AM3354BZCZ100 Texas Instruments Integrated Circuit (BGA) In Stock
AM3354BZCZ100 is a Sitara ARM Cortex-A8 processor by Texas Instruments with integrated 3D graphics and CAN interface running at up to 1 GHz. Key specs: 324-pin BGA, 0.912 V core voltage, integrated graphics accelerator. From stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 324
- Lifecycle
- ACTIVE
- Datasheet
- AM3354BZCZ100 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 90.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of AM3354BZCZ100?
- ARM Cortex-A8 core running at up to 1 GHz for high-performance embedded Linux and RTOS applications
- Integrated 3D graphics accelerator supporting OpenGL ES 2.0 for HMI display-driven industrial systems
- CAN bus interface and extensive peripheral set in a 324-pin BGA for connectivity-rich embedded designs
What is AM3354BZCZ100 used for?
AM3354BZCZ100 is ideal for industrial HMI panels, programmable logic controllers, and factory automation gateways requiring Linux-capable processing with real-time CAN bus communication. Its integrated 3D graphics engine enables rich GUI displays for medical devices and building automation controllers without external GPU ICs. The 1 GHz Cortex-A8 core and comprehensive peripheral set support multi-protocol industrial networking in energy metering, robotics, and smart grid equipment.
What are the specifications of AM3354BZCZ100?
| YTEOL | 15 |
| Additional Feature | ALSO OPERATES AT MIN 0.912 V |
| JESD-30 Code | S-PBGA-B324 |
| JESD-609 Code | e1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA324,18X18,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max | 1.144V |
| Supply Voltage-Min | 1.056V |
| Supply Voltage-Nom | 1.1V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.50 |
| Country of Origin | Philippines |
Where can I find the AM3354BZCZ100 datasheet?
AM3354BZCZ100 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for AM3354BZCZ100?
Compatible alternatives and drop-in replacements for AM3354BZCZ100:
Frequently Asked Questions
At what clock frequency does AM3354BZCZ100 operate and what operating system environments does it support?
AM3354BZCZ100 runs the ARM Cortex-A8 core at up to 1 GHz and supports Linux, Android, and real-time operating systems such as TI-RTOS. At 1 GHz with 512 MB DDR3 RAM, the processor comfortably runs embedded Linux with GUI applications, making it suitable for industrial HMI panels and smart metering devices requiring multi-tasking capability.
What graphics capability does AM3354BZCZ100 include and how does it benefit HMI designs?
AM3354BZCZ100 integrates a 3D graphics accelerator supporting OpenGL ES 2.0, enabling hardware-accelerated rendering of complex GUIs at resolutions up to 1280x720 pixels. This eliminates the need for a discrete GPU in industrial HMI panels, reducing BOM cost by eliminating 1 to 2 external ICs while achieving smooth 30-frame-per-second animation on 7-inch to 10-inch touch displays.
How many CAN bus interfaces does AM3354BZCZ100 provide and which industrial protocols does it support?
AM3354BZCZ100 includes 2 CAN 2.0B-compatible interfaces operating at standard baud rates up to 1 Mbit/s, enabling direct connection to CANopen and DeviceNet industrial networks without external CAN controllers. The integrated CAN peripherals reduce component count and simplify PCB routing for motor drive panels and factory automation nodes communicating across 30-meter to 100-meter cable runs.
What package does AM3354BZCZ100 use and what PCB layer count does it typically require?
AM3354BZCZ100 is packaged in a 324-pin PBGA with 0.8 mm ball pitch in an 18 mm x 18 mm body, requiring at least 6 PCB layers for adequate signal integrity and power distribution routing. The fine-pitch BGA demands controlled-impedance traces for DDR3 memory interfaces running at 400 MHz, and a proper ground plane stack-up to meet EMC requirements in industrial operating environments.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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