AM5706BCBDDS Texas Instruments Integrated Circuit (BGA) In Stock
The AM5706BCBDDS is a Texas Instruments Sitara AM570x high-performance application processor featuring ARM Cortex-A15 cores with integrated DSP and accelerators for industrial applications. It operates at 1.11V to 1.2V core supply in a compact 538-ball FCBGA package. Available from authorized distributors with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 538
- Lifecycle
- OBSOLETE
- Datasheet
- AM5706BCBDDS Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 90.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- High-performance ARM Cortex-A15 based Sitara processor with integrated C66x DSP core delivering computing power for real-time industrial control and analytics
- Comprehensive connectivity including PCIe, USB 3.0, Gigabit Ethernet, and multiple industrial interfaces in a single-chip solution for industrial IoT gateways
- 538-ball fine-pitch FCBGA package with 1.11V–1.2V core voltage for power-efficient operation in space-constrained industrial embedded designs
Applications
The AM5706BCBDDS is designed for industrial automation systems including programmable logic controllers, motor drives, and robotic controllers that demand high-performance computing with deterministic real-time response. Its integrated DSP and PRU subsystem enable industrial protocol processing for EtherCAT, PROFIBUS, and other fieldbus standards in factory automation networks. It is also deployed in industrial HMI panels, machine vision systems, and embedded edge computing gateways requiring Linux or RTOS operating environments.
Specifications
| YTEOL | 0 |
| JESD-30 Code | S-PBGA-B538 |
| JESD-609 Code | e1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA538,25X25,25 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Max | 1.2V |
| Supply Voltage-Min | 1.11V |
| Supply Voltage-Nom | 1.15V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| HTS Code | 8542.31.00.30 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What processor cores are integrated in the AM5706BCBDDS?
The AM5706BCBDDS integrates ARM Cortex-A15 application processor cores along with a C66x floating-point DSP core, providing a combination of general-purpose computing and signal processing capabilities for complex industrial workloads.
What industrial communication interfaces does the AM5706BCBDDS support?
The AM5706BCBDDS supports PCIe, USB 3.0, Gigabit Ethernet, CAN, McSPI, and industrial Ethernet protocols through its integrated PRU-ICSS subsystem, enabling implementation of EtherCAT, PROFIBUS, and other fieldbus standards without external FPGAs.
What is the operating voltage of the AM5706BCBDDS?
The AM5706BCBDDS core supply voltage ranges from 1.11V to 1.2V, with additional I/O supply domains at higher voltages. This low core voltage contributes to energy-efficient operation in industrial applications with strict power budgets.
What package does the AM5706BCBDDS use?
The AM5706BCBDDS is packaged in a 538-ball Fine-Pitch BGA (FCBGA) package in a 25 x 25mm body, which provides high pin density for the extensive peripheral set while maintaining a manageable PCB footprint for industrial board designs.
What operating systems does the AM5706BCBDDS support?
The AM5706BCBDDS is supported by Texas Instruments Processor SDK for Linux and RTOS, providing ready-to-use board support packages, industrial communication libraries, and middleware stacks to accelerate product development timelines.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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