ATECC608A-TNGLORAU-B Microchip Integrated Circuit (Small Outline No-lead) In Stock
ATECC608A-TNGLORAU-B is a Microchip Trust&GO pre-provisioned secure element designed for LoRaWAN networks, delivered in a 2 mm × 3 mm UDFN-8 package. It provides hardware-based key storage and cryptographic acceleration using 2 V to 5.5 V supply. Available in 10-piece bulk packs with worldwide shipping.
- Manufacturer
- Microchip
- Package
- Small Outline No-lead
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- ATECC608A-TNGLORAU-B Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Factory-provisioned with LoRaWAN join credentials, eliminating in-field key injection and reducing provisioning time to zero
- Hardware-isolated key storage with 16 general-purpose ECC P-256 or SHA-256 key slots that never expose private keys outside the device
- Ultra-compact 2 mm × 3 mm UDFN-8 footprint and I2C interface enable integration even in very small LoRa end-node PCBs
Applications
The ATECC608A-TNGLORAU-B is purpose-built for LoRaWAN IoT end nodes such as smart utility meters, environmental sensors, and asset trackers that require secure OTAA join without custom provisioning infrastructure. Its hardware cryptographic engine offloads ECDSA and AES-128 operations from the host MCU, reducing firmware complexity and protecting session keys throughout the device lifetime. Designers targeting IEC 62443 or similar security certifications benefit from the tamper-resistant key storage combined with factory LoRaWAN credential provisioning.
Specifications
| Manufacturer Package Code | UDFN-8 |
| YTEOL | 0 |
| JESD-30 Code | R-PDSO-N8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOLCC8,.12,20 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Supply Voltage-Max | 5.5V |
| Supply Voltage-Min | 2V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | DUAL |
| uPs/uCs/Peripheral ICs Type | CRYPTOGRAPHIC AUTHENTICATOR |
| Package | Small Outline No-lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.31.00.30 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the ATECC608A-TNGLORAU-B simplify LoRaWAN OTAA provisioning compared to software key management?
The ATECC608A-TNGLORAU-B ships with factory-provisioned LoRaWAN OTAA credentials stored in hardware, so no custom key-injection step is required on the production line. The device holds the AppKey in a hardware-protected slot that never exposes the key outside the chip, supporting AES-128 session key derivation directly on-chip. This eliminates key-management server infrastructure and reduces provisioning time to near zero for high-volume LoRaWAN deployments.
What supply voltage range does the ATECC608A-TNGLORAU-B support, and does it fit energy-harvesting powered nodes?
The ATECC608A-TNGLORAU-B operates from 2 V to 5.5 V, making it compatible with coin-cell, supercapacitor, and energy-harvesting power rails common in maintenance-free IoT nodes. The deep-sleep current is typically 150 nA, which is low enough to sustain multi-year battery life in intermittent-transmission LoRaWAN sensors that wake, authenticate, and transmit every few minutes.
For a board with very tight space constraints, how large is the UDFN-8 footprint and what I2C address flexibility does the device offer?
The UDFN-8 package measures 2 mm × 3 mm with 0.5 mm pitch, occupying less than 6 mm² of PCB area — far smaller than a standard SOIC-8 at roughly 30 mm². The ATECC608A-TNGLORAU-B communicates over a single-wire I2C-compatible bus at up to 1 MHz, and address selection allows up to 8 devices on one bus, useful when pairing multiple secure elements in a multi-channel sensor design.
Related Guides
1206 100 uF MLCC Design Guide for Compact Bulk Decoupling
Design guidance for applying CL31A107MQHNNNE and related 1206 MLCCs in compact bulk decoupling networks.
Jul 3, 2026
0402 10 nF MLCC Design Guide for High-Speed Decoupling
Practical design guidance for using CL05B103KB5NNNC and related 0402 MLCCs in high-speed decoupling networks.
Jul 3, 2026
CL31A107MQHNNNE 1206 100 uF MLCC Selection Guide
How to choose CL31A107MQHNNNE and related 1206 MLCCs for low-voltage bulk capacitance and regulator stability.
Jul 2, 2026
CL05B103KB5NNNC 0402 10 nF X7R MLCC Selection Guide
How to choose CL05B103KB5NNNC and related 0402 MLCCs for bypassing, filtering, voltage derating, and sourcing.
Jul 2, 2026
Why Buy from FindMyChip
About Microchip
Microchip is a leading electronic component manufacturer. FindMyChip sources Microchip ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“FindMyChip sourced our entire STM32 BOM in 48 hours when our usual distributor had 16-week lead times.”