freeing over 99% of CPU cycles for Linux OS tasks and communication stacks.

For a compact industrial HMI panel using ATSAMA5D24A-CUR, what does the 256-ball TFBGA package require in terms of PCB layer count and ball pitch?

The 256-ball TFBGA package uses a 1.0 mm ball pitch on a 15 mm x 15 mm body, which typically requires a minimum 6-layer PCB to route the DDR bus, power planes, and peripheral signals without via-in-pad technology. Escape routing from the inner ball rows requires 100 µm trace and space with 0.2 mm microvias in the ground and power planes. Most industrial HMI designs using this package pair it with a 6-layer to 8-layer PCB manufactured to IPC Class 2 standards.

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AvailabilityIn Stock
Reference Price (USD)
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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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Thomas Mueller
Hardware Lead, SensorTech GmbH, Germany