AM3359ZCZD60 Texas Instruments Integrated Circuit (BGA) In Stock
The AM3359ZCZD60 is a 32-bit ARM Cortex-A8 microprocessor from Texas Instruments running up to 600 MHz with integrated cache and low-power modes. It features a 16-bit external data bus, boundary scan, and is packaged in a 324-ball BGA for high-density embedded Linux platforms. Widely stocked globally for HMI, industrial automation, and IoT gateway designs.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 324
- Lifecycle
- OBSOLETE
- Datasheet
- AM3359ZCZD60 Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of AM3359ZCZD60?
- 32-bit ARM Cortex-A8 core up to 600 MHz with integrated L1 and L2 cache for high-performance embedded Linux execution
- Low-power mode support enabling standby and deep-sleep states to extend battery life in portable industrial devices
- Boundary scan (JTAG) for in-system testing and board-level fault diagnostics in production environments
- 16-bit external data bus and 16-bit address bus for interfacing with external DRAM and NOR flash memory
- 324-ball BGA package enabling compact high-density PCB designs for HMI panels and gateway modules
What is AM3359ZCZD60 used for?
The AM3359ZCZD60 is the processor at the heart of BeagleBone-class embedded Linux platforms targeting industrial HMI panels, smart meters, and building automation controllers. Its 600 MHz Cortex-A8 core runs full Linux or RTOS environments with GUI stacks, making it suitable for touchscreen operator interfaces and IoT gateways that aggregate sensor data from multiple fieldbus networks. The device also serves industrial robotics, medical monitoring instruments, and communications equipment where real-time processing and connectivity coexist in a compact module.
What are the specifications of AM3359ZCZD60?
| YTEOL | 0 |
| Address Bus Width | 16 |
| Bit Size | 32 |
| Boundary Scan | YES |
| Clock Frequency-Max | 26MHz |
| External Data Bus Width | 16 |
| Format | FIXED POINT |
| Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B324 |
| Low Power Mode | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA324,18X18,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Qualification Status | Not Qualified |
| Speed | 600MHz |
| Supply Voltage-Max | 1.15V |
| Supply Voltage-Min | 1.06V |
| Supply Voltage-Nom | 1.1V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 3A991.a.2 |
| HTS Code | 8542.31.00.25 |
Where can I find the AM3359ZCZD60 datasheet?
AM3359ZCZD60 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for AM3359ZCZD60?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the maximum CPU frequency of the AM3359ZCZD60 and what operating system environments does it support?
The AM3359ZCZD60 ARM Cortex-A8 core runs at up to 600 MHz, providing enough throughput to run full Linux kernel distributions, Android, and RTOS frameworks such as FreeRTOS or TI-RTOS. At 600 MHz with integrated L1/L2 cache, the processor handles GUI rendering, network stacks, and real-time control tasks simultaneously.
How does the AM3359ZCZD60 compare to AM3358 for designs requiring extended temperature operation?
The AM3359ZCZD60 variant is specified for the commercial temperature range, whereas AM3358-series parts with the ZCZ suffix and wider temperature qualifications cover industrial -40°C to +85°C operation. Designers targeting industrial automation and outdoor equipment should verify the exact temperature code suffix before selecting between AM3358 and AM3359 to ensure the 600 MHz rating is maintained across the full operating range.
Which memory interfaces does the AM3359ZCZD60 support for connecting external DRAM and storage?
The AM3359ZCZD60 includes a 16-bit external data bus that interfaces with DDR2 and DDR3 SDRAM, plus GPMC for parallel NOR flash and NAND connections. In typical BeagleBone-style designs, 512 MB of DDR3 running at 400 MHz pairs with the 600 MHz core to provide the memory bandwidth needed for Linux and multimedia workloads.
What industrial connectivity peripherals are integrated in the AM3359ZCZD60 for factory automation designs?
The AM3359ZCZD60 integrates dual PRU-ICSS programmable real-time units capable of running EtherCAT, PROFIBUS, and other industrial Ethernet protocols at deterministic latencies below 1 µs. It also includes 2 CAN interfaces, multiple UART and SPI ports, USB 2.0, and gigabit Ethernet MAC, covering the full connectivity suite needed for PLC, motor-drive, and gateway designs.
What package does the AM3359ZCZD60 use and what board-level considerations does it require?
The AM3359ZCZD60 is packaged in a 324-ball BGA with a 0.8 mm pitch, requiring at least a 4-layer PCB with controlled-impedance traces for DDR3 routing at 400 MHz. The BGA footprint measures approximately 15 mm x 15 mm, and TI provides full PCB design guidelines including decoupling capacitor placement to manage the processor's power domains at 1.1 V core and 3.3 V I/O.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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